NB3N51054
www.onsemi.com
15
PACKAGE DIMENSIONS
CASE 948H
ISSUE B
DIM
D
MIN MAX
7.90
MILLIMETERS
E1 4.30 4.50
A 1.20
A1 0.05 0.15
L 0.50 0.75
e 0.65 BSC
c 0.09 0.20
b 0.19 0.30
L2 0.25 BSC
M 0 8
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
DAMBAR PROTRUSION SHALL BE 0.08 MAX AT MMC. DAMBAR
CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15
PER SIDE. DIMENSION D IS DETERMINED AT DATUM PLANE H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 PER SIDE. DIMENSION E1 IS DETERMINED
AT DATUM PLANE H.
6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEAT-
ING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.
7.70
---
24X
1.15
24X
0.42
0.65
DIMENSIONS: MILLIMETERS
PITCH
SOLDERING FOOTPRINT*
E 6.40 BSC
6.70
RECOMMENDED
L
L2
GAUGE
DETAIL A
PLANE
C
DETAIL A
M
END VIEW
c
H
0.10
SEATING
PLANE
SIDE VIEW
A
C
0.05 C
C
24X
A1
PIN 1
REFERENCE
D
E1
24X b
e
B
M
0.10 AC
TOP VIEW
B0.15
C
112
1324
A
B
NOTE 3
2X 12 TIPS
E
NOTE 6
NOTE 6
NOTE 4
NOTE 5
S S
S
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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