NXP Semiconductors
TJA1102
100BASE-T1 Dual PHY for Automotive Ethernet
© NXP Semiconductors N.V. 2017. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 November 2017
Document identifier: TJA1102_SDS
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
2.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2 Optimized for automotive use cases. . . . . . . . . 1
2.3 Low-power mode . . . . . . . . . . . . . . . . . . . . . . . 1
2.4 Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.5 Miscellaneous. . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Functional description . . . . . . . . . . . . . . . . . . . 5
5.1 System configuration . . . . . . . . . . . . . . . . . . . . 5
5.1.1 Clocking scheme with MII and clock provided by
the switch and one of the TJA1102 devices . . . 6
5.1.2 Clocking scheme with RMII and clock provided by
the switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2 MII and RMII. . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2.1 MII. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2.2 RMII . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2.2.1 Signaling and encoding . . . . . . . . . . . . . . . . . . 8
5.2.3 Reverse MII . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.3 Sleep and wake-up forwarding concept . . . . . 10
6 Application information. . . . . . . . . . . . . . . . . . 11
7 Package information . . . . . . . . . . . . . . . . . . . . 12
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
9 Soldering of SMD packages . . . . . . . . . . . . . . 14
9.1 Introduction to soldering . . . . . . . . . . . . . . . . . 14
9.2 Wave and reflow soldering . . . . . . . . . . . . . . . 14
9.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 14
9.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 15
10 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
13 Contact information. . . . . . . . . . . . . . . . . . . . . 18
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
