BLF278
VHF push-pull power MOS transistor
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2003 Sep 19 2
Philips Semiconductors Product Specification
VHF push-pull power MOS transistor BLF278
FEATURES
High power gain
Easy power control
Good thermal stability
Gold metallization ensures excellent reliability.
APPLICATIONS
Broadcast transmitters in the VHF frequency range.
DESCRIPTION
Dual push-pull silicon N-channel enhancement mode
vertical D-MOS transistor encapsulated in a 4-lead,
SOT262A1 balanced flange package with two ceramic
caps. The mounting flange provides the common source
connection for the transistors.
PINNING - SOT262A1
CAUTION
This product is supplied in anti-static packing to prevent
damage caused by electrostatic discharge during
transport and handling. For further information, refer to
Philips specs.: SNW-EQ-608, SNW-FQ-302A, and
SNW-FQ-302B.
PIN DESCRIPTION
1 drain 1
2 drain 2
3 gate 1
4 gate 2
5 source
Fig.1 Simplified outline and symbol.
12
34
MAM098
Top view
55
d
g
s
d
g
QUICK REFERENCE DATA
RF performance at T
h
=25°C in a push-pull common source test circuit.
MODE OF OPERATION
f
(MHz)
V
DS
(V)
P
L
(W)
G
p
(dB)
η
D
(%)
CW, class-B 108 50 300 >20 >60
CW, class-C 108 50 300 typ. 18 typ. 80
CW, class-AB 225 50 250 >14
typ. 16
>50
typ. 55
WARNING
Product and environmental safety - toxic materials
This product contains beryllium oxide. The product is entirely safe provided that the BeO discs are not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety
precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of
the user. It must never be thrown out with the general or domestic waste.
2003 Sep 19 3
Philips Semiconductors Product Specification
VHF push-pull power MOS transistor BLF278
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per transistor section
V
DS
drain-source voltage 125 V
V
GS
gate-source voltage −±20 V
I
D
drain current (DC) 18 A
P
tot
total power dissipation T
mb
25 °C; total device; both
sections equally loaded
500 W
T
stg
storage temperature 65 150 °C
T
j
junction temperature 200 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-mb
thermal resistance from junction
to mounting base
total device; both sections
equally loaded.
max. 0.35 K/W
R
th mb-h
thermal resistance from
mounting base to heatsink
total device; both sections
equally loaded.
max. 0.15 K/W
Fig.2 DC SOAR.
Total device; both sections equally loaded.
(1) Current is this area may be limited by R
DSon
.
(2) T
mb
=25°C.
handbook, halfpage
1
10
100
1 10 100
(1)
500
I
D
(A)
V (V)
DS
MRA988
(2)
Fig.3 Power derating curves.
Total device; both sections equally loaded.
(1) Continuous operation.
(2) Short-time operation during mismatch.
handbook, halfpage
0 40 80 160
500
0
400
MGE616
120
300
200
100
P
tot
(W)
T
h
(°C)
(2)
(1)

BLF278/01,112

Mfr. #:
Manufacturer:
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Lifecycle:
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