NXP Semiconductors
PMF170XP
20 V, 1 A P-channel Trench MOSFET
PMF170XP All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 29 October 2013 9 / 15
017aaa309
Q
G
(nC)
0 321
- 2
- 3
- 1
- 4
- 5
V
GS
(V)
0
I
D
= -1.0 A; V
DS
= -10 V; T
amb
= 25 °C
Fig. 14. Gate-source voltage as a function of gate
charge; typical values
017aaa137
V
GS
V
GS(th)
Q
GS1
Q
GS2
Q
GD
V
DS
Q
G(tot)
I
D
Q
GS
V
GS(pl)
Fig. 15. Gate charge waveform definitions
017aaa310
V
SD
(V)
0.0 -1.2-0.8-0.4
-1.0
-0.5
-1.5
-2.0
I
S
(A)
0.0
(1) (2)
V
GS
= 0 V
(1) T
j
= 150 °C
(2) T
j
= 25 °C
Fig. 16. Source current as a function of source-drain voltage; typical values
NXP Semiconductors
PMF170XP
20 V, 1 A P-channel Trench MOSFET
PMF170XP All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 29 October 2013 10 / 15
11. Test information
t
1
t
2
P
t
006aaa812
duty cycle δ =
t
1
t
2
Fig. 17. Duty cycle definition
12. Package outline
04-11-04Dimensions in mm
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0
1.35
1.15
1.3
0.4
0.3
0.25
0.10
1 2
3
Fig. 18. Package outline SC-70 (SOT323)
NXP Semiconductors
PMF170XP
20 V, 1 A P-channel Trench MOSFET
PMF170XP All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 29 October 2013 11 / 15
13. Soldering
solder lands
solder resist
occupied area
solder paste
sot323_fr
2.65
2.35
0.6
(3×)
0.5
(3×)
0.55
(3×)
1.325
1.85
1.3
3
2
1
Dimensions in mm
Fig. 19. Reflow soldering footprint for SC-70 (SOT323)
sot323_fw
3.65 2.1
1.425
(3×)
4.6
09
(2×)
2.575
1.8
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mm
Fig. 20. Wave soldering footprint for SC-70 (SOT323)

PMF170XP,115

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET P-CH -20 V -1 A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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