22
LTC4212
4212f
Table 5 lists some current sense resistors that can be used
with the circuit breaker. Table 6 lists some power MOSFETs
that are available. Table 7 lists the web sites of several
manufacturers. Since this information is subject to change,
please verify the part numbers with the manufacturer.
OPERATIO
U
where
P
D
= (I
LOAD
)
2
• R
DS(ON)
θ
JA
= junction-to-ambient thermal resistance
T
A(MAX)
= maximum ambient temperature
If a short circuit happens during start-up, the external
MOSFET can experience a big single pulse energy. This is
especially true if the applications only employed a small
gate capacitor or no gate capacitor at all. Consult the safe
operating area (SOA) curve of the selected MOSFET to
ensure that the T
J(MAX)
is not exceeded during start-up.
Using Staggered Pin Connectors
The LTC4212 can be used on either a printed circuit board
or on the backplane side of the connector. Printed circuit
board edge connectors with staggered pins are recom-
mended as the insertion and removal of circuit boards do
sequence the pin connections. Supply voltage and ground
connections on the printed circuit board should be wired
to the edge connector’s long pins or blades. Control and
status signals (like FAULT and ON) passing through the
card’s edge connector should be wired to short length pins
or blades.
PCB Connection Sense
There are a number of ways to use the LTC4212’s ON pin
to detect whether the printed circuit board has been fully
seated in the backplane before the LTC4212 commences
a start-up cycle.
An example is shown in the schematic on the front page
of this data sheet. In this case, the LTC4212 is mounted
on the PCB and a 20k/10k resistive divider is connected to
the ON pin. On the edge connector, R1 is wired to a short
pin. Until the connectors are fully mated, the ON pin is held
low, keeping the LTC4212 in an off state. Once the
connectors are mated, the resistive divider is con
nected
to V
CC
, V
ON
> 1.316V and the LTC4212 begins a start-up
cycle.
PCB Layout Considerations
For proper operation of the LTC4212’s circuit breaker
function, a 4-wire Kelvin connection to the sense resistors
is highly recommended. In Hot Swap applications where
load currents can reach 10A or more, narrow PCB tracks
exhibit more resistance than wider tracks and operate at
more elevated temperatures. Since the sheet resistance of
1 ounce copper foil is approximately 0.54m/square,
track resistances add up quickly in high current applica-
tions. Thus, to keep PCB track resistance and temperature
rise to a minimum, PCB track width must be appropriately
sized. Consult Appendix A of LTC Application Note 69 for
details on sizing and calculating trace resistances as a
function of copper thickness.
In the majority of applications, it will be necessary to use
plated-through vias to make circuit connections from
component layers to power and ground layers internal to
the PC board. For 1 ounce copper foil plating, a good
starting point is 1A of DC current per via, making sure the
via is properly dimensioned so that solder completely fills
any void. For other plating thicknesses, check with your
PCB fabrication facility.
APPE DIX
U
Table 5. Sense Resistor Selection Guide
CURRENT LIMIT VALUE PART NUMBER DESCRIPTION MANUFACTURER
1A LR120601R050 0.05 0.5W 1% Resistor IRC-TT
2A LR120601R025 0.025 0.5W 1% Resistor IRC-TT
2.5A LR120601R020 0.02 0.5W 1% Resistor IRC-TT
3.3A WSL2512R015F 0.015 1W 1% Resistor Vishay-Dale
5A LR251201R010F 0.01 1.5W 1% Resistor IRC-TT
10A WSR2R005F 0.005 2W 1% Resistor Vishay-Dale
23
LTC4212
4212f
Table 6. N-Channel Selection Guide
CURRENT LEVEL (A) PART NUMBER DESCRIPTION MANUFACTURER
0 to 2 MMDF3N02HD Dual N-Channel SO-8 ON Semiconductor
R
DS(ON)
= 0.1, C
ISS
= 455pF
2 to 5 MMSF5N02HD Single N-Channel SO-8 ON Semiconductor
R
DS(ON)
= 0.025, C
ISS
= 1130pF
5 to 10 MTB50N06V Single N-Channel DD Pak ON Semiconductor
R
DS(ON)
= 0.028, C
ISS
= 1570pF
10 to 20 MTB75N05HD Single N-Channel DD Pak ON Semiconductor
R
DS(ON)
= 0.0095, C
ISS
= 2600pF
Table 7. Manufacturers’ Web Sites
MANUFACTURER WEB SITE
TEMIC Semiconductor www.temic.com
International Rectifier www.irf.com
ON Semiconductor www.onsemi.com
Harris Semiconductor www.semi.harris.com
IRC-TT www.irctt.com
Vishay-Dale www.vishay.com
Vishay-Siliconix www.vishay.com
Diodes, Inc. www.diodes.com
APPE DIX
U
U
PACKAGE DESCRIPTIO
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
MSOP (MS) 0603
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.127 ± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.50
(.0197)
BSC
12
3
45
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8910
7
6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
24
LTC4212
4212f
LT/TP 0304 1K • PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 2003
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
FAX: (408) 434-0507
www.linear.com
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+
V
CC
SENSE
LTC4212
9
1
10
23
87
10µF
+
10µF
2
31
5V
2.5V
1.5A
3.3V
1.5A
4212 TA02
6
GATE
PGT
4
PGFTIMER
C
TIMER
0.01µF
PGI
ON
V
CC
5V
GND
Z1 = SMAJ10A (TVS)
R
X
10
R
SENSE
0.007
EDGE
CONNECTOR
(MALE)
M1
Si4410DY
Z1
R4
10k
R6
2.1k
R5
10k
FAULT
GND
FAULT
+
10µF
LT1963-2.5
C
PGT
180nF
C
PGF
18pF
C
X
100nF
BACKPLANE
CONNECTOR
(FEMALE)
5
+
10µF
2
31
+
10µF
LT1963-3.3
4
3
LTC1326-2.5
GND
V
CCA
1
V
CC3
6
RST
2
V
CC25
R2
20k
R1 10k
R3
10k
TYPICAL APPLICATIO
U
Monitoring DC/DC Converters with the LTC1326-2.5 Supply Monitor

LTC4212IMS#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Hot Swap Voltage Controllers Hot Swap Controller w/Power Up Timer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union