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1447F–PLD–11/08
ATF750LVC
23. ATF750LVC Ordering Information
23.1 ATF750LVC Green Package Options (Pb/Halide-free/RoHS Compliant)
Note: 1. Special order only; TSSOP package requires special thermal management.
t
PD
(ns)
t
COS
(ns)
Ext. f
MAXS
(MH
z
) Ordering Code Package Operation Range
15 10 55
ATF750LVC-15JU
ATF750LVC-15PU
ATF750LVC-15SU
ATF750LVC-15XU
(1)
28J
24P3
24S
24X
Industrial
(-40°C to 85°C)
Package Type
28J 28-Lead, Plastic J-leaded Chip Carrier (PLCC)
24P3 24-lead, 0.300’ Wide, Plastic Dual Inline Package (PDIP)
24S 24-lead, 0.300” Wide, Plastic Gull Wing Small Outline (SOIC)
24X* 24-lead, 0.173” Wide, Thin Shrink Small Outline (TSSOP)
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1447F–PLD–11/08
ATF750LVC
24. Package Information
24.1 28J – PLCC
2325 Orchard Parkway
San Jose, CA 95131
R
TITLE
DRAWING NO.
REV.
B
28J, 28-lead, Plastic J-leaded Chip Carrier (PLCC)
28J
10/04/01
1.14(0.045) X 45˚
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.51(0.020)MAX
0.318(0.0125)
0.191(0.0075)
A2
45˚ MAX (3X)
A
A1
B1
D2/E2
B
e
E1 E
D1
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This package conforms to JEDEC reference MS-018, Variation AB.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
A 4.191 4.572
A1 2.286 3.048
A2 0.508
D 12.319 12.573
D1 11.430 11.582 Note 2
E 12.319 12.573
E1 11.430 11.582 Note 2
D2/E2 9.906 10.922
B 0.660 0.813
B1 0.330 0.533
e 1.270 TYP
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1447F–PLD–11/08
ATF750LVC
24.2 24P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
24P3, 24-lead (0.300"/7.62 mm Wide) Plastic Dual
Inline Package (PDIP)
D
24P3
6/1/04
PIN
1
E1
A1
B
E
B1
C
L
SEATING PLANE
A
D
e
eB
eC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 5.334
A1 0.381 –
D 31.623 32.131 Note 2
E 7.620 8.255
E1 6.096 7.112 Note 2
B 0.356 – 0.559
B1 1.270 1.651
L 2.921 3.810
C 0.2030.356
eB 10.922
eC 0.000 1.524
e 2.540 TYP
Notes: 1. This package conforms to JEDEC reference MS-001, Variation AF.
2. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").

ATF750LVC-15XU

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
CPLD - Complex Programmable Logic Devices 750 GATE LOW POWER - 15NS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union