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AT25128A-10PU-1.8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
19
3368J–SEEPR–06/07
AT25128A_256A
8S2 – EIAJ SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8S2, 8-lead, 0.209" Body, Plastic Small
Outline Package (EIAJ)
10/7/03
8S2
C
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs are not included.
3. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.
4. Determines the true geometric position.
5. Values b and C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer shall be 0.010 +0.010/−0.005 mm.
A 1.70 2.16
A1 0.05 0.25
b 0.35 0.48 5
C 0.15 0.35 5
D 5.13 5.35
E1 5.18 5.40 2, 3
E 7.70 8.26
L 0.51 0.85
∅
0° 8°
e 1.27 BSC 4
End View
Side View
e
b
A
A1
D
E
N
1
C
E1
∅
L
Top View
20
3368J–SEEPR–06/07
AT25128A_256A
8U2-1 – dBGA2
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
PO8U2-1
A
6/24/03
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
A 0.81 0.91 1.00
A1 0.15 0.20 0.25
A2 0.40 0.45 0.50
b 0.25 0.30 0.35 1
D 2.35 BSC
E 3.73 BSC
e 0.75 BSC
e1 0.74 REF
d 0.75 BSC
d1 0.80 REF
1. Dimension 'b' is measured at the maximum solder ball diameter.
This drawing is for general information only.
d
A
Side View
Top View
Bottom View
8 Solder Balls
1
A
B
C
D
2
(e1)
e
A1 BALL PAD CORNER
(d1)
1. b
A1
A2
D
A1 BALL PAD CORNER
E
21
3368J–SEEPR–06/07
AT25128A_256A
8A2 – TSSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
5/30/02
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 2.90 3.00 3.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
A – – 1.20
A2 0.80 1.00 1.05
b 0.19 – 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
8A2
B
Side View
End View
Top View
A2
A
L
L1
D
123
E1
N
b
Pin 1 indicator
this corner
E
e
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24

AT25128A-10PU-1.8

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Buy AT25128A-10PU-1.8
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Description:
IC EEPROM 128K SPI 20MHZ 8DIP
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