LTC2430/LTC2431
7
24301f
TYPICAL PERFOR A CE CHARACTERISTICS
UW
RMS Noise vs V
INCM
RMS Noise vs Temperature (T
A
)
V
INCM
(V)
–1 0
2.4
RMS NOISE (µV)
2.8
3.4
1
3
4
24301 G11
2.6
3.2
3.0
2
5
6
V
CC
= 5V
REF
+
= 5V
REF
= GND
V
IN
= 0V
V
INCM
= GND
F
O
= GND
T
A
= 25°C
TEMPERATURE (°C)
–50
2.4
RMS NOISE (µV)
2.6
2.8
3.0
3.2
3.4
–25
02550
24301 G12
75 100
V
CC
= 5V
V
REF
= 5V
V
IN
= 0V
V
INCM
= GND
F
O
= GND
RMS Noise vs V
CC
V
CC
(V)
2.7 3.1
2.4
RMS NOISE (µV)
2.8
3.4
3.5
4.3
4.7
24301 G13
2.6
3.2
3.0
3.9
5.1
5.5
REF
+
= 2.5V
REF
= GND
V
IN
= 0V
V
INCM
= GND
F
O
= GND
T
A
= 25°C
RMS Noise vs V
REF
V
REF
(V)
0
RMS NOISE (µV)
3.0
3.2
3.4
4
24301 G14
2.8
2.6
2.4
1
2
3
5
V
CC
= 5V
REF
= GND
V
IN
= 0V
V
INCM
= GND
F
O
= GND
T
A
= 25°C
Offset Error vs V
INCM
V
INCM
(V)
–1
–1.0
OFFSET ERROR (ppm OF V
REF
)
0.8
0.4
0.2
0
1.0
0.4
1
3
4
24301 G15
0.6
0.6
0.8
0.2
0
2
5
6
V
CC
= 5V
REF
+
= 5V
REF
= GND
V
IN
= 0V
F
O
= GND
T
A
= 25°C
Offset Error vs Temperature
Offset Error vs V
REF
TEMPERATURE (°C)
–45
–1.0
OFFSET ERROR (ppm OF V
REF
)
0.8
0.4
0.2
0
1.0
0.4
–15
15
30 90
24301 G16
0.6
0.6
0.8
0.2
–30 0
45
60
75
V
CC
= 5V
V
REF
=5V
V
IN
= 0V
V
INCM
= GND
F
O
= GND
Offset Error vs V
CC
V
CC
(V)
2.7
–1.0
OFFSET ERROR (ppm OF V
REF
)
0.8
0.4
0.2
0
1.0
0.4
3.5
4.3
4.7
24301 G17
0.6
0.6
0.8
0.2
3.1
3.9
5.1
5.5
REF
+
= V
CC
REF
= GND
V
IN
= 0V
V
INCM
= GND
F
O
= GND
T
A
= 25°C
V
REF
(V)
0
OFFSET ERROR (ppm OF V
REF
)
1
3
5
4
24301 G18
–1
–3
0
2
4
–2
–4
–5
1
2
3
5
V
CC
= 5V
REF
= GND
V
IN
= 0V
V
INCM
= GND
F
O
= GND
T
A
= 25°C
Full-Scale Error vs Temperature
TEMPERATURE (°C)
–45
–20
FULL-SCALE ERROR (ppm OF V
REF
)
–10
0
10
20
–30 –15 0 15
24301 G19
30 45 60 75 90
+FS ERROR
FS ERROR
V
CC
= 5V
V
REF
= 5V
F
O
= GND
V
INCM
= 2.5V
LTC2430/LTC2431
8
24301f
TYPICAL PERFOR A CE CHARACTERISTICS
UW
PSRR vs Frequency at V
CC
Conversion Current vs Temperature
Full-Scale Error vs V
REF
V
REF
(V)
0
FULL-SCALE ERROR (ppm OF V
REF
)
20
15
10
5
0
–5
–10
–15
–20
4
24301 G20
123 53.50.5 1.5 2.5 4.5
+FS ERROR
FS ERROR
V
CC
= 5V
REF
= GND
F
O
= GND
V
INCM
= 0.5V
REF
T
A
= 25°C
Full-Scale Error vs V
CC
V
CC
(V)
2.7
–5
FULL-SCALE ERROR (ppm OF V
REF
)
–4
–2
–1
0
5
2
3.5 4.3 4.7
24301 G21
–3
3
4
1
3.1 3.9 5.1 5.5
+FS ERROR
FS ERROR
V
REF
= 2.5V
REF
= GND
F
O
= GND
V
INCM
= 0.5V
REF
T
A
= 25°C
FREQUENCY AT V
CC
(Hz)
0
–140
REJECTION (dB)
–120
–80
–60
–40
0
20
100
140
24301 G22
–100
–20
80
180
220200
40
60
120 160
V
CC
= 4.1V
DC
±1.4V
REF
+
= 2.5V
REF
= GND
IN
+
= GND
IN
= GND
F
O
= GND
T
A
= 25°C
PSRR vs Frequency at V
CC
PSRR vs Frequency at V
CC
FREQUENCY AT V
CC
(Hz)
15170
–60
–40
0
15320
24301 G24
–80
–100
15220 15270 15370
–120
–140
–20
REJECTION (dB)
V
CC
= 4.1V
DC
±0.7V
REF
+
= 2.5V
REF
= GND
IN
+
= GND
IN
= GND
F
O
= GND
T
A
= 25°C
TEMPERATURE (°C)
–45
CONVERSION CURRENT (µA)
200
210
220
75
24301 G25
190
180
160
–15 15 45–30 9003060
170
240
230
V
CC
= 5.5V
V
CC
= 2.7V
V
CC
= 5V
V
CC
= 3V
F
O
= GND
CS = GND
SCK = NC
SDO = NC
Conversion Current
vs Output Data Rate
OUTPUT DATA RATE (READINGS/SEC)
0
100
SUPPLY CURRENT (µA)
200
400
500
600
60 70 80 90
1000
24301 G26
300
10 20 30 40 50 100
700
800
900
V
CC
= 5V
V
CC
= 3V
V
REF
= V
CC
IN
+
= GND
IN
= GND
SCK = NC
SDO = NC
SDI = GND
CS = GND
F
O
= EXT OSC
T
A
= 25°C
Sleep Mode Current
vs Temperature
TEMPERATURE (°C)
–45
0
SLEEP MODE CURRENT (µA)
1
3
4
5
–15
15
30 90
24301 G27
2
–30 0
45
60
75
6
V
CC
= 5.5V
V
CC
= 2.7V
V
CC
= 5V
V
CC
= 3V
F
O
= GND
CS = V
CC
SCK = NC
SDO = NC
FREQUENCY AT V
CC
(Hz)
1
0
–20
–40
–60
–80
–100
–120
–140
1k 100k
24301 G23
10 100
10k 1M
REJECTION (dB)
V
CC
= 4.1V
DC
REF
+
= 2.5V
REF
= GND
IN
+
= GND
IN
= GND
F
O
= GND
T
A
= 25°C
LTC2430/LTC2431
9
24301f
V
CC
(Pin 1): Positive Supply Voltage. Bypass to GND
(Pin␣ 6) with a 10µF tantalum capacitor in parallel with
0.1µF ceramic capacitor as close to the part as possible.
REF
+
(Pin 2), REF
(Pin 3): Differential Reference Input.
The voltage on these pins can have any value between GND
and V
CC
as long as the reference positive input, REF
+
, is
maintained more positive than the reference negative
input, REF
, by at least 0.1V.
IN
+
(Pin 4), IN
(Pin 5): Differential Analog Input. The
voltage on these pins can have any value between
GND – 0.3V and V
CC
+ 0.3V. Within these limits, the
converter bipolar input range (V
IN
= IN
+
– IN
) extends
from –0.5 • (V
REF
) to 0.5 • (V
REF
). Outside this input
range, the converter produces unique overrange and
underrange output codes.
GND (Pin 6): Ground. Connect this pin to a ground plane
through a low impedance connection.
CS (Pin 7): Active LOW Digital Input. A LOW on this pin
enables the SDO digital output and wakes up the ADC.
Following each conversion, the ADC automatically enters
the Sleep mode and remains in this low power state as
long as CS is HIGH. A LOW-to-HIGH transition on CS
during the Data Output transfer aborts the data transfer
and starts a new conversion.
UU
U
PI FU CTIO S
GND (Pins 1, 7, 8, 9, 10, 15, 16): Ground. Multiple ground
pins internally connected for optimum ground current flow
and V
CC
decoupling. Connect each one of these pins to a
ground plane through a low impedance connection. All seven
pins must be connected to ground for proper operation.
V
CC
(Pin 2): Positive Supply Voltage. Bypass to GND with
a 10µF tantalum capacitor in parallel with 0.1µF ceramic
capacitor as close to the part as possible.
REF
+
(Pin 3), REF
(Pin 4): Differential Reference Input.
The voltage on these pins can have any value between GND
and V
CC
as long as the reference positive input, REF
+
, is
maintained more positive than the reference negative
input, REF
, by at least 0.1V.
IN
+
(Pin 5), IN
(Pin 6): Differential Analog Input. The
voltage on these pins can have any value between
GND – 0.3V and V
CC
+ 0.3V. Within these limits the
converter bipolar input range (V
IN
= IN
+
– IN
) extends
from –0.5 • (V
REF
) to 0.5 • (V
REF
). Outside this input range
the converter produces unique overrange and underrange
output codes.
CS (Pin 11): Active LOW Digital Input. A LOW on this pin
enables the SDO digital output and wakes up the ADC.
Following each conversion the ADC automatically enters
the Sleep mode and remains in this low power state as
long as CS is HIGH. A LOW-to-HIGH transition on CS
during the Data Output transfer aborts the data transfer
and starts a new conversion.
SDO (Pin 12): Three-State Digital Output. During the Data
Output period, this pin is used as serial data output. When
the chip select CS is HIGH (CS = V
CC
) the SDO pin is in a
high impedance state. During the Conversion and Sleep
periods, this pin is used as the conversion status output.
The conversion status can be observed by pulling CS LOW.
SCK (Pin 13): Bidirectional Digital Clock Pin. In Internal
Serial Clock Operation mode, SCK is used as digital output
for the internal serial interface clock during the Data
Output period. In External Serial Clock Operation mode,
SCK is used as digital input for the external serial interface
clock during the Data Output period. A weak internal pull-
up is automatically activated in Internal Serial Clock Op-
eration mode. The Serial Clock Operation mode is deter-
mined by the logic level applied to the SCK pin at power up
or during the most recent falling edge of CS.
F
O
(Pin 14): Frequency Control Pin. Digital input that
controls the ADC’s notch frequencies and conversion
time. When the F
O
pin is connected to V
CC
(F
O
= V
CC
), the
converter uses its internal oscillator and the digital filter
first null is located at 50Hz. When the F
O
pin is connected
to GND (F
O
= OV), the converter uses its internal oscillator
and the digital filter first null is located at 60Hz. When F
O
is driven by an external clock signal with a frequency f
EOSC
,
the converter uses this signal as its system clock and the
digital filter first null is located at a frequency f
EOSC
/2560.
(LTC2430)
(LTC2431)

LTC2430CGN#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 20-bit Differential Delta-Sigma ADC
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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