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LT5518EUF#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
LT5518
13
5518f
Figure 12. Bottom Side Layout of Demo Board
Figure 13. 1.5GHz to 2.4GHz Direct Conversion Transmitter
Application with LO Feedthrough and Image Calibration Loop
90°
0°
LT5518
BASEBAND
GENERATOR
CAL
LO FEEDTHROUGH CAL OUT
IMAGE CAL OUT
PA
VCO/SYNTHESIZER
RF = 1.5GHz
TO 2.4GHz
EN
2, 4, 6, 9, 10, 12, 15, 17
100nF
×2
5V
V-I
V-I
I-CHANNEL
Q-CHANNEL
BALUN
14
16
1
7
5
8, 13
V
CC
11
3
5518 F13
I-DAC
Q-DAC
ADC
Application Measurements
The LT5518 is recommended for base-station applications
using various modulation formats. Figure 13 shows a
typical application. The CAL box in Figure 13 allows for
LO feedthrough and Image suppression calibration. Fig-
ure 14 shows the ACPR performance for W-CDMA using
one or four channel modulation. Figures 15, 16 and 17
illustrate the 1, 2 and 4-channel W-CDMA measurement.
To calculate ACPR, a correction is made for the spectrum
analyzer noise fl oor.
If the output power is high, the ACPR will be limited by the
linearity performance of the part. If the output power is
low, the ACPR will be limited by the noise performance of
the part. In the middle, an optimum ACPR is obtained.
Because of the LT5518’s very high dynamic range, the test
equipment can limit the accuracy of the ACPR measure-
ment. Consult the factory for advice on ACPR measure-
ment, if needed.
The ACPR performance is sensitive to the amplitude match
of the BBIP and BBIM (or BBQP and BBQM) input voltage.
This is because a difference in AC voltage amplitude will
give rise to a difference in amplitude between the even-order
harmonic products generated in the internal V-I converter.
As a result, they will not cancel out entirely. Therefore, it
APPLICATIO S I FOR ATIO
WUU
U
Figure 11. Component Side Layout of Demo Board
LT5518
14
5518f
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
RF FREQUENCY (MHz)
2125
5518 F16
2130 2135 2140 2145 2150 2155
POWER IN 30kHz BW (dBm)
DOWNLINK TEST
MODEL 64 DPCH
UNCORRECTED
SPECTRUM
CORRECTED
SPECTRUM
SYSTEM NOISE FLOOR
RF OUTPUT POWER PER CARRIER (dBm)
–34 –30 –26 –22 –18 –14 –10
)cBd( RPCTLA ,RP
C
A
)
z
H
/
m
Bd
( TESF
F
O
z
H
M03 T
A
ROOLF ESION
–65
–60
–55
5518 F14
–70
–75
–85
–80
–145
–140
–135
–150
–155
–165
–160
4-CH ACPR
4-CH NOISE
1-CH NOISE
4-CH ALTCPR
1-CH ALTCPR
1-CH ACPR
DOWNLINK TEST MODEL 64 DPCH
–40
–45
–50
–55
–60
–65
–70
–75
–80
–85
–90
TEMPERATURE (°C)
–40
5518 F18
–200 20406080
LO FT (dBm), IR (dB)
LO FEEDTHROUGH
IMAGE REJECTION
CALIBRATED WITH P
RF
= –30dBm
–40
–50
–60
–70
–80
–90
–110
–100
–120
–130
RF FREQUENCY (MHz)
2115
5518 F17
2125 2135 2145 2155 2165
POWER IN 30kHz BW (dBm)
DOWNLINK
TEST
MODEL 64
DPCH
UNCORRECTED
SPECTRUM
CORRECTED
SPECTRUM
SYSTEM NOISE FLOOR
RF FREQUENCY (MHz)
2127.5
POWER IN 30kHz BW (dBm)
2147.52142.5
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
5518 F15
2137.52132.5 2152.5
DOWNLINK TEST
MODEL 64 DPCH
CORRECTED
SPECTRUM
UNCORRECTED
SPECTRUM
SYSTEM NOISE FLOOR
is important to keep the amplitudes at the BBIP and BBIM
inputs (or BBQP and BBQM) as equal as possible.
When the temperature is changed after calibration, the LO
feedthrough and the Image Rejection performance will
change. This is illustrated in Figure 18. The LO feedthrough
and Image Rejection can also change as function of the
baseband drive level, as is depicted in Figure 19. The RF
output power, IM2 and IM3 vs two-tone baseband drive
level are given in Figure 20.
Figure 14. W-CDMA ACPR, ALTCPR and Noise vs
RF Output Power at 2140MHz for 1 and 4 Channels
Figure 15. 1-Channel W-CDMA Spectrum
Figure 16. 2-Channel W-CDMA
Spectrum
Figure 18. LO Feedthrough and
Image Rejection vs Temperature
after Calibration at 25°C
Figure 17. 4-Channel W-CDMA
Spectrum
APPLICATIO S I FOR ATIO
WUU
U
LT5518
15
5518f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
UF Package
16-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1692)
Figure 19. Image Rejection and LO Feedthrough
vs Baseband Drive Voltage After Calibration at 25°C
and V
BBI
= 0.2V
P-P, DIFF
f
BBI
= 2MHz, 2.1MHz, 0°
f
BBQ
= 2MHz, 2.1MHz, 90°
P
LO
= 0dBm
f
RF
= f
BB
+ f
LO
f
LO
= 2.14GHz
IM2 = POWER AT f
LO
+ 4.1MHz
IM3 = MAX POWER AT
f
LO
+ 1.9MHz or f
LO
+ 2.2MHz
V
CC
= 5V
EN = HIGH
I AND Q BASEBAND VOLTAGE (V
P-P, DIFF, EACH TONE
)
0.1
–90
–80
–40
HD2, HD3 (dBc)
–70
–60
–50
–30
–20
–10
0
10
110
5518 F20
T
A
= –40°C
T
A
= 85°C
T
A
= 25°C
RF
IM3
IM2
Figure 20. RF Two-Tone Power, IM2 and
IM3 at 2140MHz vs Baseband Voltage
I AND Q BASEBAND VOLTAGE (V
P-P, DIFF
)
0
P
RF,
LO FT (dBm), IR (dBc)
20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
4
5518 F19
1
2
3
5
T
A
= –40°C
T
A
= 85°C
T
A
= 25°C
LO FT
IR
P
RF
f
BBI
= 2MHz, 0°
f
BBQ
= 2MHz, 90°
P
LO
= 0dBm
f
RF
= f
BB
+ f
LO
f
LO
= 2.14GHz
V
CC
= 5V
EN = HIGH
APPLICATIO S I FOR ATIO
WUU
U
PACKAGE DESCRIPTIO
U
4.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.55 ± 0.20
1615
1
2
BOTTOM VIEW—EXPOSED PAD
2.15 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.30 ± 0.05
0.65 BSC
0.200 REF
0.00 – 0.05
(UF16) QFN 10-04
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.72 ±0.05
0.30 ±0.05
0.65 BSC
2.15 ± 0.05
(4 SIDES)
2.90 ± 0.05
4.35 ± 0.05
PACKAGE OUTLINE
PIN 1 NOTCH R = 0.20 TYP
OR 0.35 × 45° CHAMFER
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

LT5518EUF#PBF

Mfr. #:
Buy LT5518EUF#PBF
Manufacturer:
Analog Devices Inc.
Description:
Modulator / Demodulator 2GHz Direct Quadrature Modulator
Lifecycle:
New from this manufacturer.
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