MMG3011NT1
13
RF Device Data
Freescale Semiconductor, Inc.
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
AN3100: General Purpose Amplifier and MMIC Biasing
Software
.s2p File
Development Tools
Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to
Software & Tools on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision Date Description
3 Mar. 2007 Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS
compliant part numbers, pp. 6, 7
4 July 2007 Replaced Case Outline 1514--01 with 1514--02, Issue D, pp. 1, 11--13. Case updated to add missing
dimension for Pin 1 and Pin 3.
5 Mar. 2008 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 5
Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, pp. 8, 9
6 Feb. 2012 Corrected temperature at which ThetaJC is measured from 25Cto87C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production. ESD
ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive
devices, p. 3
Removed I
CC
bias callout from applicable graphs and Table 10, Common Emitter S--Parameters heading
as bias is not a controlled value, pp. 4--9
Added .s2p File availability to Product Software and Printed Circuit Boards to Development Tools, p. 14
7 Sept. 2014 Added Fig. 21, Product Marking, p. 9
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
