Figure 3-5. Drift Compensation
The QT1010 drift compensation is asymmetric; the reference level drift-compensates in one direction
faster than it does in the other. Specifically, it compensates faster for decreasing signals than for
increasing signals. Increasing signals should not be compensated for quickly, since an approaching finger
could be compensated for partially or entirely before even approaching the sense electrode. However, an
obstruction over the sense pad, for which the sensor has already made full allowance, could suddenly be
removed leaving the sensor with an artificially elevated reference level and thus become insensitive to
touch. In this latter case, the sensor will compensate for the object's removal very quickly, usually in only
a few seconds.
With large values of Cs and small values of Cx, drift compensation will appear to operate more slowly
than with the converse. Note that the positive and negative drift compensation rates are different.
3.7 Response Time
The QT1010's response time is highly dependent on run mode and burst length, which in turn is
dependent on Cs and Cx. With increasing Cs, response time slows, while increasing levels of Cx reduce
response time. The response time will also be a lot slower in LP or SYNC mode due to a longer time
between burst measurements.
3.8 Spread Spectrum
The QT1010 modulates its internal oscillator by ±7.5% during the measurement burst. This spreads the
generated noise over a wider band, reducing emission levels. This also reduces susceptibility since there
is no longer a single fundamental burst frequency.
3.9 Output Features
3.9.1 Output
The output of the QT1010 is active-high upon detection.
The output will remain active-high for the duration of the detection, or until the Max On-duration expires,
whichever occurs first. If a Max On-duration timeout occurs first, the sensor performs a full recalibration
and the output becomes inactive (low) until the next detection.
3.9.2 HeartBeat Output
The QT1010 output has a HeartBeat “health” indicator superimposed on it in all modes. This operates by
taking the output pin into a three-state mode for 15 μs, once before every QT burst. This output state can
be used to determine that the sensor is operating properly, using one of several simple methods, or it can
be ignored.
AT42QT1010
© 2017 Microchip Technology Inc.
Datasheet
DS40001946A-page 13
The HeartBeat indicator can be sampled by using a pull-up resistor on the OUT pin (Figure 3-6), and
feeding the resulting positive-going pulse into a counter, flip flop, one-shot, or other circuit. The pulses will
only be visible when the chip is not detecting a touch.
Figure 3-6. Obtaining HeartBeat Pulses with a Pull-up Resistor (SOT23-6)
OUT
VDD
SNSK
SNS
SYNC/MODE
VSS
2
6
4
3
1
5
VDD
Ro
HeartBeat" Pulse
If the sensor is wired to a microcontroller as shown in Figure 3-7, the microcontroller can reconfigure the
load resistor to either Vss or Vdd depending on the output state of the QT1010, so that the pulses are
evident in either state.
Figure 3-7. Using a Microcontroller to Obtain HeartBeat Pulses in Either Output State (SOT23-6)
OUT
SNSK
SNS
SYNC/MODE
6
4
3
1
Ro
Microcontroller
Port_M.x
Port_M.y
Electromechanical devices like relays will usually ignore the short HeartBeat pulse. The pulse also has
too low a duty cycle to visibly affect LEDs. It can be filtered completely if desired, by adding an RC filter to
the output, or if interfacing directly and only to a high-impedance CMOS input, by doing nothing or at
most adding a small noncritical capacitor from OUT to Vss.
3.9.3 Output Drive
The OUT pin is active high and can sink or source up to 2 mA. When a large value of Cs (>20 nF) is
used, the OUT current should be limited to <1 mA to prevent gain-shifting side effects, which happen
when the load current creates voltage drops on the die and bonding wires; these small shifts can
materially influence the signal level to cause detection instability.
AT42QT1010
© 2017 Microchip Technology Inc.
Datasheet
DS40001946A-page 14
4. Circuit Guidelines
4.1 More Information
Refer to Application Note QTAN0002, "Secrets of a Successful QTouch
®
Design", and the "Touch
Sensors Design Guide" (both downloadable from http://www.microchip.com), for more information on
construction and design methods.
4.2 Sample Capacitor
Cs is the charge sensing sample capacitor. The required Cs value depends on the thickness of the panel
and its dielectric constant. Thicker panels require larger values of Cs. Typical values are 2 nF to 50 nF
depending on the sensitivity required; larger values of Cs demand higher stability and better dielectric to
ensure reliable sensing.
The Cs capacitor should be a stable type, such as X7R ceramic or PPS film. For more consistent sensing
from unit to unit, 5% tolerance capacitors are recommended. X7R ceramic types can be obtained in 5%
tolerance at little or no extra cost. In applications where high sensitivity (long burst length) is required, the
use of PPS capacitors is recommended.
For battery powered operation, a higher value sample capacitor is recommended (typical value 8.2 nF).
4.3 UDFN/USON Package Restrictions
The central pad on the underside of the UDFN/USON chip is connected to ground. Do not run any tracks
underneath the body of the chip, only ground.
4.4 Power Supply and PCB Layout
See Section 5.2 for the power supply range. At 3V, current drain averages less than 500 μA in Fast mode.
If the power supply is shared with another electronic system, care should be taken to ensure that the
supply is free of digital spikes, sags, and surges which can adversely affect the QT1010. The QT1010 will
track slow changes in Vdd, but it can be badly affected by rapid voltage fluctuations. It is highly
recommended that a separate voltage regulator be used just for the QT1010 to isolate it from power
supply shifts caused by other components.
If desired, the supply can be regulated using a Low Dropout (LDO) regulator, although such regulators
often have poor transient line and load stability. See Application Note QTAN0002, "Secrets of a
Successful QTouch
®
Design" for further information.
Parts placement: The chip should be placed to minimize the SNSK trace length to reduce low frequency
pickup, and to reduce stray Cx, which degrades gain. The Cs and Rs resistors (see Figure 1-1) should be
placed as close to the body of the chip as possible so that the trace between Rs and the SNSK pin is very
short, thereby reducing the antenna-like ability of this trace to pick up high frequency signals and feed
them directly into the chip. A ground plane can be used under the chip and the associated discrete
components, but the trace from the Rs resistor and the electrode should not run near ground to reduce
loading.
For best EMC performance, the circuit should be made entirely with SMT components.
AT42QT1010
© 2017 Microchip Technology Inc.
Datasheet
DS40001946A-page 15

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