19
LT1956/LT1956-5
1956f
APPLICATIO S I FOR ATIO
WUUU
Boost current loss:
P
VI
V
BOOST
OUT OUT
IN
=
()
2
36/
Quiescent current loss:
PV V
Q IN OUT
=
()
+
()
0 0015 0 003..
R
SW
= switch resistance (0.3) hot
t
EFF
= effective switch current/voltage overlap time
= (t
r
+ t
f
+ t
Ir
+ t
If
)
t
r
= (V
IN
/1.2)ns
t
f
= (V
IN
/1.7)ns
t
Ir
= t
If
= (I
OUT
/0.05)ns
f = switch frequency
Example: with V
IN
= 12V, V
OUT
= 5V and I
OUT
= 1A:
P
W
PW
PW
SW
BOOST
Q
=
()()()
+
()
()
()( )
()
=+=
=
()
()
=
=
()
+
()
=
03 1 5
12
57 10 1 2 1 12 500 10
0 125 0 171 0 296
5136
12
0 058
12 0 0015 5 0 003 0 033
2
93
2
.
•/
...
/
.
...
Total power dissipation in the IC is given by:
P
TOT
= P
SW
+ P
BOOST
+ P
Q
= 0.296W + 0.058W + 0.033W = 0.39W
Thermal resistance for the LT1956 packages is influenced
by the presence of internal or backside planes.
SSOP (GN16) Package: With a full plane under the GN16
package, thermal resistance will be about 85°C/W.
TSSOP (Exposed Pad) Package: With a full plane under the
TSSOP package, thermal resistance (θ
JA
) will be about
45°C/W.
To calculate die temperature, use the proper thermal
resistance (θ
JA
) number for the desired package an add in
worst-case ambient temperature:
T
J
= T
A
+ (θ
JA
• P
TOT
)
When estimating ambient, remember the nearby catch
diode and inductor will also be dissipating power.
P
VV V I
V
DIODE
F IN OUT LOAD
IN
=
( )( )( )
V
F
= Forward voltage of diode (assume 0.63V at 1A)
PW
DIODE
==
(. )( )()
.
063 12 5 1
12
037
Notice that the catch diode’s forward voltage contributes
a significant loss in the overall system efficiency. A larger,
low V
F
diode can improve efficiency by several percent.
P
INDUCTOR
= (I
LOAD
)(L
DCR
)
L
DCR
= inductor DC resistance (assume 0.1)
P
INDUCTOR
= (1)(0.1) = 0.1W
Typical thermal resistance of the board is 10°C/W. Taking
the catch diode and inductor power dissipation into ac-
count and using the example calculations for LT1956 dis-
sipation, the LT1956 die temperature will be estimated as:
T
J
= T
A
+ (θ
JA
• P
TOT
) + (10 • [P
DIODE
+ P
INDUCTOR
])
With the GN16 package (θ
JA
= 85°C/W), at an ambient
temperature of 70°C:
T
J
= 70 + (85 • 0.39) + (10 • 0.47) = 108°C
With the TSSOP package (θ
JA
= 45°C/W) at an ambient
temperature of 70°C:
T
J
= 70 + (45 • 0.37) + (10 • 0.47) = 91°C
Die temperature can peak for certain combinations of
V
IN
, V
OUT
and load current. While higher V
IN
gives greater
switch AC losses, quiescent and catch diode losses, a
lower V
IN
may generate greater losses due to switch DC
losses. In general, the maximum and minimum V
IN
levels
should be checked with maximum typical load current for
calculation of the LT1956 die temperature. If a more
accurate die temperature is required, a measurement of
the SYNC pin resistance (to GND) can be used. The SYNC
pin resistance can be measured by forcing a voltage no
greater than 0.5V at the pin and monitoring the pin
current over temperature in a oven. This should be done
with minimal device power (low V
IN
and no switching
[V
C
= 0V]) in order to calibrate SYNC pin resistance with
ambient (oven) temperature.
20
LT1956/LT1956-5
1956f
APPLICATIO S I FOR ATIO
WUUU
Note: Some of the internal power dissipation in the IC, due
to BOOST pin voltage, can be transferred outside of the IC
to reduce junction temperature by increasing the voltage
drop in the path of the boost diode D2 (see Figure 9). This
reduction of junction temperature inside the IC will allow
higher ambient temperature operation for a given set of
conditions. BOOST pin circuitry dissipates power given by:
P
VI V
V
DISS
OUT SW C
IN
(BOOST Pin)=
()
•/36
2
Typically, V
C2
(the boost voltage across the capacitor C2)
equals V
OUT
. This is because diodes D1 and D2 can be
considered almost equal, where:
V
C2
= V
OUT
– V
F
(D2) – [–V
F
(D1)] = V
OUT
.
Hence, the equation for boost circuitry power dissipation
given in the previous Thermal Calculations section, is
stated as:
P
VI V
V
DISS BOOST
OUT SW OUT
IN
()
•/
=
()
36
Here it can be seen that boost power dissipation increases
as the square of V
OUT
. It is possible, however, to reduce
V
C2
below V
OUT
to save power dissipation by increasing
the voltage drop in the path of D2. Care should be taken
that V
C2
does not fall below the minimum 3.3V boost
voltage required for full saturation of the internal power
switch. For output voltages of 5V, V
C2
is approximately 5V.
During switch turn on, V
C2
will fall as the boost capacitor
C2 is discharged by the BOOST pin. In the previous BOOST
Pin section, the value of C2 was designed for a 0.7V droop
in V
C2
(= V
DROOP
). Hence, an output voltage as low as 4V
would still allow the minimum 3.3V for the boost function
using the C2 capacitor calculated.
If a target output voltage of 12V is required, however, an
excess of 8V is placed across the boost capacitor which is
not required for the boost function but still dissipates
additional power.
What is required is a voltage drop in the path of D2 to
achieve minimal power dissipation while still maintaining
minimum boost voltage across C2.
A zener, D4, placed in series with D2 (see Figure 9), drops
voltage to C2.
Example:
The BOOST pin power dissipation for a 20V input to 12V
output conversion at 1A is given by:
PW
BOOST
=
()
=
12 1 36 12
20
02
•/
.
If a 7V zener is placed in series with D2, then power
dissipation becomes:
PW
BOOST
=
()
=
12 1 36 5
20
0 084
•/
.
For an FE package with thermal resistance of 45°C/W,
ambient temperature savings would be:
T (ambient) savings = 0.116W • 45°C/W = 5°C
For a GN package with thermal resistance of 85°C/W,
ambient temperature savings would be:
T (ambient) savings = 0.116W • 85°C/W = 10°C
The 7V zener should be sized for excess of 0.116W
operation. The tolerances of the zener should be consid-
ered to ensure minimum V
BOOST
exceeds 3.3V + V
DROOP
.
BOOST
V
IN
D1
R1
V
OUT
C
F
C
C
LT1956
SHDN
SYNC
SW
BIAS
FB
V
C
GND
C2
C1
L1
D2
R
C
R2
1956 F09
C3
V
IN
D2 D4
+
Figure 9. BOOST Pin, Diode Selection
21
LT1956/LT1956-5
1956f
APPLICATIO S I FOR ATIO
WUUU
Input Voltage vs Operating Frequency Considerations
The absolute maximum input supply voltage for the LT1956
is specified at 60V. This is based on internal semiconduc-
tor junction breakdown effects. The practical maximum
input supply voltage for the LT1956 may be less than 60V
due to internal power dissipation or switch minimum on
time considerations.
For the extreme case of an output short-circuit fault to
ground, see the section Short-Circuit Considerations.
A detailed theoretical basis for estimating internal power
dissipation is given in the Thermal Calculations section.
This will allow a first pass check of whether an application’s
maximum input voltage requirement is suitable for the
LT1956. Be aware that these calculations are for DC input
voltages and that input voltage transients as high as 60V
are possible if the resulting increase in internal power
dissipation is of insufficient time duration to raise die
temperature significantly. For the FE package, this means
high voltage transients on the order of hundreds of milli-
seconds are possible. If LT1956 (FE package) thermal
calculations show power dissipation is not suitable for the
given application, the LT1766 (FE package) is a recom-
mended alternative since it is identical to the LT1956 but
runs cooler at 200kHz.
Switch minimum on time is the other factor that may limit
the maximum operational input voltage for the LT1956 if
pulse-skipping behavior is not allowed. For the LT1956,
pulse-skipping may occur for V
IN
/(V
OUT
+ V
F
) ratios > 4.
(V
F
= Schottky diode D1 forward voltage drop, Figure 5.)
If the LT1766 is used, the ratio increases to 10. Pulse-
skipping is the regulator’s way of missing switch pulses to
maintain output voltage regulation. Although an increase
in output ripple voltage can occur during pulse-skipping,
a ceramic output capacitor can be used to keep ripple
voltage to a minimum (see output ripple voltage compari-
son for tantalum vs ceramic output capacitors, Figure 3).
FREQUENCY COMPENSATION
Before starting on the theoretical analysis of frequency
response, the following should be remembered—the worse
the board layout, the more difficult the circuit will be to
stabilize. This is true of almost all high frequency analog
circuits, read the Layout Considerations section first.
Common layout errors that appear as stability problems
are distant placement of input decoupling capacitor and/
or catch diode, and connecting the V
C
compensation to a
ground track carrying significant switch current. In addi-
tion, the theoretical analysis considers only first order
non-ideal component behavior. For these reasons, it is
important that a final stability check is made with produc-
tion layout and components.
The LT1956 uses current mode control. This alleviates
many of the phase shift problems associated with the
inductor. The basic regulator loop is shown in Figure 10.
The LT1956 can be considered as two g
m
blocks, the error
amplifier and the power stage.
Figure 11 shows the overall loop response. At the V
C
pin,
the frequency compensation components used are:
R
C
= 2.2k, C
C
= 0.022µF and C
F
= 220pF. The output
capacitor used is a 100µF, 10V tantalum capacitor with
typical ESR of 100m.
The ESR of the tantalum output capacitor provides a useful
zero in the loop frequency response for maintaining stabil-
ity. This ESR, however, contributes significantly to the
ripple voltage at the output (see Output Ripple Voltage in
the Applications Information section). It is possible to
reduce capacitor size and output ripple voltage by replac-
ing the tantalum output capacitor with a ceramic output
capacitor because of its very low ESR. The zero provided
by the tantalum output capacitor must now be reinserted
back into the loop. Alternatively, there may be cases
where, even with the tantalum output capacitor, an addi-
tional zero is required in the loop to increase phase margin
for improved transient response.
A zero can be added into the loop by placing a resistor (R
C
)
at the V
C
pin in series with the compensation capacitor, C
C
,
or by placing a capacitor (C
FB
) between the output and the
FB pin.
When using R
C
, the maximum value has two limitations.
First, the combination of output capacitor ESR and R
C
may
stop the loop rolling off altogether. Second, if the loop gain
is not rolled off sufficiently at the switching frequency,
output ripple will perturb the V
C
pin enough to cause
unstable duty cycle switching similar to subharmonic

LT1956IFE#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Hi V, 1.5A, 500kHz Buck Sw Regs
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