IPD30N10S3L34ATMA1

IPD30N10S3L-34
OptiMOS
®
-T Power-Transistor
Features
• N-channel - Enhancement mode
• Automotive AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Green product (RoHS compliant)
• 100% Avalanche tested
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current
I
D
T
C
=25°C, V
GS
=10V
30 A
T
C
=100°C, V
GS
=10V
1)
20
Pulsed drain current
1)
I
D,pulse
T
C
=25°C
120
Avalanche energy, single pulse
1)
E
AS
I
D
=15A
138 mJ
Avalanche current, single pulse
I
AS
30 A
Gate source voltage
2)
V
GS
±20 V
Power dissipation
P
tot
T
C
=25°C
57 W
Operating and storage temperature
T
j
, T
stg
-55 ... +175 °C
IEC climatic category; DIN IEC 68-1 55/175/56
Value
V
DS
100
V
R
DS(on),max
31
mW
I
D
30 A
Product Summary
Type Package Marking
IPD30N10S3L-34 PG-TO252-3-11 3N10L34
PG-TO252-3-11
Rev. 1.1 page 1 2011-10-06
IPD30N10S3L-34
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
1)
Thermal resistance, junction - case
R
thJC
- - 2.6 K/W
SMD version, device on PCB
R
thJA
minimal footprint - - 62
6 cm
2
cooling area
3)
- - 40
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0V, I
D
= 1mA
100 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=29µA
1.2 1.7 2.4
Zero gate voltage drain current
I
DSS
V
DS
=80V, V
GS
=0V,
T
j
=25°C
- 0.01 0.1 µA
V
DS
=80V, V
GS
=0V,
T
j
=125°C
1)
- 1 10
Gate-source leakage current
I
GSS
V
GS
=16V, V
DS
=0V
- - 100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=4.5V, I
D
=30A
- 32.2 41.8
mW
V
GS
=10 V, I
D
=30 A
- 25.8 31.0
Values
Rev. 1.1 page 2 2011-10-06
IPD30N10S3L-34
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
1)
Input capacitance
C
iss
- 1520 1976 pF
Output capacitance
C
oss
- 380 494
Reverse transfer capacitance
C
rss
- 45 68
Turn-on delay time
t
d(on)
- 6 - ns
Rise time
t
r
- 4 -
Turn-off delay time
t
d(off)
- 18 -
Fall time
t
f
- 3 -
Gate Charge Characteristics
1)
Gate to source charge
Q
gs
- 5 7 nC
Gate to drain charge
Q
gd
- 4 6
Gate charge total
Q
g
- 24 31
Gate plateau voltage
V
plateau
- 3.7 - V
Reverse Diode
Diode continous forward current
1)
I
S
- - 30 A
Diode pulse current
1)
I
S,pulse
- - 120
Diode forward voltage
V
SD
V
GS
=0V, I
F
=30A,
T
j
=25°C
0.6 1 1.2 V
Reverse recovery time
1)
t
rr
V
R
=50V, I
F
=I
S
,
di
F
/dt=100A/µs
- 72 - ns
Reverse recovery charge
1)
Q
rr
- 150 - nC
1)
Defined by design. Not subject to production test.
3)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
2)
Qualified with V
GS
= +20/-5V.
T
C
=25°C
Values
V
GS
=0V, V
DS
=25V,
f=1MHz
V
DD
=20V, V
GS
=10V,
I
D
=30A, R
G
=3.5W
V
DD
=80V, I
D
=30A,
V
GS
=0 to 10V
Rev. 1.1 page 3 2011-10-06

IPD30N10S3L34ATMA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-Ch 100V 30A DPAK-2 OptiMOS-T
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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