Data Sheet HMC7950
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage (V
) 8 V
Second Gate Bias Voltage (V
GG
2)
Radio Frequency Input Power (RFIN) 20 dBm
Channel Temperature 175°C
Continuous Power Dissipation (P
DISS
),
T
= 85°C (Derate 17.2 mW/°C Above 85°C)
1.55 W
Maximum Peak Reflow Temperature (MSL3)
1
260°C
Storage Temperature Range
Operating Temperature Range −40°C to +85°C
ESD Sensitivity, Human Body Model (HBM) 250 V (Class 1A)
1
See the Ordering Guide section for more information.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JC
is the junction to case thermal resistance.
Table 6. Thermal Resistance
Package Type θ
Unit
EP-16-2
1
58 °C/W
1
Channel to ground pad. See JEDEC Standard JESD51-2 for additional
information on optimizing the thermal impedance
ESD CAUTION