HMC7950 Data Sheet
Rev. 0 | Page 12 of 16
THEORY OF OPERATION
The HMC7950 is a GaAs, pHEMT, MMIC low noise amplifier.
Its basic architecture is that of a single-supply, biased cascode
distributed amplifier with an integrated RF choke for the drain.
The cascode distributed architecture uses a fundamental cell
consisting of a stack of two field effect transistors (FETs) with
the source of the upper FET connected to the drain of the lower
FET. The fundamental cell is then duplicated several times, with
a transmission line feeding the RFIN signal to the gates of the
lower FETs and a separate transmission line interconnecting the
drains of the upper FETs and routing the amplified signal to the
RFOUT pin. Additional circuit design techniques around each
cell optimize the overall performance for broadband operation.
The major benefit of this architecture is that high performance
is maintained across a bandwidth far greater than a single
instance of the fundamental cell can provide. A simplified
schematic of this architecture is shown in Figure 37.
Although the gate bias voltages of the upper FETs are set internally
by a resistive voltage divider connected to V
DD
, the V
GG
2 pin
provides the user with an optional means of changing the gate
bias of the upper FETs. Application of a voltage to V
GG
2 allows
the user to change the voltage output by the resistive divider,
altering the gate bias of the upper FETs and thus changing the
gain. Application of V
GG
2 voltages across the range of −2.0 V to
+2.6 V affects gain changes of approximately 30 dB, depending
on the frequency. Increasing the voltage applied to V
GG
2 increases
the gain, whereas decreasing the voltage decreases the gain. For
V
DD
= 5.0 V (nominal), the resulting V
GG
2 open circuit voltage
is approximately 2.2 V.
Figure 37. Architecture and Simplified Schematic
V
GG
2
V
DD
TRANSMISSION
LINE
TRANSMISSION
LINE
R
FOU
T
RFI
N
15412-036
Data Sheet HMC7950
Rev. 0 | Page 13 of 16
APPLICATIONS INFORMATION
Capacitive bypassing is recommended for V
DD
, as shown in the
typical application circuit in Figure 38. Gain control is possible
through the application of a dc voltage to V
GG
2. If gain control is
used, capacitive bypassing of V
GG
2 is recommended as shown in
the typical application circuit. If gain control is not used, V
GG
2
can be either left open or capacitively bypassed as shown in
Figure 38.
The recommended bias sequence during power-up is as follows:
1. Set V
DD
to 5.0 V (this results in an I
DD
near its specified
typical value).
2. If the gain control function is to be used, apply a voltage
within the range of −2.0 V to +2.6 V to V
GG
2 until the
desired gain setting is achieved.
3. Apply the RF input signal.
The recommended bias sequence during power-down is as
follows:
1. Turn off the RF input signal.
2. Remove the V
GG
2 voltage, or set it to 0 V.
3. Set V
DD
to 0 V.
Power-up and power-down sequences can differ from the ones
described, although care must always be taken to ensure adherence
to the values shown in the Absolute Maximum Ratings section.
Unless otherwise noted, all measurements and data shown were
taken using the typical application circuit as configured on the
HMC7950 evaluation board. The bias conditions shown in the
Specifications section are recommended to optimize the overall
performance. Operation using other bias conditions may result
in performance that differs from the data shown in this data sheet.
Figure 38. Typical Application Circuit
V
DD
10nF
4.7µF
100pF
+
10nF4.7µF
V
GG
2
100pF
RFOUT
RFIN
PACKAGE
BASE
GND
123
11109
16
12
13
14
15
4
8
7
6
5
15412-037
HMC7950 Data Sheet
Rev. 0 | Page 14 of 16
EVALUATION BOARD
The HMC7950 evaluation board is a 2-layer board fabricated
using Rogers 4350 and using best practices for high frequency
RF design. The RF input and RF output traces have a 50 Ω
characteristic impedance.
The evaluation board and populated components are designed
to operate over the ambient temperature range of −40°C to
+85°C. For the proper bias sequence, see the Applications
Information section.
The evaluation board schematic is shown in Figure 40. A fully
populated and tested evaluation board, shown in Figure 39, is
available from Analog Devices, Inc., upon request.
Figure 39. Evaluation PCB
Table 8. Bill of Materials for Evaluation PCB EV1HMC7950LS6
Item Description
RFIN, RFOUT PCB mount, K connector, SRI Part Number 21-146-1000-92
C1, C7 100 pF capacitor, 5%, 50 V, C0G, 0402 package
C3, C8 10 nF capacitor, 10%, 16 V, X7R, 0402 package
C5, C9
4.7 µF tantalum capacitor, 10%, 20 V, 1206 package
U1 Amplifier, HMC7950LS6
PCB Evaluation PCB; circuit board material: Rogers 4350
VDD, VGG2 DC pins, Molex Part Number 87759-0414
C2, C4, C6, J3, J4, VGG Do not install (DNI)
H7950
J3
J4
ANALOG
DEVICES
1
2
VDD
VGG2
1 2
C5
C3
C1
C9
C7
C8
U1
08-043402 REV B
HMC7950LS6 EVAL
VGG
1
2
C2
C4
C6
RFOUT
RFIN
15412-038

HMC7950LS6TR

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Amplifier 2-28GHz LNA
Lifecycle:
New from this manufacturer.
Delivery:
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