PBSS5440D_2 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 14 December 2009 3 of 13
NXP Semiconductors
PBSS5440D
40 V PNP low V
CEsat
(BISS) transistor
[1] Device mounted on a ceramic PCB, AL
2
O
3
, standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
[5] Operated under pulsed conditions: Duty cycle δ≤10% and pulse width t
p
≤ 10 ms.
T
stg
storage temperature −65 +150 °C
T
j
junction temperature - 150 °C
T
amb
ambient temperature −65 +150 °C
(1) Ceramic PCB, AL
2
O
3
, standard footprint
(2) FR4 PCB, mounting pad for collector 6 cm
2
(3) FR4 PCB, mounting pad for collector 1 cm
2
(4) FR4 PCB, standard footprint
Fig 1. Power derating curves
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
(1)
T
amb
(°C)
−75 17512525 75−25
006aaa270
800
400
1200
1600
P
tot
(mW)
0
(2)
(4)
(3)