NP50P04KDG-E1-AY

Data Sheet D18688EJ3V0DS
2
NP50P04KDG
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Zero Gate Voltage Drain Current IDSS VDS = 40 V, VGS = 0 V 10
μ
A
Gate Leakage Current IGSS VGS = m20 V, VDS = 0 V m100 nA
Gate to Source Threshold Voltage VGS(th) VDS = 10 V, ID = 1 mA 1.0 1.6 2.5 V
Forward Transfer Admittance
Note
| y
fs | VDS = 10 V, ID = 25 A 15 30 S
Drain to Source On-state Resistance
Note
R
DS(on)1 VGS = 10 V, ID = 25 A 7.9 10 mΩ
RDS(on)2 VGS = 4.5 V, ID = 25 A 9.8 15 mΩ
Input Capacitance Ciss VDS = 10 V, 5100 pF
Output Capacitance Coss VGS = 0 V, 790 pF
Reverse Transfer Capacitance Crss f = 1 MHz 440 pF
Turn-on Delay Time td(on) VDD = 20 V, ID = 25 A, 20 ns
Rise Time tr VGS = 10 V, 45 ns
Turn-off Delay Time td(off) RG = 0 Ω 405 ns
Fall Time tf 230 ns
Total Gate Charge QG VDD = 32 V, 100 nC
Gate to Source Charge QGS VGS = 10 V, 13 nC
Gate to Drain Charge QGD ID = 50 A 42 nC
Body Diode Forward Voltage
Note
V
F(S-D) IF = 50 A, VGS = 0 V 0.95 1.5 V
Reverse Recovery Time trr IF = 50 A, VGS = 0 V, 48 ns
Reverse Recovery Charge Qrr di/dt = 100 A/
μ
s 66 nC
Note Pulsed test PW 350
μ
s, Duty Cycle 2%
TEST CIRCUIT 1 AVALANCHE CAPABILITY
R
G
= 25 Ω
50 Ω
L
V
DD
V
GS
= 20 0 V
BV
DSS
I
AS
I
D
V
DS
Starting T
ch
V
DD
D.U.T.
TEST CIRCUIT 3 GATE CHARGE
TEST CIRCUIT 2 SWITCHING TIME
PG.
R
G
0
V
GS
()
D.U.T.
R
L
V
DD
τ = 1 s
μ
Duty Cycle 1%
V
GS
Wave Form
V
DS
Wave Form
V
GS
()
10%
90%
V
GS
10%
0
V
DS
()
90%90%
t
d(on)
t
r
t
d(off)
t
f
10%
τ
V
DS
0
t
on
t
off
PG.
PG.
50 Ω
D.U.T.
R
L
V
DD
I
G
= 2 mA
Data Sheet D18688EJ3V0DS
3
NP50P04KDG
TYPICAL CHARACTERISTICS (TA = 25°C)
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
TOTAL POWER DISSIPATION vs.
CASE TEMPERATURE
dT - Percentage of Rated Power - %
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175 200
T
ch - Channel Temperature - °C
PT - Total Power Dissipation - W
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175 200
T
C - Case Temperature - °C
FORWARD BIAS SAFE OPERATING AREA
ID - Drain Current - A
-0.01
-0.1
-1
-10
-100
-1000
-0.1 -1 -10 -100
I
D(DC)
I
D(pulse)
R
DS(on)
Limited
(V
GS
=
10 V)
P
W
=
1
i
0
0
μ
s
1
i
m
i
s
1
i
0
m
i
s
DC
T
C
= 25°C
Single Pulse
P
o
w
e
r
D
i
s
s
i
p
a
t
i
o
n
L
i
m
i
t
e
d
V
DS - Drain to Source Voltage - V
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
rth(t) - Transient Thermal Resistance - °C/W
0.01
0.1
1
10
100
1000
R
th(ch-A)
= 83.3°C/Wi
R
th(ch-C)
= 1.67
°
C/Wi
Single Pulse
PW - Pulse Width - s
100
μ
1 m 10 m 100 m 1 10 100 1000
Data Sheet D18688EJ3V0DS
4
NP50P04KDG
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
FORWARD TRANSFER CHARACTERISTICS
ID - Drain Current - A
0
-50
-100
-150
0 -1-2-3
VGS =
10 V
Pulsed
4.5 V
V
DS - Drain to Source Voltage - V
ID - Drain Current - A
-0.001
-0.01
-0.1
-1
-10
-100
-1000
0 -1-2-3-4-5
V
DS
=
10 V
Pulsed
T
ch
=
55
°
C
25°C
25°C
75°C
125
°
C
150
°
C
175
°
C
V
GS - Gate to Source Voltage - V
GATE TO SOURCE THRESHOLD VOLTAGE vs.
CHANNEL TEMPERATURE
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
VGS(th) - Gate to Source Threshold Voltage - V
0
-0.5
-1
-1.5
-2
-2.5
-3
-75 -25 25 75 125 175 225
V
DS
=
10 V
I
D
=
1 mA
T
ch - Channel Temperature - °C
| yfs | - Forward Transfer Admittance - S
0.1
1
10
100
-0.1 -1 -10 -100
VDS =
10 V
Pulsed
T
ch
=
55
°
C
25°C
25
°
C
75
°
C
125°C
150°C
175
°
C
I
D - Drain Current - A
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
DRAIN CURRENT
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
RDS(on) - Drain to Source On-state Resistance - mΩ
0
10
20
30
40
-1 -10 -100 -1000
10 V
Pulsed
V
GS
=
4.5 V
I
D - Drain Current - A
RDS(on) - Drain to Source On-state Resistance - mΩ
0
10
20
30
0 -5 -10 -15 -20
Pulsed
I
D
=
50
A
25
A
10
A
V
GS - Gate to Source Voltage - V

NP50P04KDG-E1-AY

Mfr. #:
Manufacturer:
Description:
MOSFET P-CH 40V 50A TO-263
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