BSP316PH6327XTSA1 Datasheet BSP316PH6327XTSA1 | P7-P9

BSP316P

13 Typ. gate charge

= f (Q

Gate

)

parameter: I

= -0.68 A pulsed, T

= 25 °C

0 1 2 3 4 5 6 7

8.5

-2

-4

-6

-8

-10

-12

-16

0.2

DS max

0.5

DS max

0.8 V

DS max

14 Drain-source breakdown voltage

(BR)DSS

= f (T

)

-60 -20 20 60 100

°C

180

-90

-92

-94

-96

-98

-100

-102

-104

-106

-108

-110

-112

-114

-120

(BR)DSS

2016-05-30

Rev.2.0 Page 7

Package Outline SOT-223

Footprint

Soldering type: Reflow soldering Soldering type: Wave soldering

Tape and Reel

Dimensions in mm

BSP316P

2016-05-30

Rev.2.0 Page 8

-100VSIPMOSSmallSignalTransistor

BSP316P

Rev.2.0,2016-06-10

RevisionHistory

BSP316P

Revision:2016-06-10,Rev.2.0

Previous Revision

Revision Date Subjects (major changes since last revision)

2.0

2016-06-10

Release of final version

TrademarksofInfineonTechnologiesAG

AURIX™,C166™,CanPAK™,CIPOS™,CoolGaN™,CoolMOS™,CoolSET™,CoolSiC™,CORECONTROL™,CROSSAVE™,DAVE™,DI-POL™,DrBlade™,

EasyPIM™,EconoBRIDGE™,EconoDUAL™,EconoPACK™,EconoPIM™,EiceDRIVER™,eupec™,FCOS™,HITFET™,HybridPACK™,Infineon™,

ISOFACE™,IsoPACK™,i-Wafer™,MIPAQ™,ModSTACK™,my-d™,NovalithIC™,OmniTune™,OPTIGA™,OptiMOS™,ORIGA™,POWERCODE™,

PRIMARION™,PrimePACK™,PrimeSTACK™,PROFET™,PRO-SIL™,RASIC™,REAL3™,ReverSave™,SatRIC™,SIEGET™,SIPMOS™,SmartLEWIS™,

SOLIDFLASH™,SPOC™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™.

TrademarksupdatedAugust2015

OtherTrademarks

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P1-P3 P4-P6 P7-P9

BSP316PH6327XTSA1

Mfr. #:

Buy BSP316PH6327XTSA1

Manufacturer:

Infineon Technologies

Description:

MOSFET P-Ch -100V -680mA SOT-223-3

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

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Products related to this Datasheet

BSP316PH6327XTSA1