10 ©2003, 2004 Micron Technology, Inc. All rights reserved.
NOTE:
1. For full-page accesses: y = 1,024.
2. For a burst length of two, A1–A9 select the block-of-
two burst; A0 selects the starting column within the
block.
3. For a burst length of four,A2–A9 select the block-of-
four burst; A0–A1 select the starting column within the
block.
4. For a burst length of eight, A3–A9 select the block-of-
eight burst; A0–A2 select the starting column within
the block.
5. For a full-page burst, the full row is selected and A0–A9
select the starting column.
6. Whenever a boundary of the block is reached within a
given sequence above, the following access wraps
within the block.
7. For a burst length of one, A0–A9 select the unique col-
umn to be accessed, and mode register bit M3 is
ignored.
CAS Latency Diagram
CAS Latency
Operating Mode
Table 7: Burst Definition
BURST
LENGTH
STARTING
COLUMN
ORDER OF ACCESSES WITHIN
A BURST ADDRESS
TYPE =
SEQUENTIAL
TYPE =
INTERLEAVED
A0
A1 A0
A2 A1 A0
…Cn - 1, Cn…
Not Supported
CLK
DQ
T2T1 T3T0
CAS Latency = 3
LZ
D
OUT
t
OH
t
COMMAND
NOPREAD
t
AC
NOP
T4
NOP
DON’T CARE
UNDEFINED
CLK
DQ
T2T1 T3T0
CAS Latency = 2
LZ
D
OUT
t
OH
t
COMMAND
NOPREAD
t
AC
NOP
128MB (x64, SR), 256MB (x64, DR)
168-PIN SDRAM UDIMM
PDF: 09005aef8137b07b/Source: 09005aef8137b02d Micron Technology, Inc., reserves the right to change products or specifications without notice.
SD8_16C16_32x64AG.fm - Rev. E 12/10 EN
11 ©2003, 2004 Micron Technology, Inc. All rights reserved.
Write Burst Mode
CLOCK FREQUENCY (MHZ)
CAS LATENCY = 2 CAS LATENCY = 3
≤≤
≤≤
≤≤
PDF: 09005aef8137b07b/Source: 09005aef8137b02d Micron Technology, Inc., reserves the right to change products or specifications without notice.
SD8_16C16_32x64AG.fm - Rev. E 12/10 EN
12 ©2003, 2004 Micron Technology, Inc. All rights reserved.
NOTE:
1. A0–A11provide device row address, and BA0, BA1 determine which device bank is made active.
2. A0–A9 provide device column address; A10 HIGH enables the auto precharge feature (nonpersistent), while A10 LOW
disables the auto precharge feature; BA0, BA1 determine which device bank is being read from or written to.
3. A10 LOW: BA0, BA1 determine which device bank is being precharged. A10 HIGH: all device banks are precharged and
BA0, BA1 are “Don’t Care.”
4. This command is AUTO REFRESH if CKE is HIGH, SELF REFRESH if CKE is LOW.
5. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE.
6. A0–A11 define the op-code written to the mode register.
7. Activates or deactivates the DQs during WRITEs (zero-clock delay) and READs (two-clock delay).
Table 9: SDRAM Commands and DQMB Operation Truth Table
NAME (FUNCTION) CS# RAS# CAS# WE# DQMB ADDR DQ NOTES
XXX X X X
NO OPERATION (NOP)
LHHH X X X
ACTIVE (Select bank and activate row)
L L H H X Bank/Row X 1
READ (Select bank and column, and start READ burst)
LHLHL/H8Bank/ColX 2
WRITE (Select bank and column, and start WRITE burst)
L H L L L/H8 Bank/Col Valid 2
BURST TERMINATE
LHHL X XActive
PRECHARGE (Deactivate row in bank or banks)
LLHL X Code X 3
AUTO refresh or Self Refresh (Enter self refresh mode)
LLLHX X X4, 5
LOAD MODE REGISTER
LLLL XOp-codeX 6
Write Enable/Output Enable
–––– L Active7

MT16LSDT3264AY-133G3

Mfr. #:
Manufacturer:
Micron
Description:
MODULE SDRAM 256MB 168UDIMM
Lifecycle:
New from this manufacturer.
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