HTMS1x01_8x01 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.4 — 21 May 2015
152934 49 of 57
NXP Semiconductors
HTMS1x01; HTMS8x01
HITAG µ transponder IC
20. Package outline
Fig 21. Package outline SOT1122
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1122
MO-252
sot1122_po
Unit
mm
max
nom
min
0.50 0.04
0.55 0.425
0.30
0.25
0.22
0.35
0.30
0.27
A
(1)
Dimensions
Notes
1. Dimension A is including plating thickness.
2. Can be visible in some manufacturing processes.
SOT1122
A
1
D
1.50
1.45
1.40
1.05
1.00
0.95
Eee
1
0.55
0.50
0.47
0.45
0.40
0.37
bb
1
LL
1
09-10-09
XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm
D
E
e
1
e
A
1
b
1
L
1
L
e
1
0 1 2 mm
scale
3
1
2
b
4×
(2)
4×
(2)
A
pin 1 indication
type code
terminal 1
index area
HTMS1x01_8x01 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.4 — 21 May 2015
152934 50 of 57
NXP Semiconductors
HTMS1x01; HTMS8x01
HITAG µ transponder IC
Fig 22. Package outline HVSON2
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT899-1
SOT899-1
05-02-25
05-05-09
Note
1. Plastic or metal protrusions of 0.75 mm maximum per side are not included
UNIT
A
max
mm 1
0.05
0
2.1
1.9
1.35
1.05
3.1
2.9
1.35
1.05
0.5
0.3
A
1
DIMENSIONS (mm are the original dimensions)
HVSON2: plastic thermal enhanced very thin small outline package; no leads;
2 terminals; body 3 × 2 × 0.85 mm
D
0.9
0.7
b D
h
E E
h
e
2.5
L y
1
0.1
v
0.1
w
0.05
y
0.05
0 1 2 mm
scale
C
y
C
y
1
X
detail X
A
A
1
B
A
D
E
terminal 1
index area
b
e
AC
B
v
M
Cw
M
D
h
1
2
L
E
h
terminal 1
index area
HTMS1x01_8x01 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.4 — 21 May 2015
152934 51 of 57
NXP Semiconductors
HTMS1x01; HTMS8x01
HITAG µ transponder IC
21. Abbreviations
Table 54. Abbreviations
Abbreviation Definition
AC Anticollision Code
ASK Amplitude Shift Keying
BC Bi-phase Code
BPLC Binary Pulse Length Coding
CRC Cyclic Redundancy Check
DSFID Data Storage Format Identifier
EEPROM Electrically Erasable Programmable Read-Only Memory
EOF End Of Frame
IC Integrated Circuit
ICR Integrated Circuit Reference number
LSB Least Significant Bit
LSByte Least Significant Byte
m Modulation Index
MC Manchester Code
MFC integrated circuit Manufacturer Code
MSB Most Significant Bit
MSByte Most Significant Byte
MSN Manufacturer Serial Number
NA No Access
NOB Number Of Block
NOP Number Of Pages
NOS Number Of Slots
NSS Number Of Sensors
OTP One Time Programmable
PID Product Identifier
PWD Password
RF Radio Frequency
RFU Reserved for Future Use
RND Random Number
RO Read Only
RTF Reader Talks First
R/W Read/Write
RWD Read Write Device
SOF Start of Frame
TTF Transponder Talks First
UID Unique IDentifier

HTMS8201FTB/AF,115

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders RFID HTAG ADVANCED
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union