NOT RECOMMENDED FOR
NEW DESIGNS
6.42
IDT70P3519/99
High-Speed 1.8V 256/128K x 36 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges
10
FEBRUARY 15, 2008
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(3)
(VDD = 1.8V ± 100mV)
NOTES:
1. At f = f
MAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS".
2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby.
3. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
4. V
DD = 1.8V, TA = 25°C for Typ, and are not production tested. IDD DC(f=0) = 15mA (Typ).
5. CE
X = VIL means CE0X = VIL and CE1X = VIH
CEX = VIH means CE0X = VIH or CE1X = VIL
CEX < 0.2V means CE0X < 0.2V and CE1X > VDDQ - 0.2V
CE
X > VDDQ - 0.2V means CE0X > VDDQ - 0.2V or CE1X - 0.2V
"X" represents "L" for left port or "R" for right port.
6. I
SB1, ISB2 and ISB4 will all reach full standby levels (ISB3) on the appropriate port(s) if ZZL and/or ZZR = VIH.
70P3519/99
S200
Com'l Only
70P3519/99
S166
Com'l & Ind
Symbol Parameter Test Condition Version
Typ.
(4)
Max. Typ.
(4)
Max. Unit
I
DD
Dynamic Operating
Current (Both
Ports Active)
CE
L
and CE
R
= V
IL
,
Outputs Disabled,
f = f
MAX
(1)
COM'L S 226 325 190 285
mA
IND S
___ ___
190 325
I
SB1
(6)
Standby Current
(Both Ports - TTL
Level Inputs)
CE
L
= CE
R
= V
IH
f = f
MAX
(1)
COM'L S 120 195 102 170
mA
IND S
___ ___
102 205
I
SB2
(6)
Standby Current
(One Port - TTL
Level Inputs)
CE
"A"
= V
IL
and CE
"B"
= V
IH
(5)
Active Port Outputs Disabled,
f=f
MAX
(1)
COM'L S 176 265 148 230
mA
IND S
___ ___
148 270
I
SB3
Full Standby Current
(Both Ports - CMOS
Level Inputs)
Both Ports CE
L
and
CE
R
> V
DDQ
- 0.2V, V
IN
> V
DDQ
- 0.2V
or V
IN
< 0.2V, f = 0
(2)
COM'L S 15 45 15 45
mA
IND S
___ ___
15 60
I
SB4
(6)
Full Standby Current
(One Port - CMOS
Level Inputs)
CE
"A"
< 0.2V and CE
"B"
> V
DDQ
- 0.2V
(5)
V
IN
> V
DDQ
- 0.2V or V
IN
< 0.2V
Active Port, Outputs Disabled, f = f
MAX
(1)
COM'L S 176 265 148 230
mA
IND S
___ ___
148 270
Izz Sleep Mode Current
(Both Ports - TTL
Level Inputs)
ZZ
L =
ZZ
R =
V
IH
f=f
MAX
(1)
COM'L S 15 45 15 45
mA
IND S
___ ___
15 60
7144 tbl 09
NOT RECOMMENDED FOR
NEW DESIGNS
6.42
IDT70P3519/99
High-Speed 1.8V 256/128K x 36 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges
11
AC Test Conditions (VDDQ - 3.3V/2.5V/1.8V)
Figure 1. AC Output Test load.
Input Pulse Levels (Address & Controls)
Input Pulse Levels (I/Os)
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
Output Load
GND to 3
.
0V/GND to 2.4V/GND to 1.7V
GND to 3.0V/GND to 2.4V/GND to 1.7V
2ns
1.5V/1.25V/0.85V
1.5V/1.25V/0.85V
Figure 1
7144 tbl 10
1.5V/1.25V/0.85V
50
50
7144 drw 03
10pF
(Tester)
D
ATA
OUT
,
Capacitance (pF) from AC Test Load
7144 drw 04
tCD
(
Typical, ns)
NOT RECOMMENDED FOR
NEW DESIGNS
6.42
IDT70P3519/99
High-Speed 1.8V 256/128K x 36 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges
12
FEBRUARY 15, 2008
AC Electrical Characteristics Over the Operating Temperature Range
(Read and Write Cycle Timing)
(2,3)
(VDD = 1.8V ± 100mV, TA = 0°C to +70°C)
NOTES:
1. The Pipelined output parameters (t
CYC2, tCD2) apply to either or both left and right ports when PL/FTX = VDD (1.8V). Flow-through parameters (tCYC1, tCD1) apply
when PL/FT = V
SS (0V) for that port.
2. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE) and PL/FT. PL/FT should be treated as DC
signals, i.e. steady state during operation.
3. These values are valid for any level of V
DDQ (3.3V/2.5V/1.8V).
4. Guaranteed by design (not production tested).
70P3519/99
S200
Com'l Only
70P3519/99
S166
Com'l & Ind
Symbol Parameter Min.Max.Min.Max.Unit
t
CYC1
Clock Cycle Time (Flow-Through)
(1)
15
____
20
____
ns
t
CYC2
Clock Cycle Time (Pipelined)
(1)
5
____
6
____
ns
t
CH1
Clock High Time (Flow-Through)
(1)
6
____
8
____
ns
t
CL1
Clock Low Time (Flow-Through)
(1)
6
____
8
____
ns
t
CH2
Clock High Time (Pipelined)
(2)
2
____
2.4
____
ns
t
CL2
Clock Low Time (Pipelined)
(1)
2
____
2.4
____
ns
t
SA
Address Setup Time 1.5
____
1.7
____
ns
t
HA
Address Hold Time 0.5
____
0.5
____
ns
t
SC
Chip Enable Setup Time 1.5
____
1.7
____
ns
t
HC
Chip Enable Hold Time 0.5
____
0.5
____
ns
t
SB
Byte Enable Setup Time 1.5
____
1.7
____
ns
t
HB
Byte Enable Hold Time 0.5
____
0.5
____
ns
t
SW
R/W Setup Time 1.5
____
1.7
____
ns
t
HW
R/W Hold Time 0.5
____
0.5
____
ns
t
SD
Input Data Setup Time 1.5
____
1.7
____
ns
t
HD
Input Data Hold Time 0.5
____
0.5
____
ns
t
SAD
ADS Setup Time
1.5
____
1.7
____
ns
t
HAD
ADS Hold Time
0.5
____
0.5
____
ns
t
SCN
CNTEN Setup Time
1.5
____
1.7
____
ns
t
HCN
CNTEN Hold Time
0.5
____
0.5
____
ns
t
SRPT
REPEAT Setup Time
1.5
____
1.7
____
ns
t
HRPT
REPEAT Hold Time
0.5
____
0.5
____
ns
t
OE
Output Enable to Data Valid
____
4.4
____
4.4 ns
t
OLZ
(4)
Output Enable to Output Low-Z 1
____
1
____
ns
t
OHZ
(4)
Output Enable to Output High-Z 1 3.4 1 3.6 ns
t
CD1
Clock to Data Valid (Flow-Through)
(1)
____
10
____
12 ns
t
CD2
Clock to Data Valid (Pipelined)
(1)
____
3.4
____
3.6 ns
t
DC
Data Output Hold After Clock High 1
____
1
____
ns
t
CKHZ
(4)
Clock High to Output High-Z 1 3.4 1 3.6 ns
t
CKLZ
(4)
Clock High to Output Low-Z 1
____
1
____
ns
t
INS
Interrupt Flag Set Time
____
7
____
7ns
t
INR
Interrupt Flag Reset Time
____
7
____
7ns
t
COLS
Collision Flag Set Time
____
3.4
____
3.6 ns
t
COLR
Collision Flag Reset Time
____
3.4
____
3.6 ns
t
ZZSC
Sleep Mode Set Cycles 2
____
2
____
cycles
t
ZZRC
Sleep Mode Recovery Cycles 3
____
3
____
cycles
Port-to-Port Delay
t
CO
Clock-to-Clock Offset 4
____
5
____
ns
t
OFS
Clock-to-Clock Offset for Collision Detection
Please refer to Collision Detection Timing Table
on Page 21
7144 tbl 11

70P3519S166BCG8

Mfr. #:
Manufacturer:
Description:
IC SRAM 9M PARALLEL 256CABGA
Lifecycle:
New from this manufacturer.
Delivery:
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