October 2011 Doc ID 11265 Rev 5 1/14
14
USBLC6-2
Very low capacitance ESD protection
Features
■ 2 data-line protection
■ Protects V
BUS
■
Very low capacitance: 3.5 pF max.
■ Very low leakage current: 150 nA max.
■ SOT-666 and SOT23-6L packages
■ RoHS compliant
Benefits
■ Very low capacitance between lines to GND for
optimized data integrity and speed
■ Low PCB space consumption: 2.9 mm
2
max for
SOT-666 and 9 mm² max for SOT23-6L
■ Enhanced ESD protection: IEC 61000-4-2
level 4 compliance guaranteed at device level,
hence greater immunity at system level
■ ESD protection of V
BUS
■
High reliability offered by monolithic integration
■ Low leakage current for longer operation of
battery powered devices
■ Fast response time
■ Consistent D+ / D- signal balance:
– Very low capacitance matching tolerance
I/O to GND = 0.015 pF
– Compliant with USB 2.0 requirements
Complies with the following standards:
■ IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
Figure 1. Functional diagram (top view)
Applications
■ USB 2.0 ports up to 480 Mb/s (high speed)
■ Compatible with USB 1.1 low and full speed
■ Ethernet port: 10/100 Mb/s
■ SIM card protection
■ Video line protection
■ Portable electronics
Description
The USBLC6-2SC6 and USBLC6-2P6 are
monolithic application specific devices dedicated
to ESD protection of high speed interfaces, such
as USB 2.0, Ethernet links and video lines.
The very low line capacitance secures a high level
of signal integrity without compromising in
protecting sensitive chips against the most
stringently characterized ESD strikes.
SOT23-6L
USBLC6-2SC6
SOT-666
USBLC6-2P6
11
6
2
5
3
4
I/O1 I/O1
GND V
BUS
I/O2 I/O2
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