17
20 Lead QFN Recommended Stencil Design
A stencil thickness of 2.18mm (6 mils) for this QFN package is recommended
2.18mm
0.8 mm
0.4 mm
Recommendations for Handling and Storage of ADJD-J823
••
••
• Before Opening the MBB (Moisture Barrier Bag)
− The sensor component must be kept sealed in a MBB (Moisture Barrier Bag) stored at 30°C and 70%RH or
less at all times.
− It should also be seal with a moisture absorbent material (Silica Gel) and an indicator card (Cobalt Chloride) to
indicate the moisture within the bag.
• After Opening the MBB (Moisture Barrier Bag)
− The sensor component must be kept at 30°C and 60%RH or less
− The sensor component should have a MET (Manufacturing Exposure Time) of 24 hours starting from the time
of removal from the MBB to the soldering oven.
− If unused sensor component remain, it is recommended to store them back to the MBB.
− If the indicator card has turned from blue to pink or it has exceeded the recommended MET (Manufacturing
Exposure Time) of 24hrs, baking treatment should be performed using the following conditions before
continue to IR reflow soldering.
− Baking treatment: 24 hours at 125°C.
