DXP18BN5014HL

SpecNo.JEFK243A-0002G-01
P1/9
MURATA MFG.CO.,LTD
Reference Only
(6) (5) (4)
(1) (2) (3)
1.6±0.1
0.2±0.1 0.4±0.1
0.3±0.1
0.8±0.1
0.45±0.1
0.15±0.1
(Top View)
Polarity
Marking
(Bottom View)
(inmm)
: Electrode
Micro Chip Transformer DXP18BN□□□□□□
Reference Specification
1. Scope
This reference specification applies to Micro Chip Transformer DXP18BN Series.
2. Part Numbering
(ex.) DX P 18 B N 50 14 T L
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1) Micro Chip Transformer
(2) Structure (P: Film Type)
(3) Dimension (L×W)
(4) Type of Transformer (B: Balun)
(5) Category
3. Electrical Specification
Customer
Part Number
Murata
Part Number
Freq.
Range
[MHz]
input-output
Impedance
[ohm]
Insertion Loss
[dB max.]
CMRR
[dB min.]
Rated
Power
[dBm]
DXP18BN5014TL
50-870 50-200 1.5
25 20
DXP18BN5014TB
DXP18BN5014HL
470-790 50-200 1.2
DXP18BN5014HB
DXP18BN5016DL
470-870
50-300 1.2
DXP18BN5016DB
DXP18BN7514TL
50-870 75-300 1.5
DXP18BN7514TB
Operating Temperature : -40 to +85°C Storage Temperature : -40 to +85°C
4. Standard Testing Condition
<
Unless otherwise specified> <In case of doubt>
Temperature : Ordinary Temperature 15 to 35°C Temperature : 20 ± 2°C
Humidity : Ordinary Humidity 25 to 85%(RH) Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
5. Style and Dimensions
Dimension Eqivalent Circuit
Unit Mass (typ.)
0.003g
(6) Port Impedance (50:50ohm / 75: 75ohm)
(7) Impedance ratio (14: one to four)
(8) Main Application (:50870MHz/:470790MHz/D:470870MHz)
(9) Packing Code L:Taping / B:Bulk
(4)B2
(3)GND
(2)NC
(6)B1
(1)UB
(5)GND
SpecNo.JEFK243A-0002G-01
P2/9
MURATA MFG.CO.,LTD
Reference Only
NC (Non-Contact) Terminal
Don't connect NC terminal with any signal lines/GND lines on the circuit board.
6. Marking
Polarity Marking is on the upper surface of a Product.
7. Electrical Performance
No. Item Specification Definition and Measurement Method
7.1 Insertion
Loss
(IL)
Meet item 3.
Insertion Loss is given by Sds21 mag extracted from the below circuit.
Port Impedance [ohm]
Port1 Port2 Port3
5014H 50 100 100
5014T 50 100 100
5016D 50 150 150
7514T 75 150 150
IL[dB] = 20log
10
(Sds21)
Where
Sds21 is S-parameter of single mode stimulus - Differential mode response
Parasitics and loss factors caused by the test board have to be removed.
7.2 CMRR
Meet item 3. CMRR is given by the following equation, S-parameters are extracted from
the below circuit.
Port Impedance [ohm]
Port1 Port2 Port3
5014H 50 100 100
5014T 50 100 100
5016D 50 150 150
7514T 75 150 150
CMRR[dB] = 20log10(Sds21/Scs21)=20log10{(S21+S31)/(S21-S31)}
Where
Sds21 is S-parameter of single mode stimulus - Differential mode response
Scs21 is S-parameter of single mode stimulus - Common mode response
Parasitics and loss factors caused by the test board have to be removed.
Port2
Port1
Port3
UB
GN
D
NC
B1
GND
B2
Port2
Port1
Port3
UB
GN
D
NC
B1
GND
B2
SpecNo.JEFK243A-0002G-01
P3/9
MURATA MFG.CO.,LTD
Reference Only
8. Mechanical Performance
No. Item Specification Test Method
8.1 Appearance
and
Dimensions
Meet all dimension on item 5. Visual Inspection and measurement with microscope.
8.2 Solderability
The electrodes shall be at least
95% covered with new solder
coating.
Flux:Ethanol solution of rosin,25(wt)%
Pre-Heating : 150±10°C 60s to 90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240±5°C
Immersion Time : 3±1 seconds
Immersion and emersion rates : 25mm/s
8.3 Resistance
to Soldering
Heat
Meet Table 1.
Table 1
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : : 150±10°C 60s to 90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 10±1 seconds
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room
condition for 4 to 48 hours.
8.4
Drop It shall be dropped on concrete or steel board.
Method : free fall
Height : 1 m
The Number of Times : 3 times
8.5 Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10 to 2000 to 10Hz
for 15 minutes
Total Amplitude 3.0mm or Acceleration 196m/s
2
whichever is smaller
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions. (Total 6 hours)
8.6
Bending
Strength
It shall be soldered on the Glass-epoxy substrate.
Deflection : 3mm (t=1.0mm).
Keeping time : 5 seconds
Speed of Applying Force : 0.5mm/s
(in mm)
9. Environmental Performance(Products shall be soldered on the substrate.)
No. Item Specification Test Method
9.1 Temperature
Cycle
Meet Table 1. 1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2 Ordinary Temp. / within 3 min
Step 3 +85(+3°C,-0°C) / 30(+3,-0) min
Step 4 Ordinary Temp. / within 3 min
Total of 100 cycles.
Then measured after exposure in the room condition for
4 to 48 hours.
9.2
Humidit
y
Temperature : 70±2°C
Humidity : 90~95%(RH)
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
9.3 Heat
Resistance
Temperature : 85±2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
9.4 Cold
Resistance
Tempe
r
ature : -40± 2°C
Time : 1000(+48 hours,-0 hours)
Then measured after exposure in the
room condition for 4 to 48 hours.
Appearance No damaged
IL
Meet Item 3.
CMRR
45
R230
F
Deflection
45
Product
Pressure jig

DXP18BN5014HL

Mfr. #:
Manufacturer:
Description:
Signal Conditioning 0603 50ohm Balun
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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