NB3N51054
www.onsemi.com
7
Table 9. BYTE 4: CONTROLLER REGISTER 4
Bit @Pup Name Description
7 0 Reserved Reserved
6 0 Reserved Reserved
5 0 Reserved Reserved
4 0 Reserved Reserved
3 0 Reserved Reserved
2 0 Reserved Reserved
1 0 Reserved Reserved
0 0 Reserved Reserved
Table 10. BYTE 5: CONTROLLER REGISTER 5
Bit @Pup Name Description
7 0 Reserved Reserved
6 0 Reserved Reserved
5 0 Reserved Reserved
4 0 Reserved Reserved
3 0 Reserved Reserved
2 0 Reserved Reserved
1 0 Reserved Reserved
0 0 Reserved Reserved
Table 11. BYTE 6: CONTROLLER REGISTER 6
Bit @Pup Name Description
7 0 TEST_SEL Reserved
6 0 TEST_MODE Reserved
5 0 Reserved Reserved
4 1 Reserved Reserved
3 0 Reserved Reserved
2 0 Reserved Reserved
1 1 Reserved Reserved
0 1 Reserved Reserved
Table 12. BYTE 7: CONTROLLER REGISTER 7
Bit @Pup Name Description
7 0 Rev Code [3] Revision Code (MSB)
6 0 Rev Code [2] Revision Code
5 0 Rev Code [1] Revision Code
4 1 Rev Code [0] Revision Code (LSB)
3 1 Vendor ID [3] Vendor ID (MSB)
2 1 Vendor ID [2] Vendor ID
1 1 Vendor ID [1] Vendor ID
0 1 Vendor ID [0] Vendor ID (LSB)
NB3N51054
www.onsemi.com
8
Table 13. ATTRIBUTES
Characteristic Value
Internal Pull−up Resistor (SCLK, SDATA)
50 kW
ESD Protection Human Body Model 2 kV
Moisture Sensitivity, Indefinite Time Out of Dray Pack (Note 1) Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 132,000
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 14. ABSOLUTE MAXIMUM RATING (Note 2)
Symbol
Parameter Rating Unit
V
DD
Positive power supply with respect to GND +4.6 V
V
I
Input Voltage with respect to device GND −0.5 V to V
DD
+ 0.5 V V
T
A
Operating Temperature Range −40 to +85 °C
T
STG
Storage temperature −65 to +150 °C
T
SOL
Max. Soldering Temperature (10 sec) 265 °C
q
JA
Thermal Resistance (Junction−to−ambient) 0 lfpm
(Note 3) 500 lfpm
65
57
°C/W
q
JC
Thermal Resistance (Junction−to−case) 50 °C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and not valid simultaneously. If
stress limits are exceeded device functional operation is not implied, damage may occur and reliability may be affected.
3. JEDEC standard multilayer board − 2S2P (2 signal, 2 power).
Table 15. DC ELECTRICAL CHARACTERISTICS (V
DD
= 3.3 V ± 5%, GND = 0 V, T
A
= −40°C to 85°C, Note 4)
Symbol Parameter Min Typ Max Unit
V
DD
Power Supply Voltage 3.135 3.3 3.465 V
I
DD
Power Supply Current, spread OFF, all outputs ON 125 130 mA
I
OFF
Power Supply Current when all outputs are set OFF through I
2
C, spread OFF 50 mA
V
IH
Input HIGH Voltage (XIN/CLKIN) 2.0 V
DD
+ 0.3 V
V
IL
Input LOW Voltage (XIN/CLKIN) GND − 0.3 0.8 V
I
IH
Input HIGH Current (SCLK/SDATA), V
DD
= V
IN
= 3.465 V 10
mA
I
IL
Input LOW Current (SCLK/SDATA), V
DD
= 3.465 V, V
IN
= 0 V −150
mA
V
OH
Output HIGH Voltage for HCSL Output (Note 5) 660 850 mV
V
OL
Output LOW Voltage for HCSL Output (Note 5) −150 mV
V
CROSS
Crossing Voltage Magnitude (Absolute) for HCSL Output (Notes 5, 6, 7) 250 550 mV
DV
CROSS
Change in Magnitude of V
CROSS
for HCSL Output (Notes 5, 6, 8) 150 mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. Measurement taken with outputs terminated with R
S
= 33.2 W, R
L
= 49.9 W, with test load capacitance of 2 pF and current biasing resistor
set at R
REF
= 475 W. See Figure 6. Guaranteed by characterization.
5. Measurement taken from single-ended waveform
6. Measured at crossing point where the instantaneous voltage value of the rising edge of CLKx+ equals the falling edge of CLKx-.
7. Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all crossing points
for this measurement.
8. Defined as the total variation of all crossing voltage of rising CLKx+ and falling CLKx-. This is maximum allowed variance in the V
CROSS
for
any particular system.
NB3N51054
www.onsemi.com
9
Table 16. AC ELECTRICAL CHARACTERISTICS (V
DD
= 3.3 V ± 5%, GND = 0 V, T
A
= −40°C to 85°C, Note 9)
Symbol
Parameter Conditions Min Typ Max Unit
f
CLKIN
Clock/ Crystal Input Frequency 25 MHz
f
CLKOUT
Output Frequency 100 MHz
F
NOISE
Phase Noise Performance
@ 100 Hz offset from carrier −104
dBc/Hz
@ 1 kHz offset from carrier −121
@ 10 kHz offset from carrier −131
@ 100 kHz offset from carrier −136
@ 1 MHz offset from carrier −140
@ 10 MHz offset from carrier −155
t
jit(
f
)
RMS Phase Jitter RMS Phase Jitter, f
CLKIN
= 25 MHz
Crystal, f
CLKOUT
= 100 MHz,
Integration Range: 12 kHz − 20 MHz
0.5 ps
t
JITTER
Peak Cycle−to−Cycle Jitter Measured over 10000 cycles 20 ps
t
F
/ t
R
Rise / Fall Time Measured differentially between
−150 mV to +150 mV
0.6 4.0 V/ns
Dt
F
/ t
R
Output Rise/ Fall Time Variation Measured Single−ended 125 ps
f
MOD
Spread Spectrum Modulation Frequency 30 31.5 33.33 kHz
SSC
RED
Spectral Reduction, 3
rd
Harmonic Measured with frequency spread of
−0.5%
−10 dB
V
MAX
Absolute Maximum Voltage, measured
single ended including undershoot
1150 mV
V
MIN
Absolute Minimum Voltage, measured
single ended including undershoot
−300 mV
t
SKEW
Within device Output to Output Skew All outputs 40 ps
t
SPREAD
Spread Spectrum Transition Time Stabilization Time After Spread
Spectrum Changes
50
ms
t
DC
Output Clock Duty Cycle Measured at cross point 45 50 55 %
t
PLL
PLL Lock Time 50 ms
t
PU
Stabilization Time from Power−up V
DD
= 3.3 V 3.0 ms
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. Measurement taken from differential output on single−ended channel terminated with R
S
= 33.2 W , R
L
= 49.9 W , with test load capacitance
of 2 pF and current biasing resistor set at R
REF
= 475 W . See Figure 6. Guaranteed by characterization.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.

NB3N51054DTG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Generators & Support Products 3.3V, CRYSTAL TO 101 MHZ
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet