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LTC1850/LTC1851
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In slow memory mode, the processor applies a logic low
to RD ( = CONVST), starting the conversion.
BUSY goes
low, forcing the processor into a Wait state.
The previous
conversion result appears on the data outputs.
When the
conversion is complete, the new conversion results ap-
pear on the data outputs; BUSY goes high releasing the
processor, and the processor takes RD ( = CONVST) back
high and reads the new conversion data.
In ROM mode, the processor takes RD ( = CONVST) low,
starting a conversion and reading the previous conversion
result.
After the conversion is complete, the processor can
read the new result and initiate another conversion.
MODES OF OPERATION
Direct Address Mode
The simplest mode of operation is the Direct Address
mode. This mode is selected when both the M1 and M0
pins are low. In this mode, the address input pins directly
control the MUX and the configuration input pins directly
control the input span. The address and configuration
input pins are enabled when WR is low. WR can be tied low
if the pins will be constantly driven or the rising edge of WR
can be used to latch and hold the inputs for as long as WR
is held high.
Scan Mode
Scan mode is selected when M1 is low and M0 is high. This
mode allows the converter to scan through all of the input
channels sequentially and repeatedly without the user
having to provide an address. The address input pins (A2
to A0) are ignored but the DIFF, PGA and UNI/BIP pins are
still enabled when WR is low. As in the direct address
mode, WR can be held low or the rising edge of WR can be
used to latch and hold the information on these pins for as
long as WR is held high. The DIFF pin selects the scan
pattern. If DIFF is held low, the scan pattern will consist of
all eight channels in succession, single-ended relative to
COM (CH0-COM, CH1-COM, CH2-COM, CH3-COM,
CH4-COM, CH5-COM, CH6-COM, CH7-COM, repeat). At
the maximum conversion rate the throughput rate for each
channel would be 1.25Msps/8 or 156.25ksps. If DIFF is
held high, the scan pattern will consist of four differential
pairs (CH0-CH1, CH2-CH3, CH4-CH5, CH6-CH7, repeat).
At the maximum conversion rate, the throughput rate for
each pair would be 1.25Msps/4 or 312.5ksps. It is pos-
sible to drive the DIFF input pin while the part is in Scan
mode to achieve combinations of single-ended and differ-
ential inputs. For instance, if the A0
OUT
pin is tied to the
DIFF input pin, the scan pattern will consist of four single-
ended inputs and two differential pairs (CH0-COM single-
ended, CH1-COM single-ended, CH2-CH3 differential,
CH4-COM single-ended, CH5-COM single-ended, CH6-
CH7 differential, repeat).
The scan counter is reset to zero whenever the M0 pin
changes state so that the first conversion after M0 rises
will be MUX Address 000 (CH0-COM single-ended or CH0-
CH1 differential depending on the state of the DIFF pin). A
conversion is initiated by the falling edge of CONVST. After
each conversion, the address counter is advanced (by one
if DIFF is low, by two if DIFF is high) and the MUX address
for the present conversion is available on the address
output pins (DIFF
OUT
, A2
OUT
to A0
OUT
) along with the
conversion result.
Program/Readback Mode
The
LTC1850/
LTC1851 include a sequencer that can be
programmed to run a sequence of up to 16 locations
containing a MUX address and input configuration. The
MUX address and input configuration for each location are
programmed using the DIFF, A2 to A0, UNI/BIP and PGA
pins and are stored in memory along with an end-of-
sequence (EOS) bit that is generated automatically. The
six input address and configuration bits plus the EOS bit
can be read back by accessing the 7-bit readback status
word (S6-S0) through the data output pins. The sequencer
memory is a 16 × 7 block of memory represented by the
block diagram in Figure 10.
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LTC1850/LTC1851
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The sequencer is accessed by taking the M1 mode pin
high. With M1 high, the sequencer memory is accessed by
taking the M0 mode pin low. This will cause BUSY to go
low, disabling conversions during the programming and
readback of the sequencer. The sequencer is reset to
location 0000 whenever M1 or M0 changes state. One of
these signals should be cycled prior to any read or write
operation to guarantee that the sequencer will be pro-
grammed or read starting at location 0000.
The sequencer is programmed sequentially starting from
location 0000. RD and WR should be held high, the
appropriate signals applied to the DIFF pin, the A2 to A0
MUX address pins, the UNI/BIP pin and the PGA pin and
WR taken low to write to the memory. The rising edge of
WR will latch the data into memory and advance the
pointer to the next sequencer location. Up to 16 locations
can be programmed and the last location written before
M0 is taken back high will be the last location in the
sequence. After 16 writes, the pointer is reset to location
0000 and any subsequent writes will overwrite the previ-
ous contents and start a new sequence.
The sequencer memory can be read by holding WR high
and driving RD. Taking RD low accesses the sequencer
memory and enables the data output pins. The sequencer
should be reset to location 0000 (by pulsing M0 high)
before beginning a read operation. The seven output bits
will be available on the DIFF
OUT
/S6, A2
OUT
/S5, A1
OUT
/S4,
A0
OUT
/S3, D11/S2, D10/S1 and D9/S0 pins (LTC1851) or
DIFF
OUT
/S6, A2
OUT
/S5, A1
OUT
/S4, A0
OUT
/S3, D9/S2, D8/
S1 and D7/S0 pins (LTC1850). The D8 to D0 (LTC1851) or
D6 to D0 (LTC1850) data output pins will remain high
impedance during readback. RD going high will return the
data output pins to a high impedance state and advance the
pointer to the next location. A logic 1 on the D9/S0 (or D7/
S0) pin indicates the last location in the current sequence
but all 16 locations can be read by continuing to clock RD.
After 16 reads, the pointer is reset to location 0000. When
all programming and/or reading of the sequencer memory
is complete, M0 is taken high. BUSY will come back high
enabling CONVST and indicating that the part is ready to
start a conversion.
LOCATION 0000
S6
DIFF
S5
A2
S4
A1
S3
A0
S2
UNI/BIP
S1
PGA
S0
EOS
LOCATION 0001
LOCATION 0010
LOCATION 1110
LOCATION 1111
1851 F10
Figure 10. Sequencer Memory Block Diagram
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LTC1850/LTC1851
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Table 5
OPERATION MODE M1 M0 WR RD COMMENTS
Direct Address 0 0 0 OE Address and Configuration are Driven from External Pins
0 0 OE Address and Configuration are Latched on Rising Edge of WR or Falling Edge of CONVST
Scan 0 1 0 OE Address is Provided by Internal Scan Counter, Configuration is Driven from External Pins
0 1 OE Configuration is Latched on Rising Edge of WR or Falling Edge of CONVST
Program 1 0 1 Write Sequencer Location, WR Low Enables Inputs, Rising Edge of WR Latches Data and
Advances to Next Location
Readback 1 0 1 Read Sequencer Location, Falling Edge of RD Enables Output, Rising Edge of RD
Advances to Next Location
Sequence Run 1 1 X OE Run Programmed Sequence, Falling Edge of CONVST Starts Conversion and Advances to
Next Location
Sequence Run Mode
Once the sequencer is programmed, M0 is taken high.
BUSY will also come back high enabling CONVST and the
next falling CONVST will begin a conversion using the
MUX address and input configuration stored in location
0000 of the sequencer memory. After each conversion, the
sequencer pointer is advanced by one and the MUX
address (the actual channel or channels being converted,
not the sequencer pointer) for the present conversion is
available on the address output pins along with the con-
version result. When the sequencer finishes converting
the last programmed location, the sequencer pointer will
return to location 0000 for the next conversion. The
sequencer will also reset to location 0000 anytime the M1
or M0 pin changes state.
The contents of the sequencer memory will be retained as
long as power is continuously applied to the part. This
allows the user to switch from Sequence Run mode to
either Direct Address or Scan Mode and back without
losing the programmed sequence. The part can also be
disabled using CS or shutdown in Nap or Sleep mode
without losing the programmed sequence. Table 5 out-
lines the operational modes of the
LTC1850/
LTC1851.
Figures 11 and 12 show the timing diagrams for writing to,
reading from and running a sequence with the LTC1850/
LTC1851.
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LTC1850IFW#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 10-bit, 8-ch. Parallel 1.25Msps ADC
Lifecycle:
New from this manufacturer.
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