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LTC1850/LTC1851
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CH0 to CH7 (Pins 1 to 8): Analog Input Pins. Input pins can
be used single ended relative to the analog input common
pin (COM) or differentially in pairs (CH0 and CH1, CH2 and
CH3, CH4 and CH5, CH6 and CH7).
COM (Pin 9): Analog Input Common Pin. For single-ended
operation (DIFF = 0), COM is the “–” analog input. COM is
disabled when DIFF is high.
REFOUT (Pin 10): Internal 2.5V Reference Output. Re-
quires bypass to analog ground plane with 1µF.
REFIN (Pin 11): Reference Mode Select/Reference Buffer
Input. REFIN selects the Reference mode and acts as the
reference buffer Input. REFIN tied to ground will produce
2.048V on the REFCOMP pin. REFIN tied to the positive
supply disables the reference buffer to allow REFCOMP to
be driven externally. For voltages between 1V and 2.6V,
the reference buffer produces an output voltage on the
REFCOMP pin equal to 1.6384 times the voltage on REFIN
(4.096V on REFCOMP for a 2.5V input on REFIN).
REFCOMP (Pin 12): Reference Buffer Output. REFCOMP
sets the full-scale input span. The reference buffer pro-
duces an output voltage on the REFCOMP pin equal to
1.6384 times the voltage on the REFIN pin (4.096V on
REFCOMP for a 2.5V input on REFIN). REFIN tied to
ground will produce 2.048V on the REFCOMP pin.
REFCOMP can be driven externally if REFIN is tied to the
positive supply. Requires bypass to analog ground plane
with 10µF tantalum in parallel with 0.1µF ceramic or 10µF
ceramic.
GND (Pin 13): Ground. Tie to analog ground plane.
V
DD
(Pin 14): 5V Supply. Short to Pin 15.
V
DD
(Pin 15): 5V Supply. Bypass to GND with 10µF
tantalum in parallel with 0.1µF ceramic or 10µF ceramic.
GND (Pin 16): Ground for Internal Logic. Tie to analog
ground plane.
DIFF
OUT
/S6 (Pin 17): Three-State Digital Data Output.
Active when RD is low. Following a conversion, the single-
ended/differential bit of the present conversion is available
on this pin concurrent with the conversion result. In
Readback mode, the single-ended/differential bit of the
current sequencer location (S6) is available on this pin.
The output swings between OV
DD
and OGND.
A2
OUT
/S5, A1
OUT
/S4, A0
OUT
/S3 (Pins 18 to 20): Three-
State Digital MUX Address Outputs. Active when RD is
low. Following a conversion, the MUX address of the
present conversion is available on these pins concurrent
with the conversion result. In Readback mode, the MUX
address of the current sequencer location (S5-S3) is
available on these pins. The outputs swing between OV
DD
and OGND.
D9/S2 (Pin 21, LTC1850): Three-State Digital Data Out-
put. Active when RD is low. Following a conversion, bit 9
of the present conversion is available on this pin. In
Readback mode, the unipolar/bipolar bit of the current
sequencer location (S2) is available on this pin. The output
swings between OV
DD
and OGND.
D11/S2 (Pin 21, LTC1851): Three-State Digital Data Out-
put. Active when RD is low. Following a conversion, bit 11
of the present conversion is available on this pin. In
Readback mode, the unipolar/bipolar bit of the current
sequencer location (S2) is available on this pin. The output
swings between OV
DD
and OGND.
D8/S1 (Pin 22, LTC1850): Three-State Digital Data Out-
puts. Active when RD is low. Following a conversion, bit 8
of the present conversion is available on this pin. In
Readback mode, the gain bit of the current sequencer
location (S1) is available on this pin. The output swings
between OV
DD
and OGND.
D10/S1 (Pin 22, LTC1851): Three-State Digital Data Out-
puts. Active when RD is low. Following a conversion, bit 10
of the present conversion is available on this pin. In
Readback mode, the gain bit of the current sequencer
location (S1) is available on this pin. The output swings
between OV
DD
and OGND.
D7/S0 (Pin 23, LTC1850): Three-State Digital Data Out-
puts. Active when RD is low. Following a conversion, bit 7
of the present conversion is available on this pin. In
Readback mode, the end of sequence bit of the current
sequencer location (S0) is available on this pin. The output
swings between OV
DD
and OGND.
11
LTC1850/LTC1851
18501f
D9/S0 (Pin 23, LTC1851): Three-State Digital Data Out-
puts. Active when RD is low. Following a conversion, bit 9
of the present conversion is available on this pin. In
Readback mode, the end of sequence bit of the current
sequencer location (S0) is available on this pin. The output
swings between OV
DD
and OGND.
D6 to D0 (Pins 24 to 30, LTC1850): Three-State Digital
Data Outputs. Active when RD is low. The outputs swing
between OV
DD
and OGND.
D8 to D0 (Pins 24 to 32, LTC1851): Three-State Digital
Data Outputs. Active when RD is low. The outputs swing
between OV
DD
and OGND.
NC (Pins 31, 32, LTC1850): No Connect. There is no
internal connection to these pins.
BUSY (Pin 33): Converter Busy Output. The BUSY output
has two functions. At the start of a conversion, BUSY will
go low and remain low until the conversion is completed.
The rising edge may be used to latch the output data. BUSY
will also go low while the part is in Program/Readback
mode (M1 high, M0 low) and remain low until M0 is
brought back high. The output swings between OV
DD
and
OGND.
OGND (Pin 34): Digital Data Output Ground. Tie to analog
ground plane. May be tied to logic ground if desired.
OV
DD
(Pin 35): Digital Data Output Supply. Normally tied
to 5V, can be used to interface with 3V digital logic. Bypass
to OGND with 10µF tantalum in parallel with 0.1µF ceramic
or 10µF ceramic. See Table 5.
M0 (Pin 36): Mode Select Pin 0. Used in conjunction with
M1 to select operating mode. See Table 5
PGA (Pin 37): Gain Select Input. A high logic level selects
gain = 1, a low logic level selects gain = 2.
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UNI/BIP (Pin 38): Unipolar/Bipolar Select Input. Logic low
selects a unipolar input span, a high logic level selects a
bipolar input span.
A0 to A2 (Pins 39 to 41): MUX Address Input Pins.
DIFF (Pin 42): Single-Ended/Differential Select Input. A
low logic level selects single-ended mode, a high logic
level selects differential mode.
WR (Pin 43): Write Input. In Direct Address mode, WR low
enables the MUX address and configuration input pins
(Pins 37 to 42). WR can be tied low or the rising edge of
WR can be used to latch the data. In Program mode, WR
is used to program the sequencer. WR low enables the
MUX address and configuration input pins (Pins 37 to 42).
The rising edge of WR latches the data and increments the
counter to the next sequencer location.
RD (Pin 44): Read Input. During normal operation, RD
enables the output drivers when CS is low. In Readback
mode (M1 high, M0 low), RD going low reads the current
sequencer location, RD high advances to the next sequencer
location.
CONVST (Pin 45): Conversion Start Input. This active low
signal starts a conversion on its falling edge.
CS (Pin 46): Chip Select Input. The chip select input must
be low for the ADC to recognize the CONVST and RD
inputs. If SHDN is low, a low logic level on CS selects Nap
mode; a high logic level on CS selects Sleep mode.
SHDN (Pin 47): Power Shutdown Input. A low logic level
will invoke the Shutdown mode selected by the CS pin. CS
low selects Nap mode, CS high selects Sleep mode. Tie
high if unused.
M1 (Pin 48): Mode Select Pin 1. Used in conjunction with
M0 to select operating mode.
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LTC1850/LTC1851
18501f
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PI FU CTIO S
NOMINAL (V) ABSOLUTE MAXIMUM (V)
PIN NAME DESCRIPTION MIN TYP MAX MIN MAX
1 to 8 CH0 to CH7 Analog Inputs 0 V
DD
0.3 V
DD
+ 0.3
9 COM Analog Input Common Pin 0 V
DD
0.3 V
DD
+ 0.3
10 REFOUT 2.5V Reference Output 2.5 0.3 V
DD
+ 0.3
11 REFIN Reference Buffer Input 0 2.5 V
DD
0.3 V
DD
+ 0.3
12 REFCOMP Reference Buffer Output 4.096 0.3 V
DD
+ 0.3
13 GND Ground, Substrate Ground 0 0.3 V
DD
+ 0.3
14 V
DD
Supply 4.75 5 5.25 0.3 6
15 V
DD
Supply 4.75 5 5.25 0.3 6
16 GND Ground 0 0.3 V
DD
+ 0.3
17 DIFF
OUT
/S6 Single-Ended/Differential Output OGND OV
DD
0.3 V
DD
+ 0.3
18 A2
OUT
/S5 MUX Address Output OGND OV
DD
0.3 V
DD
+ 0.3
19 A1
OUT
/S4 MUX Address Output OGND OV
DD
0.3 V
DD
+ 0.3
20 A0
OUT
/S3 MUX Address Output OGND OV
DD
0.3 V
DD
+ 0.3
21 D9/S2 (LTC1850) Data Output OGND OV
DD
0.3 V
DD
+ 0.3
21 D11/S2 (LTC1851) Data Output OGND OV
DD
0.3 V
DD
+ 0.3
22 D8/S1 (LTC1850) Data Output OGND OV
DD
0.3 V
DD
+ 0.3
22 D10/S1 (LTC1851) Data Output OGND OV
DD
0.3 V
DD
+ 0.3
23 D7/S0 (LTC1850) Data Output OGND OV
DD
0.3 V
DD
+ 0.3
23 D9/S0 (LTC1851) Data Output OGND OV
DD
0.3 V
DD
+ 0.3
24 to 30 D6 to D0 (LTC1850) Data Outputs OGND OV
DD
0.3 V
DD
+ 0.3
24 to 32 D8 to D0 (LTC1851) Data Outputs OGND OV
DD
0.3 V
DD
+ 0.3
31 to 32 NC (LTC1850)
33 BUSY Converter Busy Output OGND OV
DD
0.3 V
DD
+ 0.3
34 OGND Output Ground 0 0.3 V
DD
+ 0.3
35 OV
DD
Output Supply 2.7 5 5.25 0.3 6
36 M0 Mode Select Pin 0 0 V
DD
0.3 10
37 PGA Gain Select Input 0 V
DD
0.3 10
38 UNI/BIP Unipolar/Bipolar Input 0 V
DD
0.3 10
39 to 41 A0 to A2 MUX Address Inputs 0 V
DD
0.3 10
42 DIFF Single-Ended/Differential Input 0 V
DD
0.3 10
43 WR Write Input, Active Low 0 V
DD
0.3 10
44 RD Read Input, Active Low 0 V
DD
0.3 10
45 CONVST Conversion Start Input, Active Low 0 V
DD
0.3 10
46 CS Chip Select Input, Active Low 0 V
DD
0.3 10
47 SHDN Shutdown Input, Active Low 0 V
DD
0.3 10
48 M1 Mode Select Pin 1 0 V
DD
0.3 10

LTC1850IFW#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 10-bit, 8-ch. Parallel 1.25Msps ADC
Lifecycle:
New from this manufacturer.
Delivery:
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