ICS874003BG-05 REVISION B MARCH 21, 2014 13 ©2014 Integrated Device Technology, Inc.
ICS874003-05 Data Sheet PCI EXPRESS™ JITTER ATTENUATOR
PCI Express Application Note
PCI Express jitter analysis methodology models the system
response to reference clock jitter. The block diagram below shows the
most frequently used Common Clock Architecture in which a copy of
the reference clock is provided to both ends of the PCI Express Link.
In the jitter analysis, the transmit (Tx) and receive (Rx) serdes PLLs
are modeled as well as the phase interpolator in the receiver. These
transfer functions are called H1, H2, and H3 respectively. The overall
system transfer function at the receiver is:
The jitter spectrum seen by the receiver is the result of applying this
system transfer function to the clock spectrum X(s) and is:
In order to generate time domain jitter numbers, an inverse Fourier
Transform is performed on X(s)*H3(s) * [H1(s) - H2(s)].
PCI Express Common Clock Architecture
For PCI Express Gen 1, one transfer function is defined and the
evaluation is performed over the entire spectrum: DC to Nyquist (e.g
for a 100MHz reference clock: 0Hz – 50MHz) and the jitter result is
reported in peak-peak.
PCIe Gen 1 Magnitude of Transfer Function
For PCI Express Gen 2, two transfer functions are defined with 2
evaluation ranges and the final jitter number is reported in rms. The
two evaluation ranges for PCI Express Gen 2 are 10kHz – 1.5MHz
(Low Band) and 1.5MHz – Nyquist (High Band). The plots show the
individual transfer functions as well as the overall transfer function Ht.
PCIe Gen 2A Magnitude of Transfer Function
PCIe Gen 2B Magnitude of Transfer Function
For PCI Express Gen 3, one transfer function is defined and the
evaluation is performed over the entire spectrum. The transfer
function parameters are different from Gen 1 and the jitter result is
reported in RMS.
PCIe Gen 3 Magnitude of Transfer Function
For a more thorough overview of PCI Express jitter analysis
methodology, please refer to IDT Application Note PCI Express
Reference Clock Requirements.
Ht s H3 s H1 s H2 s=
Ys Xs H3 s H1 s H2 s=
ICS874003BG-05 REVISION B MARCH 21, 2014 14 ©2014 Integrated Device Technology, Inc.
ICS874003-05 Data Sheet PCI EXPRESS™ JITTER ATTENUATOR
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS874003-05.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS74003-05 is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)
MAX
= V
DD_MAX
* (I
DD_MAX
+ I
DDA_MAX
) = 3.465V * (75mA + 16mA) = 315.315mW
Power (outputs)
MAX
= V
DDO_MAX
* I
DDO_MAX
= 3.465V * 75mA = 259.875mW
Total Power_
MAX
= 315.3mW + 259.9mW = 575.2mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The
maximum recommended junction temperature for devices is 125°C.
The equation for Tj is as follows: Tj =
JA
* Pd_total + T
A
Tj = Junction Temperature
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
JA
must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 86.7°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.575W * 86.7°C/W = 119.9°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board.
Table 6. Thermal Resistance
JA
for 20-Lead TSSOP, Forced Convection
JA
by Velocity
Meters per Second 012.5
Multi-Layer PCB, JEDEC Standard Test Boards 86.7°C/W 82.4°C/W 80.2°C/W
ICS874003BG-05 REVISION B MARCH 21, 2014 15 ©2014 Integrated Device Technology, Inc.
ICS874003-05 Data Sheet PCI EXPRESS™ JITTER ATTENUATOR
Reliability Information
Table 7.
JA
vs. Air Flow Table for a 20-Lead TSSOP
Transistor Count
The transistor count for ICS874003-05 is: 1418
Package Outline and Package Dimensions
Package Outline - G Suffix for 20-Lead TSSOP Table 8. Package Dimensions
Reference Document: JEDEC Publication 95, MO-153
JA
by Velocity
Meters per Second 012.5
Multi-Layer PCB, JEDEC Standard Test Boards 86.7°C/W 82.4°C/W 80.2°C/W
All Dimensions in Millimeters
Symbol Minimum Maximum
N 20
A 1.20
A1 0.05 0.15
A2 0.80 1.05
b 0.19 0.30
c 0.09 0.20
D 6.40 6.60
E 6.40 Basic
E1 4.30 4.50
e 0.65 Basic
L 0.45 0.75
aaa 0.10

874003BG-05LF

Mfr. #:
Manufacturer:
IDT
Description:
Clock Synthesizer / Jitter Cleaner PCI EXPRESS JITTER ATTENUATOR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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