4
FN6462.0
February 26, 2007
Absolute Maximum Ratings Thermal Information
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V
BOOT Voltage (V
BOOT
). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36V
Input Voltage (V
PWM
) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V
UGATE. . . . . . . . . . . . . . . . . . . V
PHASE
- 0.3V
DC
to V
BOOT
+ 0.3V
V
PHASE
- 3.5V (<100ns Pulse Width, 2µJ) to V
BOOT
+ 0.3V
LGATE . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V
DC
to V
PVCC
+ 0.3V
GND - 5V (<100ns Pulse Width, 2µJ) to V
PVCC
+ 0.3V
PHASE. . . . . . . . . . . . . . . GND - 0.3V
DC
to 15V
DC
(V
PVCC
= 12V)
GND - 8V (<400ns, 20µJ) to 30V (<200ns, VBOOT-GND<36V)
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . Class I JEDEC STD
Recommended Operating Conditions
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . 0°C to +85°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V ±10%
Supply Voltage Range, PVCC . . . . . . . . . . . . . . . .5V to 12V ±10%
Thermal Resistance θ
JA
(°C/W) θ
JC
(°C/W)
SOIC Package (Note 1) . . . . . . . . . . . . 100 N/A
DFN Package (Notes 2, 3). . . . . . . . . . 48 7
Maximum Junction Temperature (Plastic Package) . . . . . . .+150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air.
2. θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Bias Supply Current I
VCC
PX3511A, f
PWM
= 300kHz, V
VCC
= 12V - 8 - mA
PX3511B, f
PWM
= 300kHz, V
VCC
= 12V - 4.5 - mA
I
VCC
PX3511A, f
PWM
= 1MHz, V
VCC
= 12V - 10.5 - mA
PX3511B, f
PWM
= 1MHz, V
VCC
= 12V - 5 - mA
Gate Drive Bias Current I
PVCC
PX3511A, f
PWM
= 300kHz, V
PVCC
= 12V - 4 - mA
PX3511B, f
PWM
= 300kHz, V
PVCC
= 12V - 7.5 - mA
I
PVCC
(Note 4)
PX3511A, f
PWM
= 1MHz, V
PVCC
= 12V - 5 - mA
PX3511B, f
PWM
= 1MHz, V
PVCC
= 12V - 8.5 - mA
POWER-ON RESET AND ENABLE
VCC Rising Threshold 9.35 9.8 10.0 V
VCC Falling Threshold 7.35 7.6 8.0 V
PWM INPUT (See Timing Diagram on Page 6)
Input Current I
PWM
V
PWM
= 3.3V - 505 - µA
V
PWM
= 0V - -460 - µA
PWM Rising Threshold (Note 4) VCC = 12V - 1.70 - V
PWM Falling Threshold (Note 4) VCC = 12V - 1.30 - V
Typical Three-State Shutdown Window VCC = 12V 1.23 - 1.82 V
Three-State Lower Gate Falling Threshold VCC = 12V - 1.18 - V
Three-State Lower Gate Rising Threshold VCC = 12V - 0.76 - V
Three-State Upper Gate Rising Threshold VCC = 12V - 2.36 - V
PX3511A, PX3511B
5
FN6462.0
February 26, 2007
Three-State Upper Gate Falling Threshold VCC = 12V - 1.96 - V
Shutdown Holdoff Time t
TSSHD
- 245 - ns
UGATE Rise Time t
RU
V
PVCC
= 12V, 3nF Load, 10% to 90% - 26 - ns
LGATE Rise Time t
RL
V
PVCC
= 12V, 3nF Load, 10% to 90% - 18 - ns
UGATE Fall Time (Note 4) t
FU
V
PVCC
= 12V, 3nF Load, 90% to 10% - 18 - ns
LGATE Fall Time (Note 4) t
FL
V
PVCC
= 12V, 3nF Load, 90% to 10% - 12 - ns
UGATE Turn-On Propagation Delay (Note 4) t
PDHU
V
PVCC
= 12V, 3nF Load, Adaptive - 10 - ns
LGATE Turn-On Propagation Delay (Note 4) t
PDHL
V
PVCC
= 12V, 3nF Load, Adaptive - 10 - ns
UGATE Turn-Off Propagation Delay (Note 4) t
PDLU
V
PVCC
= 12V, 3nF Load - 10 - ns
LGATE Turn-Off Propagation Delay (Note 4) t
PDLL
V
PVCC
= 12V, 3nF Load - 10 - ns
LG/UG Three-State Propagation Delay (Note 4) t
PDTS
V
PVCC
= 12V, 3nF Load - 10 - ns
OUTPUT
Upper Drive Source Current (Note 4) I
U_SOURCE
V
PVCC
= 12V, 3nF Load - 1.25 - A
Upper Drive Source Impedance R
U_SOURCE
150mA Source Current 1.4 2.0 3.0 Ω
Upper Drive Sink Current (Note 4) I
U_SINK
V
PVCC
= 12V, 3nF Load - 2 - A
Upper Drive Sink Impedance R
U_SINK
150mA Sink Current 0.9 1.65 3.0 Ω
Lower Drive Source Current (Note 4) I
L_SOURCE
V
PVCC
= 12V, 3nF Load - 2 - A
Lower Drive Source Impedance R
L_SOURCE
150mA Source Current 0.85 1.3 2.2 Ω
Lower Drive Sink Current (Note 4) I
L_SINK
V
PVCC
= 12V, 3nF Load - 3 - A
Lower Drive Sink Impedance R
L_SINK
150mA Sink Current 0.60 0.94 1.35 Ω
NOTE:
4. Guaranteed by design. Not 100% tested in production.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted. (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Functional Pin Description
PACKAGE PIN #
PIN
SYMBOL FUNCTIONSOIC DFN
1 1 UGATE Upper gate drive output. Connect to gate of high-side power N-Channel MOSFET.
2 2 BOOT Floating bootstrap supply pin for the upper gate drive. Connect the bootstrap capacitor between this pin and the
PHASE pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See the Internal Bootstrap
Device section under DESCRIPTION for guidance in choosing the capacitor value.
- 3,8 N/C No Connection.
3 4 PWM The PWM signal is the control input for the driver. The PWM signal can enter three distinct states during operation, see
the three-state PWM Input section under DESCRIPTION for further details. Connect this pin to the PWM output of the
controller.
4 5 GND Bias and reference ground. All signals are referenced to this node. It is also the power ground return of the driver.
5 6 LGATE Lower gate drive output. Connect to gate of the low-side power N-Channel MOSFET.
6 7 VCC Connect this pin to a +12V bias supply. Place a high quality low ESR ceramic capacitor from this pin to GND.
7 9 PVCC This pin supplies power to both upper and lower gate drives in PX3511B; only the lower gate drive in PX3511A.
Its operating range is +5V to 12V. Place a high quality low ESR ceramic capacitor from this pin to GND.
8 10 PHASE Connect this pin to the SOURCE of the upper MOSFET and the DRAIN of the lower MOSFET. This pin provides
a return path for the upper gate drive.
9 11 PAD Connect this pad to the power ground plane (GND) via thermally enhanced connection.
PX3511A, PX3511B
6
FN6462.0
February 26, 2007
Description
Operation
Designed for versatility and speed, the PX3511A and
PX3511B MOSFET drivers control both high-side and low-
side N-Channel FETs of a half-bridge power train from one
externally provided PWM signal.
Prior to VCC exceeding its POR level, the Pre-POR
overvoltage protection function is activated during initial
startup; the upper gate (UGATE) is held low and the lower
gate (LGATE), controlled by the Pre-POR overvoltage
protection circuits, is connected to the PHASE. Once the
VCC voltage surpasses the VCC Rising Threshold (See
Electrical Specifications), the PWM signal takes control of
gate transitions. A rising edge on PWM initiates the turn-off
of the lower MOSFET (see Timing Diagram). After a short
propagation delay [t
PDLL
], the lower gate begins to fall.
Typical fall times [t
FL
] are provided in the Electrical
Specifications section. Adaptive shoot-through circuitry
monitors the LGATE voltage and determines the upper gate
delay time [t
PDHU
]. This prevents both the lower and upper
MOSFETs from conducting simultaneously. Once this delay
period is complete, the upper gate drive begins to rise [t
RU
]
and the upper MOSFET turns on.
A falling transition on PWM results in the turn-off of the upper
MOSFET and the turn-on of the lower MOSFET. A short
propagation delay [t
PDLU
] is encountered before the upper
gate begins to fall [t
FU
]. Again, the adaptive shoot-through
circuitry determines the lower gate delay time, t
PDHL
. The
PHASE voltage and the UGATE voltage are monitored, and
the lower gate is allowed to rise after PHASE drops below a
level or the voltage of UGATE to PHASE reaches a level
depending upon the current direction (See next section for
details). The lower gate then rises [t
RL
], turning on the lower
MOSFET.
Adaptive Zero Shoot-Through Deadtime Control
These drivers incorporate an adaptive deadtime control
technique to minimize deadtime, resulting in high efficiency
from the reduced freewheeling time of the lower MOSFETs’
body-diode conduction, and to prevent the upper and lower
MOSFETs from conducting simultaneously. This is
accomplished by ensuring either rising gate turns on its
MOSFET with minimum and sufficient delay after the other
has turned off.
During turn-off of the lower MOSFET, the LGATE voltage is
monitored until it drops below 1.75V, at which time the
UGATE is released to rise after 20ns of propagation delay.
Once the PHASE is high, the adaptive shoot-through
circuitry monitors the PHASE and UGATE voltages during a
PWM falling edge and the subsequent UGATE turn-off. If
either the UGATE falls to less than 1.75V above the PHASE
or the PHASE falls to less than +0.8V, the LGATE is
released to turn on.
Three-State PWM Input
A unique feature of these drivers and other Intersil drivers is
the addition of a shutdown window to the PWM input. If the
PWM signal enters and remains within the shutdown window
for a set holdoff time, the driver outputs are disabled and
both MOSFET gates are pulled and held low. The shutdown
state is removed when the PWM signal moves outside the
shutdown window. Otherwise, the PWM rising and falling
thresholds outlined in the ELECTRICAL SPECIFICATIONS
determine when the lower and upper gates are enabled.
This feature helps prevent a negative transient on the output
voltage when the output is shut down, eliminating the
Schottky diode that is used in some systems for protecting
the load from reversed output voltage events.
In addition, more than 400mV hysteresis also incorporates
into the three-state shutdown window to eliminate PWM
PWM
UGATE
LGATE
t
FL
t
PDHU
t
PDLL
t
RL
t
TSSHD
t
PDTS
t
PDTS
1.18V<PWM<2.36V
0.76V<PWM<1.96V
t
FU
t
RU
t
PDLU
t
PDHL
t
TSSHD
FIGURE 1. TIMING DIAGRAM
PX3511A, PX3511B

PX3511ADDG

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers DRVR SEE ISL6594X LGATE DETECT 10LD
Lifecycle:
New from this manufacturer.
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