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SL3S1002FTB1,115

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48
139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.8 — 11 November 2013
139038 4 of 48
NXP Semiconductors
SL3ICS1002/1202
UCODE G2XM and G2XL
5. Block diagram
The SL3ICS1002/1202 IC consists of three major blocks:
- Analog RF Interface
- Digital Controller
- EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader for being processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM, which contains the EPC and the user data.
Fig 1. Block diagram of G2X IC
001aai335
MOD
DEMOD
VREG
VDD
data
in
data
out
R/W
ANALOG
RF INTERFACE
PAD
PAD
RECT
DIGITAL CONTROL
ANTENNA
ANTICOLLISION
READ/WRITE
CONTROL
ACCESS CONTROL
EEPROM INTERFACE
CONTROL
RF INTERFACE
CONTROL
EEPROM
MEMORY
SEQUENCER
CHARGE PUMP
139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.8 — 11 November 2013
139038 5 of 48
NXP Semiconductors
SL3ICS1002/1202
UCODE G2XM and G2XL
6. Wafer layout and pinning information
6.1 Wafer layout
(1) X-scribe line width: 56.4 m
(2) Y-scribe line width: 56.4 m
(3) Chip step, x-length: 488.0 m
(4) Chip step, y-length: 470,0 m
(5) Bump to bump distance X (TP1 - RFN): 351,0 m
(6) Bump to bump distance Y (RFN - RFP): 333,0 m
(7) Distance bump to metal sealring X: 40,3 m
(8) Distance bump to metal sealring Y: 40,3 m
Bump size X x Y: 60 m x 60 m
Fig 2. Wafer layout and pinning information
001aai346
not to scale!
(1)
(7)
(2)
(8)
(5)
(6)
(4)
(3)
Y
X
TP2
TP1 RFN
RFP
139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.8 — 11 November 2013
139038 6 of 48
NXP Semiconductors
SL3ICS1002/1202
UCODE G2XM and G2XL
7. Package outline
Fig 3. Package outline SOT1122
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1122
MO-252
sot1122_po
Unit
mm
max
nom
min
0.50 0.04
0.55 0.425
0.30
0.25
0.22
0.35
0.30
0.27
A
(1)
Dimensions
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
SOT1122
A
1
D
1.50
1.45
1.40
1.05
1.00
0.95
Eee
1
0.55
0.50
0.47
0.45
0.40
0.37
bb
1
LL
1
09-10-09
XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm
D
E
e
1
e
A
1
b
1
L
1
L
e
1
0 1 2 mm
scale
3
1
2
b
4×
(2)
4×
(2)
A
pin 1 indication
type code
terminal 1
index area
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48

SL3S1002FTB1,115

Mfr. #:
Buy SL3S1002FTB1,115
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders SMART LABEL/TAG IC UCODE G2XM AND G2XL
Lifecycle:
New from this manufacturer.
Delivery:
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