FM28V020
Document Number: 001-86204 Rev. *F Page 4 of 21
Pin Definitions
Pin Name I/O Type Description
A
14
–A
0
Input Address inputs: The 15 address lines select one of 32,768 bytes in the F-RAM array. The lowest two
address lines A
2
–A
0
may be used for page mode read and write operations.
DQ
7
–DQ
0
Input/Output Data I/O Lines: 8-bit bidirectional data bus for accessing the F-RAM array.
WE
Input Write Enable: A write cycle begins when WE is asserted. The rising edge causes the FM28V020 to write
the data on the DQ bus to the F-RAM array. The falling edge of WE
latches a new column address for
page mode write cycles.
CE
Input Chip Enable: The device is selected and a new memory access begins on the falling edge of CE. The
entire address is latched internally at this point. Subsequent changes to the A
2
–A
0
address inputs allow
page mode operation.
OE
Input Output Enable: When OE is LOW, the FM28V020 drives the data bus when the valid read data is
available. Deasserting OE
HIGH tristates the DQ pins.
V
SS
Ground Ground for the device. Must be connected to the ground of the system.
V
DD
Power supply Power supply input to the device.
NC No connect No connect. This pin is not connected to the die.
FM28V020
Document Number: 001-86204 Rev. *F Page 5 of 21
Device Operation
The FM28V020 is a bytewide F-RAM memory logically
organized as 32,768 × 8 and accessed using an
industry-standard parallel interface. All data written to the part is
immediately nonvolatile with no delay. The device offers page
mode operation, which provides high-speed access to
addresses within a page (row). Access to a different page
requires that either CE
transitions LOW or the upper address
(A
14
–A
3
) changes. See the Functional Truth Table on page 14
for a complete description of read and write modes.
Memory Operation
Users access 32,768 memory locations, each with 8 data bits
through a parallel interface. The F-RAM array is organized as
eight blocks, each having 512 rows. Each row has eight column
locations, which allow fast access in page mode operation.
When an initial address is latched by the falling edge of CE
,
subsequent column locations may be accessed without the need
to toggle CE
. When CE is deasserted HIGH, a pre-charge
operation begins. Writes occur immediately at the end of the
access with no delay. The WE
pin must be toggled for each write
operation. The write data is stored in the nonvolatile memory
array immediately, which is a feature unique to F-RAM called
NoDelay writes.
Read Operation
A read operation begins on the falling edge of CE. The falling
edge of CE
causes the address to be latched and starts a
memory read cycle if WE
is HIGH. Data becomes available on
the bus after the access time is met. When the address is latched
and the access completed, a new access to a random location
(different row) may begin while CE
is still LOW. The minimum
cycle time for random addresses is t
RC
. Note that unlike SRAMs,
the FM28V020's CE
-initiated access time is faster than the
address access time.
The FM28V020 will drive the data bus when OE
is asserted LOW
and the memory access time is met. If OE
is asserted after the
memory access time is met, the data bus will be driven with valid
data. If OE
is asserted before completing the memory access,
the data bus will not be driven until valid data is available. This
feature minimizes supply current in the system by eliminating
transients caused by invalid data being driven to the bus. When
OE
is deasserted HIGH, the data bus will remain in a HI-Z state.
Write Operation
In the FM28V020, writes occur in the same interval as reads. The
FM28V020 supports both CE
and WE controlled write cycles. In
both cases, the address is latched on the falling edge of CE
.
In a CE
-controlled write, the WE signal is asserted before
beginning the memory cycle. That is, WE
is LOW when the
device is activated with the chip enable. In this case, the device
begins the memory cycle as a write. The FM28V020 will not drive
the data bus regardless of the state of OE
as long as WE is LOW.
Input data must be valid when CE
is deasserted HIGH. In a
WE
-controlled write, the memory cycle begins on the falling edge
of CE
. The WE signal falls some time later. Therefore, the
memory cycle begins as a read. The data bus will be driven if OE
is LOW; however, it will be HI-Z when WE is asserted LOW. The
CE
and WE controlled write timing cases are shown on the
page 12. In the Figure 10 on page 12 diagram, the data bus is
shown as a hi-Z condition while the chip is write-enabled and
before the required setup time. Although this is drawn to look like
a mid-level voltage, it is recommended that all DQ pins comply
with the minimum V
IH
/V
IL
operating levels.
Write access to the array begins on the falling edge of WE
after
the memory cycle is initiated. The write access terminates on the
rising edge of WE
or CE, whichever comes first. A valid write
operation requires the user to meet the access time specification
before deasserting WE
or CE. The data setup time indicates the
interval during which data cannot change before the end of the
write access (rising edge of WE
or CE).
Unlike other nonvolatile memory technologies, there is no write
delay with F-RAM. Because the read and write access times of
the underlying memory are the same, the user experiences no
delay through the bus. The entire memory operation occurs in a
single bus cycle. Data polling, a technique used with EEPROMs
to determine if a write is complete, is unnecessary.
Page Mode Operation
The FM28V020 provides the user fast access to any data within
a row element. Each row has eight column-address locations.
Address inputs A
2
–A
0
define the column address to be
accessed. An access can start anywhere within a row and other
column locations may be accessed without the need to toggle
the CE
pin. For fast access reads, after the first data byte is
driven to the bus, the column address inputs A
2
–A
0
may be
changed to a new value. A new data byte is then driven to the
DQ pins. For fast access writes, the first write pulse defines the
first write access. While CE
is LOW, a subsequent write pulse
along with a new column address provides a page mode write
access.
Pre-charge Operation
The pre-charge operation is an internal condition in which the
memory state is prepared for a new access. Pre-charge is
user-initiated by driving the CE
signal HIGH. It must remain
HIGH for at least the minimum pre-charge time, t
PC
.
Pre-charge is also activated by changing the upper addresses,
A
14
–A
3
. The current row is first closed before accessing the new
row. The device automatically detects an upper order address
change, which starts a pre-charge operation. The new address
is latched and the new read data is valid within the t
AA
address
access time; see Figure 6 on page 11. A similar sequence occurs
for write cycles; see Figure 11 on page 12. The rate at which
random addresses can be issued is t
RC
and t
WC
, respectively.
FM28V020
Document Number: 001-86204 Rev. *F Page 6 of 21
SRAM Drop-In Replacement
The FM28V020 is designed to be a drop-in replacement for
standard asynchronous SRAMs. The device does not require CE
to toggle for each new address. CE may remain LOW indefinitely
while V
DD
is applied. While CE is LOW, the device automatically
detects address changes and a new access begins. It also allows
page mode operation at speeds up to 15 MHz.
A typical application is shown in Figure 4. It shows a pull-up
resistor on CE
, which will keep the pin HIGH during power
cycles, assuming the MCU / MPU pin tristates during the reset
condition.The pull-up resistor value should be chosen to ensure
the CE
pin tracks V
DD
to a high enough value, so that the current
drawn when CE
is LOW is not an issue. A 10-k resistor draws
330 µA when CE
is LOW and V
DD
= 3.3 V.
Note that if CE
is tied to ground, the user must be sure WE is not
LOW at power-up or power-down events. If CE
and WE are both
LOW during power cycles, data will be corrupted. Figure 5 shows
a pull-up resistor on WE
, which will keep the pin HIGH during
power cycles, assuming the MCU/MPU pin tristates during the
reset condition.The pull-up resistor value should be chosen to
ensure the WE
pin tracks V
DD
to a high enough value, so that
the current drawn when WE
is LOW is not an issue. A 10-k
resistor draws 330 µA when WE is LOW and V
DD
= 3.3 V.
For applications that require the lowest power consumption, the
CE
signal should be active only during memory accesses. Due
to the external pull-up resistor, some supply current will be drawn
while CE
is LOW. When CE is HIGH, the device draws no more
than the maximum standby current I
SB
.
CE
toggling LOW on every address access is perfectly
acceptable in FM28V020.
Endurance
The FM28V020 is capable of being accessed at least 10
14
times
– reads or writes. An F-RAM memory operates with a read and
restore mechanism. Therefore, an endurance cycle is applied on
a row basis. The F-RAM architecture is based on an array of
rows and columns. Rows are defined by A
14-3
and column
addresses by A
2
-A
0
. The array is organized as 4K rows of eight
bytes each. The entire row is internally accessed once whether
a single byte or all eight bytes are read or written. Each byte in
the row is counted only once in an endurance calculation if the
addressing is contiguous in nature.
The user may choose to write CPU instructions and run them
from a certain address space. Table 1 shows endurance
calculations for a 256-byte repeating loop, which includes a
starting address, seven-page mode accesses, and a CE
pre-charge. The number of bus clock cycles needed to complete
a eight-byte read transaction is 1 + 7 + 1 or 9 clocks. The entire
loop causes each byte to experience only one endurance cycle.
The F-RAM read and write endurance is virtually unlimited.
Figure 4. Use of Pull-up Resistor on CE
Figure 5. Use of Pull-up Resistor on WE
MCU / MPU
CE
WE
OE
A
14-0
DQ
7-0
FM28V020
V
DD
MCU / MPU
CE
WE
OE
A
14-0
DQ
7-0
FM28V020
V
DD
Table 1. Time to Reach 100 Trillion Cycles for Repeating
256-byte Loop
Bus
Freq
(MHz)
Bus
Cycle
Time
(ns)
256-byte
Transaction
Time (s)
Endurance
Cycles/sec
Endurance
Cycles/year
Years to
Reach
10
14
Cycles
10 100 28.8 34,720 1.09 x 10
12
91.7
5 200 57.6 17,360 5.47 x 10
11
182.8

FM28V020-TGTR

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
F-RAM 256Kb FRAM 2.0V-3.6V FRAM
Lifecycle:
New from this manufacturer.
Delivery:
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