
DATA SHEET • SE2611T 2.4 GHZ HIGH EFFICIENCY WIRELESS LAN/BT FRONT END
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
6 May 30, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202404B
Table 10. SE2611T Electrical Specifications: 2.4 GHz Receive Characteristics
(V
CC = 3.3 V, LEN = CRX = CBTR = 3.3 V, PEN = CBTB = CTX = 0 V, TA = +25 C, as Measured on Skyworks Solutions’ SE2611T-EK1
Evaluation Board, All Unused Ports Terminated with 50 , Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typ Max Units
Frequency range fOUT 2400 2500 MHz
Receive gain, LNA enabled. S21
(BT + WLAN) Rx, high gain 11
13 15 dB
WLAN Rx, high gain only,
LEN = CRX = 3.3 V,
PEN = CBTB = CTX =CBTR= 0 V
14 16 18 dB
Gain variation ∆S21 2400 2485 MHz, over any 20 MHz band 0.5 dB
Noise figure NF 2.0 2.5 dB
Third order intercept IIP3 3 dBm
Input return loss S11 8 dB
Reverse isolation S12 20 dB
Input P1dB IP1dB CW 8 dBm
Enable time tEN
10% to 90% of RX RF power,
from time that LEN is at 50%
500 ns
Receive gain, LNA bypassed S21_BYP LEN = 0 V 20 10 dB
Input return loss, LNA bypassed S11_BYP LEN = 0 V 7 dB
Switch isolation ISOLSW
CBTB = CBTR = Low, CRX = High,
ANT_BT + BT_RX
20
dB
Package Dimensions
The PCB layout footprint for the SE2611T is provided in
Figure 4. Typical case markings are shown in Figure 5. Package
dimensions for the 20-pin QFN are shown in Figure 6, and carrier
tape dimensions are provided in Figure 7.
Package and Handling Information
Because of its sensitivity to moisture absorption, instructions on
the shipping container label regarding exposure to moisture after
the container seal is broken must be followed. Otherwise,
problems related to moisture absorption may occur when the part
is subjected to high temperature during solder assembly.
The SE2611T is rated to Moisture Sensitivity Level 1 (MSL1) at
260 C. It is capable of withstanding a Pb-free solder reflow. For
additional information, refer to the Skyworks Application Note,
Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment. If the
part is manually attached, precaution should be taken to insure
that the device is not subjected to temperatures above its rated
peak temperature for an extended period of time. For details on
both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to the
following Skyworks Application Notes:
QFN Solder Reflow and Rework Information Application Note,
document number QAD-00045.
Handling, Packing, Shipping and Use of Moisture Sensitive
QFN Application Note, document number QAD-00044.
Production quantities of this product are shipped in a standard
tape and reel format.