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AT25128A-10PU-1.8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
16
3368J–SEEPR–06/07
AT25128A_256A
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics
tables.
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for wafer form. Bumped die available upon request. Please contact
Serial Interface Marketing.
AT25256A Ordering Information
(1)
Ordering Code Package Operation Range
AT25256A-10PU-2.7
(2)
AT25256A-10PU-1.8
(2)
AT25256AN-10SU-2.7
(2)
AT25256AN-10SU-1.8
(2)
AT25256AW-10SU-2.7
(2)
AT25256AW-10SU-1.8
(2)
AT25256A-10TU-2.7
(2)
AT25256A-10TU-1.8
(2)
AT25256AU2-10UU-1.8
(2)
AT25256AY7-10YH-1.8
(2)
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U2-1
8Y7
Lead-free/Halogen-free/
Industrial Temperature
(40Cto85C)
AT25256A-W1.8-11
(3)
Die Sale
Industrial Temperature
(40Cto85C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8S2 8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8U2-1 8-ball, die Ball Grid Array Package (dBGA2)
8A2 8-lead, 4.4 mm Body, Thin Shrink Small Outline Package (TSSOP)
8Y7 8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
Options
2.7 Low-voltage (2.7V to 5.5V)
1.8 Low-voltage (1.8V to 5.5V)
17
3368J–SEEPR–06/07
AT25128A_256A
6. Packaging Information
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
A
–
–
0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005
–
–
3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
Top View
Side View
End View
18
3368J–SEEPR–06/07
AT25128A_256A
8S1 – JEDEC SOIC
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
Note:
3/17/05
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
8S1 C
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 – 0.25
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.05
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
θ 0˚ – 8˚
Ø
Ø
E
E
1
1
N
N
TOP VIEW
TOP VIEW
C
C
E1
E1
END VIEW
A
A
b
b
L
L
A1
A1
e
e
D
D
SIDE VIEW
SIDE VIEW
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24

AT25128A-10PU-1.8

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Buy AT25128A-10PU-1.8
Manufacturer:
Description:
IC EEPROM 128K SPI 20MHZ 8DIP
Lifecycle:
New from this manufacturer.
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