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28
Figure 28. Command Resume Clock Normal Operation
The CRD_CLK signal is resumed in the normal operation,
following the Chip Select positive going transition. The
previous halted state is irrelevant and the clock signal is
synchronized with the internal clock divider to avoid non
CRD_CLK 50% duty cycle.
PGM = Low A0 = Low
RESET = High A1 = Low
I/O = Low CS = Low, pulsed
CRD_CLK
C3 Fall
8.255 ns
Cp = 30 pF
CRD_CLK
C3 Rise
7.900 ns
Cp = 30 pF
Figure 29. Card Clock Rise and Fall Time
Since the CRD_CLK signal can generate very fast
transient (i.e. tr = 2.5 ns @ Cp = 10 pF), adapting the design
to cope with the EMV noise specification might be
necessary at final check out. Using an external RC network
is a way to reduce the dv/dt, hence the EMI noise.
Typically, the external series resistor is 10 , the total
capacitance being 30 pF to 50 pF
NCN6000
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Bidirectional Level Shifter
The NCN6000 carries out the voltage difference between
the MPU and the Smart Card I/O signals. When the start
sequence is completed, and if no failures have been detected,
the device becomes essentially transparent for the data
transferred on the I/O line. To fulfill the ISO7816−3
specification, both sides of the I/O line have built in pulsed
circuitry to accelerate the signal rise transient. The I/O line is
connected on both side of the interface by a NMOS switch
which provide the level shifter and, due to its relative high
internal impedance, protects the Smart Card in the event of
data collision. Such a situation could occurs if either the MPU
of the smart card forces a signal in the opposite logic level
direction.
When the CS signal goes High, or if the MPU is running
any of the programming functions, the built in register holds
the previous state presents on the input I/O pin. This
mechanism is useful to force the CRD_IO card pin in either
a High or a Low pre−defined logic state. It is the responsibility
of the programmer to set up the I/O line according to the
system’s activity
Device Q4 provides a low impedance to ground when the
CRD_IO line is deactivated. This mechanism avoids noise
presence on this line during any of the power operation.
When either side of this level shifter is forced to Low, the
externally connected device will be forward biased by the DC
current flowing through the pull up resistors as depicted in
Figure 30. Since these two resistors will carry 350A max
each under the worst case conditions, care must be observed
to make sure the external device will be capable to handle this
level of current. Note: the typical series impedance of the
internal MOS device (Q3, Figure 30) is 400 .
The oscillograms in Figure 31 give the worst case operation
when the stray capacitance is 15 pF.
Q1 Q2
Q3
GND
V
bat
I/O
200 ns
20 k 20 k
CRD_IO
Q4
CRD_VCC
LOGIC
CARD ENABLE
Seq 1
Figure 30. Basic Internal I/O Level Shifter
200 ns
Figure 31. Typical CRD_IO Rise Time
I/O
CRD_IO
CRD_VCC = 5.0 V
Note: The I/O data depends solely upon the smart card ATR
content, the NCN6000 being not involved in these data.
Figure 32. Typical I/O and RST Signals During an ATR Sequence.
CRD_VCC
I/O Card
Answer
Request Sends on
CRD_RST Line
NCN6000
Chip Select
CRD_VCC = 3.0 V
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Input Schmitt Triggers
All the Logic Input pins have built−in Schmitt trigger
circuits to prevent the NCN6000 against uncontrolled
operation. The typical dynamic characteristics of the related
pins are depicted in Figure 33.
The output signal is guaranteed to go High when the input
voltage is above 0.70*Vbat, and will go Low when the input
voltage is below 0.30*Vbat.
The CLOCK_IN pin has been design to provide a 40 MHz
bandwidth clock receiver input, capable to drive the internal
clock divider. This front end circuit yields a constant Duty
Cycle signal, according to the ISO specification, to the
external smart card, even when the NCN6000 division ratio
is 1:1.
Output
V
bat
ON
OFF
V
bat
0.70 *V
bat
Figure 33. Typical Schmitt Trigger Characteristic
Input
0.30 *V
bat
Interrupt Function
The NCN6000 flags the external microprocessor by pulling down the INT signal provided in pin 9. This signal is activated
by one of the here below referenced operations.
Table 6. Interrupt Functions
Pin Related Clear Function STATUS Pin 5
Card Insertion and
Extraction
11 Positive Going Chip Select, or logical
combination of Chip Select Low and
PWR_ON Positive Going
High = Card Presents
Low = No Card Inserted
DC−DC Converter
Overloaded
15 Positive Going Chip Select, or logical
combination of Chip Select Low and
PWR_ON Positive Going
High = DC−DC Operates Normally
Low = Output CRD_VCC Overloaded
Leaving the INT pin Low has no influence on the
NCN6000 internal behavior. It is up to the engineering to
decide when and how the interrupt will be cleared from this
pin. As described before, this can be achieved by either
providing a Chip Select positive transient, or by starting the
DC−DC converter with the standard command PWR_ON =
H and CS =L.

NCN6000DTBG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC SMART CARD COMPACT 20-TSSOP
Lifecycle:
New from this manufacturer.
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