NCP6915
http://onsemi.com
24
PACKAGE DIMENSIONS
WLCSP16, 1.56x1.56
CASE 567GF
ISSUE D
SEATING
PLANE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
−−−
MILLIMETERS
A1
D 1.56 BSC
E
b 0.24 0.29
e 0.40 BSC
0.60
D
E
A
B
PIN A1
REFERENCE
e
A0.05 BC
0.03
C
0.05 C
16X
b
4
C
B
A
0.10 C
A
A1
A2
C
0.17 0.23
1.56 BSC
0.25
16X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.40
0.40
0.10 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
RECOMMENDED
PACKAGE
OUTLINE
123
PITCH
D
PITCH
A1
A2 0.33 0.39
DETAIL A
e/2
e/2
A3
DETAIL A
A2
A3
0.04 BSC
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