MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS21267-P/AP
TRANSFER-MOLD TYPE
INSULATED TYPE
Oct. 2005
2.00
2.00
2.00
1.85
0.50
2.40
0.70
1
10
1.80
3.00
0.067
mA
V
T
j = 25°C
Tj = 125°C
I
C = 30A, Tj = 25°C
IC = 30A, Tj = 125°C
V
CE(sat)
VEC
ton
trr
tc(on)
toff
tc(off)
ICES
ConditionSymbol
Parameter
Limits
Inverter IGBT part (per 1/6 module)
Inverter FWDi part (per 1/6 module)
Case to fin (per 1 module) thermal grease applied
Rth(j-c)Q
Rth(j-c)F
Rth(c-f)F
Min.
THERMAL RESISTANCE
Typ. Max.
Unit
T
j = 25°C, –IC = 30A, VIN = 0V
Condition
Symbol
Parameter
Limits
Min. Typ. Max.
0.65
Unit
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise noted)
INVERTER PART
Collector-emitter saturation
voltage
FWDi forward voltage
Junction to case thermal
resistance (Note 3)
VD = VDB = 15V
VIN = 5V
Switching times
V
CC = 300V, VD = VDB = 15V
IC = 30A, Tj = 125°C, VIN = 0
5V
Inductive load (upper-lower arm)
Collector-emitter cut-off
current
V
CE = VCES
1.50
1.50
1.50
1.25
0.30
0.30
1.70
0.40
V
µs
µs
µs
µs
µs
°C/W
°C/W
°C/W
CONTROL (PROTECTION) PART
Note 4 : Short circuit protection is functioning only at the low-arms. Please select the external shunt resistance such that the SC trip-level is
less than 2.0 times of the collector current rating.
5:Fault signal is output when the low-arms short circuit or control supply under-voltage protective functions operate. The fault output pulse-
width tFO depends on the capacitance value of CFO according to the following approximate equation : CFO = 12.2 10
-6
tFO [F].
Symbol
I
D
VFOH
VFOL
VSC(ref)
IIN
UVDBt
UVDBr
UVDt
UVDr
tFO
Vth(on)
Vth(off)
Parameter Condition
Limits
Unit
Circuit current
Fault output voltage
Short circuit trip level
Control supply under-voltage
protection
Fault output pulse width
ON threshold voltage
OFF threshold voltage
V
D = VDB = 15V
V
IN = 5V
Total of V
P1-VPC, VN1-VNC
VUFB-VUFS, VVFB-VVFS, VWFB-VWFS
VSC = 0V, FO circuit pull-up to 5V with 10k
V
SC = 1V, IFO = 1mA
T
C = –20~100°C, VD = 15V (Note 4)
V
IN = 5V
Trip level
Reset level
Trip level
Reset level
C
FO = 22nF (Note 5)
Applied between U
P, VP, WP-VPC, UN, VN, WN-VNC
4.9
0.45
1.0
10.0
10.5
10.3
10.8
1.0
2.1
0.8
1.5
1.8
2.3
1.4
7.00
0.55
7.00
0.55
0.95
0.52
2.0
12.0
12.5
12.5
13.0
2.6
2.1
Min. Typ. Max.
mA
mA
mA
mA
V
V
V
mA
V
V
V
V
ms
V
V
V
D = VDB = 15V
V
IN = 0V
Total of V
P1-VPC, VN1-VNC
VUFB-VUFS, VVFB-VVFS, VWFB-VWFS
Tj 125°C
Note 3 : Grease with good thermal conductivity should be applied evenly with a thickness of about +100µm~+200µm on the contact surface
of DIP-IPM and heat-sink.
Input current
Contact thermal resistance
MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS21267-P/AP
TRANSFER-MOLD TYPE
INSULATED TYPE
Oct. 2005
Note 6 :
+
+
Measurement point
Heat sink
Heat sink
3mm
Place to contact
a heat sink
Mounting screw : M4
Condition
Parameter
Limits
Mounting torque
Weight
Heat-sink flatness
Min.
MECHANICAL CHARACTERISTICS AND RATINGS
Typ. Max.
0.98
–50
Unit
54
1.47
100
N·m
g
µm
Recommended : 1.18 N·m
(
Note 6
)
V
V
V
V/µs
µs
kHz
Arms
µs
V
Supply voltage
Control supply voltage
Control supply voltage
Control supply variation
Arm shoot-through blocking time
PWM input frequency
Allowable r.m.s. current
Minimum input pulse width
V
NC variation
Applied between P-N
Applied between V
P1-VPC, VN1-VNC
Applied between VUFB-VUFS, VVFB-VVFS, VWFB-VWFS
For each input signal, TC 100°C
T
C 100°C, Tj 125°C
V
CC = 300V, VD = VDB = 15V,
P.F = 0.8, sinusoidal PWM
T
C 100°C, Tj 125°C (Note 7)
(Note 8)
200 V
CC 350V,
13.5 V
D 16.5V,
13.0 V
DB 18.5V,
–20°C T
C 100°C,
N-line wiring inductance less
than 10nH (Note 9)
between V
NC-N (including surge)
400
16.5
18.5
1
20
19.0
11.6
5.0
V
CC
VD
VDB
V
D
, V
DB
tdead
fPWM
IO
PWIN(on)
PWIN(off)
V
NC
ConditionSymbol
Parameter
Recommended value
Min. Typ. Max.
0
13.5
13.0
–1
2
0.3
1.5
3.0
3.6
–5.0
Unit
RECOMMENDED OPERATION CONDITIONS
300
15.0
15.0
fPWM = 5kHz
f
PWM = 15kHz
Below rated current
Between rated current and
1.7 times of rated current
Between 1.7 times and
2.0 times of rated current
Note 7 : The Allowable r.m.s. current value depends on the actual application conditions.
8:Input signal with ON pulse width less than PWIN(on) might make no response.
9:IPM might make no response or response delay to next turn-on pulse if off-pulse width is less than PWIN(off). (Please refer to Fig. 4)
Please refer to Fig. 9 for recommended wiring method too.
MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
PS21267-P/AP
TRANSFER-MOLD TYPE
INSULATED TYPE
Oct. 2005
Fig. 4 CURRENT OUTPUT WHEN INPUT SIGNAL IS LESS THAN ALLOWABLE MINIMUM INPUT PULSE WIDTH PWIN(off) (P-side only)
DIP-IPM
U
OUT
VOUT
WOUT
VNO
CFO
GND
Fo
W
N
VN
UN
VCC
HVIC3
HVIC2
HVIC1
LVIC
CFO CIN
CIN
N
W
V
U
P
HO
IN
COM
VB
VS
VCC
HO
IN
COM
VB
VS
VCC
HO
IN
COM
VB
VS
VCC
Fo
W
N
VN
UN
WP
VP
UP
VNC
VN1
VP1
VP1
VP1
VWFS
VVFS
VUFS
VWFB
VVFB
VUFB
IGBT1
IGBT2
IGBT3
IGBT4
IGBT5
IGBT6
Di1
Di2
Di3
Di4
Di5
Di6
VPC
Fig. 5 THE DIP-IPM INTERNAL CIRCUIT
t1t2
Real line
...
off pulse width > PWIN(off) ; turn on time t1
Broken line
...
off pulse width < PWIN(off) ; turn on time t2
P-side control input
Internal IGBT gate
Output current Ic

PS21267-AP

Mfr. #:
Manufacturer:
Description:
MOD IPM 600V 30A DIP
Lifecycle:
New from this manufacturer.
Delivery:
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