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SC16C2550BIBS,128

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P43
SC16C2550B_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 12 January 2009 34 of 43
NXP Semiconductors
SC16C2550B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
Fig 19. Package outline SOT617-1 (HVQFN32)
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
5.1
4.9
D
h
3.25
2.95
y
1
5.1
4.9
3.25
2.95
e
1
3.5
e
2
3.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT617-1 MO-220- - - - - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT617-1
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
916
32
25
24
17
8
1
X
D
E
C
B
A
e
2
terminal 1
index area
terminal 1
index area
01-08-08
02-10-18
1/2 e
1/2 e
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
SC16C2550B_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 12 January 2009 35 of 43
NXP Semiconductors
SC16C2550B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
Fig 20. Package outline SOT313-2 (LQFP48)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
0.5
9.15
8.85
0.95
0.55
7
0
o
o
0.12 0.10.21
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2 MS-026136E05
00-01-19
03-02-25
D
(1) (1)(1)
7.1
6.9
H
D
9.15
8.85
E
Z
0.95
0.55
D
b
p
e
E
B
12
D
H
b
p
E
H
v M
B
D
Z
D
A
Z
E
e
v M
A
1
48
37
36
25
24
13
θ
A
1
A
L
p
detail X
L
(A )
3
A
2
X
y
c
w M
w M
0 2.5 5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
SC16C2550B_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 12 January 2009 36 of 43
NXP Semiconductors
SC16C2550B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
Fig 21. Package outline SOT129-1 (DIP40)
UNIT
A
max.
1 2
b
1
cD E e M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT129-1
99-12-27
03-02-13
A
min.
A
max.
b
Z
max.
w
M
E
e
1
1.70
1.14
0.53
0.38
0.36
0.23
52.5
51.5
14.1
13.7
3.60
3.05
0.2542.54 15.24
15.80
15.24
17.42
15.90
2.254.7 0.51 4
0.067
0.045
0.021
0.015
0.014
0.009
2.067
2.028
0.56
0.54
0.14
0.12
0.010.1 0.6
0.62
0.60
0.69
0.63
0.089 0.19 0.02 0.16
051G08 MO-015 SC-511-40
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
40
1
21
20
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
(1)(1)
DIP40: plastic dual in-line package; 40 leads (600 mil)
SOT129-1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P43

SC16C2550BIBS,128

Mfr. #:
Buy SC16C2550BIBS,128
Manufacturer:
NXP Semiconductors
Description:
UART Interface IC 16CB 2.5V-5V 2CH
Lifecycle:
New from this manufacturer.
Delivery:
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