DXP18BN5014HL

SpecNo.JEFK243A-0002G-01
P7/10
MURATA MFG.CO.,LTD
Reference Only
13.3 Standard Land Dimensions (Reflow)
(in mm)
13.4 Assembling
<Thermal Shock>
Pre-heating should be in such a way that the temperature difference between solder and
ceramic surface is limited to 100°C MAX. Also cooling into solvent after soldering
should be in such a way that the temperature difference is limited to 100°C max.
13.5 Standard Soldering Condition
(1) Soldering Condition
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C10s
Cycle of reflow 2 times 2 times
(2) Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being
mounted by reflow soldering.
Tip temperature / Soldering time : 350°C max / 3(+1,-0)s
Soldering iron output :30W max
Tip diameter : φ3mm
Reworking should be limited to 2 times.
Notes: Do not touch the products directly with the soldering iron.
150
90s±30s
Time(s)
245±3℃
Tem
p
.
(℃)
220℃
30~60s
180
260℃/10s
230℃
60s max.
Limit Profile
Standard Profile
Resis
Co
pp
er foil
p
attern
1.30
0.40
0.20
0.40
0.20
0.45
No
p
attern
SpecNo.JEFK243A-0002G-01
P8/10
MURATA MFG.CO.,LTD
Reference Only
Pick-up nozzle
Support pin
P.C.B.
Product
(3) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
13.6 Resin coating
The electric characteristics may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you
select resin. In prior to use, please make the reliability evaluation with the product mounted in your application
set.
13.7 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
Products direction
Products shall be location the sideways
Direction (Length : a<b) to the machanical
Stress.
Wraping direction
Products(wraping direction 1, wraping direction
2) shall be located carefully so that products are
not subjected to the mechanical stress due to
warping the board. Because they may be
subjected the mechanical stress in order of
wraping direction 1
>wraping direction 2.
(2)Products location on P.C.B. separation
Products(A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
>C>B D.
13.8 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are far from the portion
of perforation.
The portion of perforation shall be designed as narrow as possible
and shall be designed so as not to be applied the stress in the case
of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when
there are big holes in P.C.B. (Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B.
during placing the products on the other side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
×
Upper limit
t
1/3 T t T (T:thickness of electrodes)
Recommendable
Upper limit
Recommendable
Poor example
Good example
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
<
b
b
a
b
a
Wraping direction 1
Wraping direction 2
SpecNo.JEFK243A-0002G-01
P9/10
MURATA MFG.CO.,LTD
Reference Only
13.9 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
Power : 20W/ l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner Isopropyl alcohol (IPA)
2. Aqueous agent PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
13.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
13.11 Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such
as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
13.12 Storage Condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
·Products should be stored in the warehouse on the following conditions.
Temperature -10 ~ +40°C
Humidity 15 to 85% relative humidity No rapid change on temperature and humidity.
· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration. Poor solderability due to the oxidized electrode.
· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14.
!
Notes
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

DXP18BN5014HL

Mfr. #:
Manufacturer:
Description:
Signal Conditioning 0603 50ohm Balun
Lifecycle:
New from this manufacturer.
Delivery:
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