MT9VDVF6472Y-335F1

PDF: 09005aef81c737fb/Source: 09005aef81c7379d Micron Technology, Inc., reserves the right to change products or specifications without notice.
DVF9C64x72.fm - Rev. B 10/07 EN
7 ©2005 Micron Technology, Inc. All rights reserved.
512MB (x72, ECC, SR) 184-Pin DDR VLP RDIMM
Electrical Specifications
Electrical Specifications
Stresses greater than those listed in Table 6 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions outside those indicated on the device data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may adversely
affect reliability.
Notes: 1. For further information, refer to technical note TN-00-08: “Thermal Applications,” available
on Micron’s Web site.
Input Capacitance
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Component AC Timing and Operating Conditions
Recommended AC operating conditions are given in the DDR component data sheets.
Component specifications are available on Microns Web site. Module speed grades
correlate with component speed grades, as shown in Table 7.
Table 6: Absolute Maximum Ratings
Symbol Parameter Min Max Units
V
DD/VDDQ
VDD/VDDQ supply voltage relative to VSS
–1.0 +3.6 V
V
IN, VOUT
Voltage on any pin relative to VSS
–0.5 +3.2 V
I
I
Input leakage current; Any input 0V VIN VDD;
V
REF input 0V VIN 1.35V (All other pins not under
test = 0V)
Address inputs,
RAS#, CAS#, WE#, BA,
S#, CKE
–5 +5 µA
CK, CK0
–10 +10
DM
–2 +2
IOZ
Output leakage current; 0V VOUT VDDQ; DQ are
disabled
DQ, DQS
–5 +5 µA
T
A
DRAM ambient operating temperature
1
Commercial
0+70°C
Industrial
–40 +85 °C
Table 7: Module and Component Speed Grades
Module Speed Grade Component Speed Grade
-40B -5B
-335 -6
PDF: 09005aef81c737fb/Source: 09005aef81c7379d Micron Technology, Inc., reserves the right to change products or specifications without notice.
DVF9C64x72.fm - Rev. B 10/07 EN
8 ©2005 Micron Technology, Inc. All rights reserved.
512MB (x72, ECC, SR) 184-Pin DDR VLP RDIMM
Electrical Specifications
IDD Specifications
Table 8: I
DD Specifications and Conditions – 512MB
Values are shown for the MT46V64M8 DDR SDRAM only and are computed from values specified in the
512Mb (64 Meg x 8) component data sheet
Parameter/Condition Symbol -40B -335 Units
Operating one bank active-precharge current:
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN);
DQ, DM, and DQS inputs changing once per clock cycle; Address and control inputs
changing once every two clock cycles
IDD0 1,395 1,170 mA
Operating one bank active-read-precharge current: BL = 2;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); IOUT = 0mA; Address and control inputs changing once per clock cycle
IDD1 1,665 1,440 mA
Precharge power-down standby current: All device banks idle; Power-down
mode;
t
CK =
t
CK (MIN); CKE = LOW
IDD2P 45 45 mA
Idle standby current: CS# = HIGH; All device banks idle;
t
CK =
t
CK (MIN);
CKE = HIGH; Address and other control inputs
changing once per clock cycle;
V
IN
=V
REF
for DQ, DM, and DQS
IDD2F 495 405 mA
Active power-down standby current: One device bank active; Power-down mode;
t
CK =
t
CK (MIN); CKE = LOW
IDD3P 405 315 mA
Active standby current: CS# = HIGH; CKE = HIGH; One device bank active;
t
RC =
t
RAS (MAX);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing twice per clock
cycle; Address and other control inputs changing once per clock cycle
IDD3N 540 450 mA
Operating burst read current: BL = 2; Continuous burst reads; One device bank
active; Address and control inputs changing once per clock cycle;
t
CK =
t
CK (MIN);
I
OUT =0mA
IDD4R 1,710 1,485 mA
Operating burst write current: BL = 2; Continuous burst writes; One device bank
active; Address and control inputs changing once per clock cycle;
t
CK =
t
CK (MIN); DQ,
DM, and DQS inputs changing twice per clock cycle
IDD4W 1,755 1,575 mA
Auto refresh current
t
REFC =
t
RFC (MIN)
IDD5 3,105 2,610 mA
t
REFC = 7.8125µs
IDD5A 99 90 mA
Self refresh current: CKE 0.2V
IDD645 45 mA
Operating bank interleave read current: Four device bank interleaving reads;
BL = 4 with auto precharge;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); Address and control
inputs change only during active READ or WRITE commands
IDD7 4,050 3,645 mA
PDF: 09005aef81c737fb/Source: 09005aef81c7379d Micron Technology, Inc., reserves the right to change products or specifications without notice.
DVF9C64x72.fm - Rev. B 10/07 EN
9 ©2005 Micron Technology, Inc. All rights reserved.
512MB (x72, ECC, SR) 184-Pin DDR VLP RDIMM
Register and PLL Specifications
Register and PLL Specifications
Notes: 1. Timing and switching specifications for the register listed above are critical for proper oper-
ation of the DDR SDRAM RDIMMs. These are meant to be a subset of the parameters for
the specific device used on the module. Detailed information for this register is available in
JEDEC standard JESD82.
Table 9: Register Specifications
SSTV16859 devices or equivalent JESD82-4B
Parameter Symbol Pins Condition Min Max Units
DC high-level
input voltage
V
IH(DC) Address, control,
command
SSTL_25 VREF(DC) + 150 mV
DC low-level
input voltage
V
IL(DC) Address, control,
command
SSTL_25 VREF(DC) - 150 mV
AC high-level
input voltage
V
IH(AC) Address, control,
command
SSTL_25 VREF(DC) + 310 VDD mV
AC low-level
input voltage
V
IL(AC) Address, control,
command
SSTL_25 VREF(DC) - 310 mV
Output high voltage
V
OH Parity output LVCMOS VDD - 0.2 V
Output low voltage
V
OL Parity output LVCMOS 0.2 V
Input current
I
I All pins VI = VDDQ or VSSQ–5.0 +5.0µA
Static standby
I
DD All pins RESET# = VSSQ (IO = 0) 100 µA
Static operating
I
DD All pins RESET# = VSSQ;
VI = VIH(AC) or VIL(DC)
IO = 0
–Varies by
manufacturer
mA
Dynamic operating
(clock tree)
I
DDD n/a RESET# = VDD, VI = VIH(AC)
or VIL(AC), IO = 0; CK and
CK# switching 50 percent
duty cycle
–Varies by
manufacturer
µA
Dynamic operating
(per each input)
I
DDD n/a RESET# = VDD, VI = VIH(AC)
or VIL(AC), IO = 0; CK and
CK# switching 50 percent
duty cycle; One data input
switching at
t
CK/2, 50
percent duty cycle
–Varies by
manufacturer
µA
Input capacitance
(per device, per pin)
C
I All inputs except
RESET#
VI = VREF ±250mV;
VDDQ = 1.8V
2.5 3.5 pF
Input capacitance
(per device, per pin)
C
I RESET# VI = VDDQ or VSSQ–Varies by
manufacturer
pF

MT9VDVF6472Y-335F1

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR SDRAM 512MB 184RDIMM
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New from this manufacturer.
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