NCP5424
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10
DESIGN GUIDELINES
Definition of the design specifications
The output voltage tolerance can be affected by any or all
of the following:
1. buck regulator output voltage setpoint accuracy;
2. output voltage change due to discharging or charging
of the bulk decoupling capacitors during a load
current transient;
3. output voltage change due to the ESR and ESL of the
bulk and high frequency decoupling capacitors,
circuit traces, and vias;
4. output voltage ripple and noise.
Budgeting the tolerance is left to the designer who must
consider all of the above effects and provide an output
voltage that will meet the specified tolerance at the load.
The designer must also ensure that the regulator
component temperatures are kept within the manufacturers
specified ratings at full load and maximum ambient
temperature.
Selecting Feedback Divider Resistors
V
OUT
R1
R2
V
FB
Figure 7. Selecting Feedback Divider Resistors
The feedback pins (V
FB1(2)
) are connected to external
resistor dividers to set the output voltages. The error
amplifier is referenced to 1.0 V and the output voltage is
determined by selecting resistor divider values. Resistor R1
is selected based on a design trade−off between efficiency
and output voltage accuracy. The output voltage error can be
estimated due to the bias current of the error amplifier
neglecting resistor tolerance:
Error%
1 10
6
R1
1
100%
R2 can be sized after R1 has been determined:
R2 R1
V
OUT
1
1
Calculating Duty Cycle
The duty cycle of a buck converter (including parasitic
losses) is given by the formula:
Duty Cycle D
V
OUT
(V
HFET
V
L
)
V
IN
V
LFET
V
HFET
V
L
where:
V
OUT
= buck regulator output voltage;
V
HFET
= high side FET voltage drop due to R
DS(ON)
;
V
L
= output inductor voltage drop due to inductor wire
DC resistance;
V
IN
= buck regulator input voltage;
V
LFET
= low side FET voltage drop due to R
DS(ON)
.
Selecting the Switching Frequency
Selecting the switching frequency is a trade−off between
component size and power losses. Operation at higher
switching frequencies allows the use of smaller inductor and
capacitor values. Nevertheless, it is common to select lower
frequency operation because a higher frequency results in
lower efficiency due to MOSFET gate charge losses.
Additionally, the use of smaller inductors at higher
frequencies results in higher ripple current, higher output
voltage ripple, and lower efficiency at light load currents.
The value of the oscillator resistor is designed to be
linearly related to the switching period. If the designer
prefers not to use Figure 8 to select the necessary resistor, the
following equation quite accurately predicts the proper
resistance for room temperature conditions.
R
OSC
21700 f
SW
2.31f
SW
where:
R
OSC
= oscillator resistor in k;
f
SW
= switching frequency in kHz.
Figure 8. Switching Frequency
10 20 30 40 50 60
100
200
300
400
500
600
700
800
R
OSC
(k
)
Frequency (kHz)
Selection of the Output Inductor
The inductor should be selected based on its inductance,
current capability, and DC resistance. Increasing the
inductor value will decrease output voltage ripple, but
degrade transient response. There are many factors to
consider in selecting the inductor including cost, efficiency,
EMI and ease of manufacture. The inductor must be able to
handle the peak current at the switching frequency without
saturating, and the copper resistance in the winding should
be kept as low as possible to minimize resistive power loss.
There are a variety of materials and types of magnetic
cores that could be used for this application. Among them
are ferrites, molypermalloy cores (MPP), amorphous and
powdered iron cores. Powdered iron cores are very
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11
commonly used. Powdered iron cores are very suitable due
to its high saturation flux density and have low loss at high
frequencies, a distributed gap and exhibit very low EMI.
The minimum value of inductance which prevents
inductor saturation or exceeding the rated FET current can
be calculated as follows:
L
MIN
(V
IN(MIN)
V
OUT
)V
OUT
f
SW
V
IN(MIN)
I
SW(MAX)
where:
L
MIN
= minimum inductance value;
V
IN(MIN)
= minimum design input voltage;
V
OUT
= output voltage;
f
SW
= switching frequency;
I
SW(MAX)
− maximum design switch current.
The inductor ripple current can then be determined:
I
L
V
OUT
(1 D)
L f
SW
where:
I
L
= inductor ripple current;
V
OUT
= output voltage;
L = inductor value;
D = duty cycle.
f
SW
= switching frequency
The designer can now verify if the number of output
capacitors will provide an acceptable output voltage ripple
(1.0% of output voltage is common). The formula below is
used:
I
L
V
OUT
ESR
MAX
Rearranging we have:
ESR
MAX
V
OUT
I
L
where:
ESR
MAX
= maximum allowable ESR;
V
OUT
= 1.0% × V
OUT
= maximum allowable output
voltage ripple ( budgeted by the designer );
I
L
= inductor ripple current;
V
OUT
= output voltage.
The number of output capacitors is determined by:
Number of capacitors
ESR
CAP
ESR
MAX
where:
ESR
CAP
= maximum ESR per capacitor (specified in
manufacturers data sheet).
The designer must also verify that the inductor value
yields reasonable inductor peak and valley currents (the
inductor current is a triangular waveform):
I
L(PEAK)
I
OUT
I
L
2
where:
I
L(PEAK)
= inductor peak current;
I
OUT
= load current;
I
L
= inductor ripple current.
I
L(VALLEY)
I
OUT
I
L
2
where:
I
L(VALLEY)
= inductor valley current.
Selection of the Output Capacitors
These components must be selected and placed carefully
to yield optimal results. Capacitors should be chosen to
provide acceptable ripple on the regulator output voltage.
Key specifications for output capacitors are their ESR
(Equivalent Series Resistance), and ESL (Equivalent Series
Inductance). For best transient response, a combination of
low value/high frequency and bulk capacitors placed close
to the load will be required.
In order to determine the number of output capacitors the
maximum voltage transient allowed during load transitions
has to be specified. The output capacitors must hold the
output voltage within these limits since the inductor current
can not change with the required slew rate. The output
capacitors must therefore have a very low ESL and ESR.
The voltage change during the load current transient is:
V
OUT
I
OUT
ESL
t
ESR
t
TR
C
OUT
where:
I
OUT
/ t = load current slew rate;
I
OUT
= load transient;
t = load transient duration time;
ESL = Maximum allowable ESL including capacitors,
circuit traces, and vias;
ESR = Maximum allowable ESR including capacitors
and circuit traces;
t
TR
= output voltage transient response time.
The designer has to independently assign values for the
change in output voltage due to ESR, ESL, and output
capacitor discharging or charging. Empirical data indicates
that most of the output voltage change (droop or spike
depending on the load current transition) results from the
total output capacitor ESR.
The maximum allowable ESR can then be determined
according to the formula:
ESR
MAX
V
ESR
I
OUT
where:
V
ESR
= change in output voltage due to ESR (assigned
by the designer)
Once the maximum allowable ESR is determined, the
number of output capacitors can be found by using the
formula:
Number of capacitors
ESR
CAP
ESR
MAX
where:
ESR
CAP
= maximum ESR per capacitor (specified in
manufacturers data sheet).
ESR
MAX
= maximum allowable ESR.
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The actual output voltage deviation due to ESR can then
be verified and compared to the value assigned by the
designer:
V
ESR
I
OUT
ESR
MAX
Similarly, the maximum allowable ESL is calculated from
the following formula:
ESL
MAX
V
ESL
t
I
Selection of the Input Inductor
A common requirement is that the buck controller must
not disturb the input voltage. One method of achieving this
is by using an input inductor and a bypass capacitor. The
input inductor isolates the supply from the noise generated
in the switching portion of the buck regulator and also limits
the inrush current into the input capacitors upon power up.
The inductors limiting effect on the input current slew rate
becomes increasingly beneficial during load transients. The
worst case is when the load changes from no load to full load
(load step), a condition under which the highest voltage
change across the input capacitors is also seen by the input
inductor. The inductor successfully blocks the ripple current
while placing the transient current requirements on the input
bypass capacitor bank, which has to initially support the
sudden load change.
The minimum inductance value for the input inductor is
therefore:
L
IN
V
(dIdt)
MAX
where:
L
IN
= input inductor value;
V = voltage seen by the input inductor during a full load
swing;
(dI/dt)
MAX
= maximum allowable input current slew rate.
The designer must select the LC filter pole frequency so
that at least 40 dB attenuation is obtained at the regulator
switching frequency. The LC filter is a double−pole network
with a slope of −2.0, a roll−off rate of −40 dB/dec, and a
corner frequency:
f
C
1
2 LC
where:
L = input inductor;
C = input capacitor(s).
SELECTION OF THE POWER FET
FET Basics
The use of a MOSFET as a power switch is compelled by
two reasons: 1) high input impedance; and 2) fast switching
times. The electrical characteristics of a MOSFET are
considered to be nearly those of a perfect switch. Control
and drive circuitry power is therefore reduced. Because the
input impedance is so high, it is voltage driven. The input of
the MOSFET acts as if it were a small capacitor, which the
driving circuit must charge at turn on. The lower the drive
impedance, the higher the rate of rise of V
GS
, and the faster
the turn−on time. Power dissipation in the switching
MOSFET consists of 1) conduction losses, 2) leakage
losses, 3) turn−on switching losses, 4) turn−off switching
losses, and 5) gate−transitions losses. The latter three losses
are proportional to frequency.
The most important aspect of FET performance is the
Static Drain−To−Source On−Resistance (R
DS(ON)
), which
affects regulator efficiency and FET thermal management
requirements. The On−Resistance determines the amount of
current a FET can handle without excessive power
dissipation that may cause overheating and potentially
catastrophic failure. As the drain current rises, especially
above the continuous rating, the On−Resistance also
increases. Its positive temperature coefficient is between
+0.6%/°C and +0.85%/°C. The higher the On−Resistance
the larger the conduction loss is. Additionally, the FET gate
charge should be low in order to minimize switching losses
and reduce power dissipation.
Both logic level and standard FETs can be used.
Voltage applied to the FET gates depends on the
application circuit used. Both upper and lower gate driver
outputs are specified to drive to within 1.5 V of ground when
in the low state and to within 2.0 V of their respective bias
supplies when in the high state. In practice, the FET gates
will be driven rail−to−rail due to overshoot caused by the
capacitive load they present to the controller IC.
Selection of the Switching (Upper) FET
The designer must ensure that the total power dissipation
in the FET switch does not cause the power component’s
junction temperature to exceed 150°C.
The maximum RMS current through the switch can be
determined by the following formula:
I
RMS(H)
I
L(PEAK)
2
(I
L(PEAK)
I
L(VALLEY)
)
I
L(VALLEY)
2
D
3
where:
I
RMS(H)
= maximum switching MOSFET RMS current;
I
L(PEAK)
= inductor peak current;
I
L(VALLEY)
= inductor valley current;
D = duty cycle.
Once the RMS current through the switch is known, the
switching MOSFET conduction losses can be calculated:

NCP5424D

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC REG CTRLR BUCK 16SOIC
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