PCA9541_7 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 7.1 — 24 June 2015 37 of 42
NXP Semiconductors
PCA9541
2-to-1 I
2
C-bus master selector with interrupt logic and reset
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 30
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18
and 19
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 30
.
Table 18. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350
< 2.5 235 220
2.5 220 220
Table 19. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (C)
Volume (mm
3
)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
PCA9541_7 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 7.1 — 24 June 2015 38 of 42
NXP Semiconductors
PCA9541
2-to-1 I
2
C-bus master selector with interrupt logic and reset
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Abbreviations
MSL: Moisture Sensitivity Level
Fig 30. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 20. Abbreviations
Acronym Description
AI Auto Increment
CDM Charged Device Model
DUT Device Under Test
EEPROM Electrically Erasable Programmable Read-Only Memory
ESD ElectroStatic Discharge
FRU Field Replaceable Unit
HBM Human Body Model
I
2
C-bus Inter Integrated Circuit bus
IC Integrated Circuit
MM Machine Model
POR Power-On Reset
RC Resistor-Capacitor network
SMBus System Management Bus
PCA9541_7 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet Rev. 7.1 — 24 June 2015 39 of 42
NXP Semiconductors
PCA9541
2-to-1 I
2
C-bus master selector with interrupt logic and reset
18. Revision history
Table 21. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCA9541_7.1 20150624 Product data sheet - PCA9541_7
Modifications:
Updated Figure 17
PCA9541_7 20090702 Product data sheet - PCA9541_6
Modifications:
Type numbers PCA9541D//02, PCA9541PW/02 and PCA9541BS/02 are withdrawn; this affects:
Section 1 “
General description, 2
nd
paragraph modified; (old) 11
th
paragraph deleted
Section 2 “
Features and benefits, (old) 4
th
bullet item deleted
Table 1 “
Ordering information modified
Table 2 “
Marking codes modified
Figure 2, Figure 3 and Figure 4 modified
Table 6 “
Register 0 - Interrupt Enable (IE) register bit description, Table note [1] modified
Table 8 “
Register 1 - Control Register (B1:B0 = 01b) bit description, Table note [1] modified
Table 11Default Control Register values modified
Table 14 “
Register 2 - Interrupt Status (ISTAT) register bit description, Table note [1] modified
Section 8.5 “
Power-on reset, (old) 2
nd
bullet item deleted
Section 8.6 “External reset, (old) 2
nd
bullet item deleted
Section 10.2 “
High reliability systems, 1
st
paragraph modified
(Old) Table 16 “Static characteristics (2.3 V to 3.6 V)” and (old) Table 17 “Static characteristics
(3.6 V to 5.5 V)” are merged.
Table 16 “Static characteristics, sub-section “Supply”:
I
stb
(Typ) at condition V
DD
= 2.3 V to 3.6 V changed from “10 A” to “30 A”
I
stb
(Max) at condition V
DD
= 2.3 V to 3.6 V changed from “100 A” to “80 A”
I
stb
(Typ) at condition V
DD
= 3.6 V to 5.5 V changed from “10 A” to “40 A”
I
stb
(Max) at condition V
DD
= 3.6 V to 5.5 V changed from “200 A” to “100 A”
Table 16 “Static characteristics, sub-section “Input SCL_MSTn; input/output SDA_MSTn
(upstream and downstream channels):
for condition V
DD
= 3.6 V to 5.5 V, deleted I
IL
and I
IH
specifications (was in old Table 17)
Table 16 “Static characteristics, sub-section “Select inputs A0 to A3, INT_IN, RESET”:
for condition V
DD
= 3.6 V to 5.5 V, I
LI
(Max) changed from “+50 A” to “+1 A” (from old
Table 17)
Table 16 “Static characteristics, sub-section “Pass gate”:
for condition V
DD
= 3.6 V to 5.5 V, I
L
(Max) changed from +100 A to +1 A (was in old
Table 17)
Figure 25 “Definition of RESET timing modified:
changed signal name from “LEDx” to “INTn
deleted “LED off”
PCA9541_6 20080911 Product data sheet - PCA9541_5
PCA9541_5 20071001 Product data sheet - PCA9541_4
PCA9541_4 20060104 Product data sheet - PCA9541_3
PCA9541_3
(9397 750 14746)
20050713 Product data sheet - PCA9541_2
PCA9541_2
(9397 750 13629)
20041001 Product data sheet - PCA9541_1

PCA9541BS/01,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC I2C 2:1 SELECTOR 16-HVQFN
Lifecycle:
New from this manufacturer.
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