VNN7NV04P-E, VNS7NV04P-E Package and PCB thermal data
Doc ID 15632 Rev 4 19/29
Figure 36. SO-8 thermal impedance junction ambient single pulse
Figure 37. Thermal fitting model of an OMNIFET II in SO-8
Equation 1 Pulse calculation formula
where
Table 5. SO-8 thermal parameter
Area/island (cm
2
)Footprint2
R1 (°C/W) 0.2
R2 (°C/W) 0.9
R3 (°C/W) 3.5
R4 (°C/W) 21
R5 (°C/W) 16
R6 (°C/W) 58 28
C1 (W.s/°C) 3.00E-04
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
T_amb
C1
R1 R2
C2
R3
C3
R4
C4
R5
C5
R6
C6
Pd
Tj
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
δ t
p
T=
Package and PCB thermal data VNN7NV04P-E, VNS7NV04P-E
20/29 Doc ID 15632 Rev 4
4.2 SOT-223 thermal data
Figure 38. SOT-223 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 2 mm, Cu thickness = 35 µm, Copper areas: 0.11 cm
2
, 1 cm
2
, 2 cm
2
).
Figure 39. R
thj-amb
vs PCB copper area in open box free air condition
C2 (W.s/°C) 9.00E-04
C3 (W.s/°C) 7.50E-03
C4 (W.s/°C) 0.045
C5 (W.s/°C) 0.35
C6 (W.s/°C) 1.05 2
Table 5. SO-8 thermal parameter (continued)
Area/island (cm
2
)Footprint2
60
70
80
90
100
110
120
130
140
00.511.522.5
Cu area (cm^2)
RTH j-amb (°C/W)
VNN7NV04P-E, VNS7NV04P-E Package and PCB thermal data
Doc ID 15632 Rev 4 21/29
Figure 40. SOT-223 thermal impedance junction ambient single pulse
Figure 41. Thermal fitting model of an OMNIFET II in SOT-223
Equation 2 Pulse calculation formula
where
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
T_amb
C1
R1 R2
C2
R3
C3
R4
C4
R5
C5
R6
C6
Pd
Tj
Z
THδ
R
TH
δ Z
THtp
1 δ()+=
δ t
p
T=

VNN7NV04PTR-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers 40V 6A OMNIFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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