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TEA1062AT/C4,112

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
1997 Sep 03 22
Philips Semiconductors Product specification
Low voltage transmission circuits with
dialler interface
TEA1062; TEA1062A
PACKAGE OUTLINES
UNIT
A
max.
1 2
b
1
cEe M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1
92-10-02
95-01-19
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.055
0.045
0.53
0.38
0.32
0.23
21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.2542.54 7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7 0.51 3.7
0.15
0.021
0.015
0.013
0.009
0.010.100.0200.19
050G09 MO-001AE
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
16
1
9
8
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1) (1)
D
(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
1997 Sep 03 23
Philips Semiconductors Product specification
Low voltage transmission circuits with
dialler interface
TEA1062; TEA1062A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
SOT38-4
92-11-17
95-01-14
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
b
2
e
D
A
2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
A
max.
12
b
1
(1) (1)
(1)
b
2
cD E e M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.30
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
0.2542.54 7.62
8.25
7.80
10.0
8.3
0.764.2 0.51 3.2
inches
0.068
0.051
0.021
0.015
0.014
0.009
1.25
0.85
0.049
0.033
0.77
0.73
0.26
0.24
0.14
0.12
0.010.10 0.30
0.32
0.31
0.39
0.33
0.0300.17 0.020 0.13
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
1997 Sep 03 24
Philips Semiconductors Product specification
Low voltage transmission circuits with
dialler interface
TEA1062; TEA1062A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
SOT38-9
97-07-24
M
H
c
M
E
A
L
seating plane
w M
e
D
A
2
A
1
b
1
b
2
Z
16
1
9
8
E
pin 1 index
b
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
UNIT
A
max.
b
1
(1) (1)
(1)
b
2
cD E e M
H
Z
L
mm
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
A
1
min.
A
2
max.
b
max.
w
M
E
e
1
1.65
1.40
0.51
0.41
0.36
0.20
19.30
18.80
6.45
6.24
3.81
2.92
0.2542.54 7.62
8.23
7.62
9.40
8.38
0.764.32 0.38 3.56
inches
0.065
0.055
0.020
0.016
0.014
0.008
1.14
0.76
0.045
0.030
0.76
0.74
0.254
0.246
0.150
0.115
0.010.10 0.30
0.324
0.300
0.37
0.33
0.0300.17 0.015 0.14
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-9
(e
1
)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

TEA1062AT/C4,112

Mfr. #:
Buy TEA1062AT/C4,112
Manufacturer:
NXP Semiconductors
Description:
IC TRANSMISSION LV 16-SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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