Package Dimensions
Figure 4: 170-Ball FBGA (BG)
A
0.2 S
1.1 ±0.1
0.35 ±0.05
S
12.0 ±0.1
Ball A1 ID
Ball A1 ID
14.0 ± 0.1
170- 0.45 ±0.05
B
0.15
M
S
12.8
A B
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
2.0
10.4
0.8
0.8
0.2 S B
0.2 S A
0.12 S
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
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www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
2Gb: x16, x32 GDDR5 SGRAM
Package Dimensions
PDF: 09005aef858b7e99
2gb_gddr5_sgram_brief.pdf - Rev. A 2/14 EN
7
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© 2014 Micron Technology, Inc. All rights reserved.
