ADN2815 Data Sheet
Rev. C | Page 24 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
916
17
24
25
8
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
3.25
3.10 SQ
2.95
EATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 22. 32-Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADN2815ACPZ −40°C to +85°C 32-Lead LFCSP_WQ CP-32-7
ADN2815ACPZ-500RL7 −40°C to +85°C 32-Lead LFCSP_WQ, Tape-Reel, 500 pieces CP-32-7
ADN2815ACPZ-RL7 −40°C to +85°C 32-Lead LFCSP_WQ, Tape-Reel, 1,500 pieces CP-32-7
EVAL-ADN2815EBZ Evaluation Board
EVAL-ADN2815EB Evaluation Board
1
Z = RoHS Compliant Part.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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registered trademarks are the property of their respective owners.
D04952-0-4/14(C)
