SI5913DC-T1-E3

Vishay Siliconix
Si5913DC
Document Number: 68920
S10-0548-Rev. B, 08-Mar-10
www.vishay.com
1
P-Channel 20 V (D-S) MOSFET with Schottky Diode
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
LITTLE FOOT
®
Plus Schottky Power MOSFET
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
•HDD
- DC/DC Converter
Asynchronous Rectification
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
- 20
0.084 at V
GS
= - 10 V
- 4
f
4 nC
0.108 at V
GS
= - 4.5 V
- 4
f
0.175 at V
GS
= - 2.5 V - 3.5
SCHOTTKY PRODUCT SUMMARY
V
KA
(V)
V
f
(V)
Diode Forward Voltage
I
F
(A)
a
20 0.5 at 1 A 2
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage (MOSFET)
V
DS
- 20
VReverse Voltage (Schottky)
V
KA
20
Gate-Source Voltage (MOSFET)
V
GS
± 12
Continuous Drain Current (T
J
= 150 °C) (MOSFET)
T
C
= 25 °C
I
D
- 4
f
A
T
C
= 70 °C
- 4
f
T
A
= 25 °C
- 3.7
b, c
T
A
= 70 °C
- 2.9
b, c
Pulsed Drain Current
(MOSFET)
I
DM
- 15
Continuous Source-Drain Diode Current
(MOSFET Diode Conduction)
T
C
= 25 °C
I
S
- 2.6
T
A
= 25 °C
- 1.4
b, c
Average Forward Current (Schottky)
I
F 2
b
Pulsed Forward Current (Schottky)
I
FM
5
Maximum Power Dissipation (MOSFET)
T
C
= 25 °C
P
D
3.1
W
T
C
= 70 °C 2.0
T
A
= 25 °C
1.7
b, c
T
A
= 70 °C
1.1
b, c
Maximum Power Dissipation (Schottky)
T
C
= 25 °C 3.1
T
C
= 70 °C 2.0
T
A
= 25 °C
1.3
b, c
T
A
= 70 °C
0.8
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendation (Peak Temperature)
g, h
260
Bottom View
1206-8 ChipFET
®
A
A
S
G
K
K
D
D
1
Marking Code
DJ XX
Lot Traceability
and Date Code
Part # Code
Ordering Information: Si5913DC-T1-E3 (Lead (Pb)-free)
Si5913DC-T1-GE3 (Lead (Pb)-free and Halogen-free)
A
K
S
G
D
P-Channel MOSFET
www.vishay.com
2
Document Number: 68920
S10-0548-Rev. B, 08-Mar-10
Vishay Siliconix
Si5913DC
Notes:
a. Based on T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s
d. Maximum under steady state conditions is 115 °C/W.
e. Maximum under steady state conditions is 130 °C/W.
f. Package limited.
g. See Solder Profile (www.vishay.com/doc?73257
). The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed an is not required
to ensure adequate bottom side soldering interconnection.
h. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient (MOSFET)
b, d
t 5 s
R
thJA
62 74
°C/W
Maximum Junction-to-Foot (Drain) (MOSFET)
Steady State
R
thJF
32 40
Maximum Junction-to-Ambient (Schottky)
b, e
t 5 s
R
thJA
77 95
Maximum Junction-to-Foot (Drain) (Schottky)
Steady State
R
thJF
33 40
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 20 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 20
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
3
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 0.6 - 1.5 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 12 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 20 V, V
GS
= 0 V
- 1
µA
V
DS
= - 20 V, V
GS
= 0 V, T
J
= 55 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= - 10 V - 15 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V, I
D
= - 3.7 A
0.070 0.084
Ω
V
GS
= - 4.5 V, I
D
= - 3.2 A
0.090 0.108
V
GS
= - 2.5 V, I
D
= - 2.5 A
0.140 0.175
Forward Transconductance
a
g
fs
V
DS
= - 10 V, I
D
= - 3.7 A
6S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 10 V, V
GS
= 0 V, f = 1 MHz
330
pFOutput Capacitance
C
oss
80
Reverse Transfer Capacitance
C
rss
57
Total Gate Charge
Q
g
V
DS
= - 10 V, V
GS
= - 10 V, I
D
= - 3.7 A
812
nC
V
DS
= - 10 V, V
GS
= - 4.5 V, I
D
= - 3.7 A
46
Gate-Source Charge
Q
gs
0.8
Gate-Drain Charge
Q
gd
1.4
Gate Resistance
R
g
f = 1 MHz 1.2 6 12 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 10 V, R
L
= 3.4 Ω
I
D
- 2.9 A, V
GEN
= - 10 V, R
g
= 1 Ω
36
ns
Rise Time
t
r
10 20
Turn-Off DelayTime
t
d(off)
16 24
Fall Time
t
f
815
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 10 V, R
L
= 3.4 Ω
I
D
- 2.9 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
18 27
Rise Time
t
r
40 60
Turn-Off DelayTime
t
d(off)
18 27
Fall Time
t
f
10 15
Document Number: 68920
S10-0548-Rev. B, 08-Mar-10
www.vishay.com
3
Vishay Siliconix
Si5913DC
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 1.2
A
Pulse Diode Forward Current
I
SM
- 15
Body Diode Voltage
V
SD
I
S
= - 2.9 A, V
GS
= 0 V
- 0.75 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 2.9 A, dI/dt = 100 A/µs, T
J
= 25 °C
23 35 ns
Body Diode Reverse Recovery Charge
Q
rr
14 21 nC
Reverse Recovery Fall Time
t
a
11
ns
Reverse Recovery Rise Time
t
b
12
SCHOTTKY SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Forward Voltage Drop
V
F
I
F
= 1 A
0.42 0.50
V
I
F
= 1 A, T
J
= 125 °C
0.36 0.43
Maximum Reverse Leakage Current
I
rm
V
r
= 5 V
0.015 0.08
mA
V
r
= 5 V, T
J
= 85 °C
0.50 5.00
V
r
= 20 V
0.02 0.10
V
r
= 20 V, T
J
= 85 °C
0.7 7.00
V
r
= 20 V, T
J
= 125 °C
550
Junction Capacitance
C
T
V
r
= 10 V
60
pF

SI5913DC-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -20V Vds 12V Vgs 1206-8 ChipFET
Lifecycle:
New from this manufacturer.
Delivery:
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