CY62136EV30 MoBL
®
Document Number: 38-05569 Rev. *I Page 13 of 18
Package Diagrams
Figure 11. 48-ball VFBGA (6 × 8 × 1 mm) BV48/BZ48 Package Outline, 51-85150
51-85150 *H
CY62136EV30 MoBL
®
Document Number: 38-05569 Rev. *I Page 14 of 18
Figure 12. 44-pin TSOP Z44-II Package Outline, 51-85087
Package Diagrams (continued)
51-85087 *E
CY62136EV30 MoBL
®
Document Number: 38-05569 Rev. *I Page 15 of 18
Acronyms Document Conventions
Units of Measure
Acronym Description
BLE
Byte Low enable
BHE
Byte High Enable
CE
Chip Enable
CMOS Complementary Metal Oxide Semiconductor
I/O Input/Output
OE
Output Enable
SRAM Static Random Access Memory
TSOP Thin Small Outline Package
VFBGA Very Fine-Pitch Ball Grid Array
WE
Write Enable
Symbol Unit of Measure
°C degree Celsius
MHz megahertz
A microampere
s microsecond
mA milliampere
mm millimeter
ns nanosecond
ohm
% percent
pF picofarad
V volt
W watt

CY62136EV30LL-45BVXI

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 2Mb 3V 45ns 128K x 16 LP SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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