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Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-1301EN - July 11, 2008
LMV932 (National Semiconductor) was used in the control
circuit that produced the results shown in Figure 15;
however, any low noise, low o set voltage op amp should
produce similar results. LMV932’s low supply voltage of
1.8 volts, limits the possibility of exceeding the 1.5 volt
absolute maximum of the AMMC-6650 V1 and V2 control
line inputs.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance.
A single bond wire is normally su cient for signal con-
nections, however double bonding with 0.7mil gold wire
will reduce series inductance. Gold thermo-sonic wedge
bonding is the preferred method for wire attachment to
the bond pads. The recommended wire bond stage tem-
perature is 150°C +/- 2°C. Caution should be taken to not
exceed the Absolute Maximum Rating for assembly tem-
perature and time.
The chip is 100um thick and should be handled with care.
The MMIC has air bridges on the top surface and should be
carefully handled by the edges or with a custom collet, (do
not pick up the die with a vacuum on die center). Bonding
pads and chip backside metallization are gold.
This MMIC is also static sensitive and ESD precautions
should be taken.
Notes:
1. Ablebond 84-1 LMI silver epoxy is recommended
2. Eutectic attach is not recommended and may jeopardize reliability of
the device.
Bond Pad Dimensions and Locations
Part Number Ordering Information
Part Number
Devices Per
Container Container
AMMC-6650-W10 10 Gelpak
AMMC-6650-W50 50 Gelpak
Figure 15. Attenuation vs. Control Voltage, Frequency = 15 GHz
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
0.01 0.1 1 10
Control Voltage (Vin)
Attenuation (dB)
Vref=0.2V
Vref=0.1V
Assembly Techniques
The backside of the MMIC chip is RF ground. The chip
should be attached directly to the ground plane (e.g.
circuit carrier or heatsink) using electrically conductive
epoxy
[1,2]
.
For best performance, the topside of the MMIC should be
brought up to the same height as the circuits surrounding
it. This can be accomplished by mounting a gold plated
metal shim (same length as the MMIC) under the chip. The
amount of epoxy used for the chip or shim attachment
should be just enough to provide a thin llet around the
bottom perimeter of the chip. The ground plane should
be free of any residue that may jeopardize electrical or
mechanical contact with the chip.
