ADN2815 Data Sheet
Rev. C | Page 18 of 24
Additional Features Available via the I
2
C Interface
Coarse Data Rate Readback
The data rate can be read back over the I
2
C interface to
approximately ±10% without the need of an external reference
clock. A 9-bit register, COARSE_RD[8:0], can be read back
when LOL is deasserted. The eight MSBs of this register are the
contents of the RATE[7:0] register. The LSB of the
COARSE_RD register is Bit MISC[0].
Table 13 provides coarse data rate readback to within ±10%.
System Reset
A frequency acquisition can be initiated by writing a 1 followed
by a 0 to the I
2
C Register Bit CTRLB[5]. This initiates a new
frequency acquisition while keeping the ADN2815 in the
operating mode that it was previously programmed to in
Registers CTRL[A], CTRL[B], and CTRL[C].
Data Sheet ADN2815
Rev. C | Page 19 of 24
APPLICATIONS INFORMATION
PCB DESIGN GUIDELINES
Proper RF PCB design techniques must be used for optimal
performance.
Power Supply Connections and Ground Planes
Use of one low impedance ground plane is recommended. The
VEE pins should be soldered directly to the ground plane to
reduce series inductance. If the ground plane is an internal
plane and connections to the ground plane are made through
vias, multiple vias can be used in parallel to reduce the series
inductance, especially on Pin 23, which is the ground return for
the output buffers. The exposed pad should be connected to the
GND plane using plugged vias so that solder does not leak
through the vias during reflow.
Use of a 22 µF electrolytic capacitor between VCC and VEE is
recommended at the location where the 3.3 V supply enters the
PCB. When using 0.1 µF and 1 nF ceramic chip capacitors, they
should be placed between the IC power supply VCC and VEE,
as close as possible to the ADN2815 VCC pins.
If connections to the supply and ground are made through vias,
the use of multiple vias in parallel helps to reduce series
inductance, especially on Pin 24, which supplies power to the
high speed CLKOUTP/CLKOUTN and DATAOUTP/
DATAOUTN output buffers. Refer to Figure 19 for the
recommended connections.
By using adjacent power supply and GND planes, excellent high
frequency decoupling can be realized by using close spacing
between the planes. This capacitance is given by
( )
pFε. A/dC
r
PLANE
880=
where:
ε
r
is the dielectric constant of the PCB material.
A is the area of the overlap of power and GND planes (cm
2
).
d is the separation between planes (mm).
For FR-4, ε
r
= 4.4 mm and 0.25 mm spacing, C ~15 pF/cm
2
.
50 TRANSMISSION LINES
DATAOUTP
DAT
AOUTN
CLKOUT
P
CLKOUTN
0.1µF22µF
1nF
0.1µF
0.1µF
0.1µF
0.1µF
0.47µF ±20%
>300MΩ INSUL ATION RESIS
TANCE
1nF
1nF
1nF
0.1µF
1nF
+
VCC
50Ω
50Ω
OPTICAL
TRANSCEIVER
MODULE
VCC
NC
NC
µC
I
2
C CONTROLLER
I
2
C CONTROLLER
VCC
VCC
04952-0-031
1
VCC
2
VCC
3
VREF
4
NIN
5
PIN
6
NC
7
NC
8
VEE
24
VCC
23
VEE
22
NC
21
SDA
20
SCK
19
SADDR5
18
VCC
17
VEE
9
10
REFCLK
P
11
REFCLKN
12
VCC
13
VEE
14
CF2
15
CF1
16
LO
L
32
VCC
31
VCC
30
VEE
29
D
AT
AOUT
P
28
D
AT
AOUTN
27
SQUELCH
26
CLKOUTP
25
CLKOUTN
EXPOSED PAD
TIED OFF TO
VEE PLANE
WITH VIAS
Figure 19. Typical ADN2815 Applications Circuit
ADN2815 Data Sheet
Rev. C | Page 20 of 24
Transmission Lines
Use of 50 Ω transmission lines is required for all high frequency
input and output signals to minimize reflections: PIN, NIN,
CLKOUTP, CLKOUTN, DATAOUTP and DATAOUTN (also
REFCLKP and REFCLKN, if a high frequency reference clock is
used, such as 155 MHz). It is also necessary for the PIN/NIN
input traces to be matched in length, and the CLKOUTP/
CLKOUTN and DATAOUTP/DATAOUTN output traces to be
matched in length to avoid skew between the differential traces.
The high speed inputs, PIN and NIN, are internally terminated
with 50 Ω to an internal reference voltage (see Figure 20).
A 0.1 μF is recommended between VREF, Pin 3, and GND to
provide an ac ground for the inputs.
As with any high speed mixed-signal design, take care to keep
all high speed digital traces away from sensitive analog nodes.
04952-0-026
C
IN
C
IN
50
0.1F
50
3k
NIN
PIN
ADN2815
2.5V
VREF
50
50
TIA
V
CC
Figure 20. ADN2815 AC-Coupled Input Configuration
Soldering Guidelines for Lead Frame Chip Scale Package
The lands on the 32-lead LFCSP are rectangular. The printed
circuit board (PCB) pad for these should be 0.1 mm longer than
the package land length and 0.05 mm wider than the package
land width. The land should be centered on the pad. This
ensures that the solder joint size is maximized. The bottom of
the chip scale package has a central exposed pad. The pad on
the PCB should be at least as large as this exposed pad. The user
must connect the exposed pad to VEE using plugged vias so
that solder does not leak through the vias during reflow. This
ensures a solid connection from the exposed pad to VEE.
Choosing AC Coupling Capacitors
AC coupling capacitors at the input (PIN, NIN) and output
(DATAOUTP, DATAOUTN) of the ADN2815 must be chosen
such that the device works properly over the full range of data
rates used in the application. When choosing the capacitors, the
time constant formed with the two 50 Ω resistors in the signal
path must be considered. When a large number of consecutive
identical digits (CIDs) are applied, the capacitor voltage can
droop due to baseline wander (see Figure 21), causing pattern-
dependent jitter (PDJ).
The user must determine how much droop is tolerable and
choose an ac coupling capacitor based on that amount of droop.
The amount of PDJ can then be approximated based on the
capacitor selection. The actual capacitor value selection can
require some trade-offs between droop and PDJ.
For example, assuming 2% droop can be tolerated, then the
maximum differential droop is 4%. Normalizing to V p-p:
Droop = Δ V = 0.04 V = 0.5 V p-p (1 − e
–t/τ
); therefore, τ = 12t
where:
τ is the RC time constant (C is the ac coupling capacitor, R =
100 Ω seen by C).
t is the total discharge time, which is equal to nT.
n is the number of CIDs.
T is the bit period.
The capacitor value can then be calculated by combining the
equations for τ and t:
C = 12 nT/R
Once the capacitor value is selected, the PDJ can be
approximated as
6.0/15.0
r
nT/RC
pspp
etPDJ
where:
PDJ
pspp
is the amount of pattern-dependent jitter allowed;
< 0.01 UI p-p typical.
t
r
is the rise time, which is equal to 0.22/BW,
where BW ~ 0.7 (bit rate).
Note that this expression for t
r
is accurate only for the inputs.
The output rise time for the ADN2815 is ~100 ps, regardless of
data rate.

ADN2815ACPZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Timers & Support Products Anyrate 10 Mbps to 2.7Gbps PA/CDR
Lifecycle:
New from this manufacturer.
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