FM28V100
Document Number: 001-86202 Rev. *E Page 7 of 18
AC Test Conditions
Input pulse levels ...................................................0 V to 3 V
Input rise and fall times (10%–90%) ........................... <
3 ns
Input and output timing reference levels ....................... 1.5 V
Output load capacitance............................................... 30 pF
Data Retention and Endurance
Parameter Description Test condition Min Max Unit
T
DR
Data retention At +85 C 10 Years
At +75
C38
At +65
C151
NV
C
Endurance Over operating temperature 10
14
Cycles
Capacitance
Parameter
Description Test Conditions Max Unit
C
I/O
Input/Output capacitance (DQ) T
A
= 25 C, f = 1 MHz, V
DD
= V
DD
(Typ) 8 pF
C
IN
Input capacitance 6pF
Thermal Resistance
Parameter
Description Test Conditions 32-pin TSOP I Unit
JA
Thermal resistance
(junction to ambient)
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
80
C/W
JC
Thermal resistance
(junction to case)
21 C/W
FM28V100
Document Number: 001-86202 Rev. *E Page 8 of 18
AC Switching Characteristics
Over the Operating Range
Parameters
[4]
Description
V
DD
=
2.0 V to 2.7 V V
DD
=
2.7 V to 3.6 V
Unit
Cypress
Parameter
Alt Parameter Min Max Min Max
SRAM Read Cycle
t
CE
t
ACE
Chip enable access time 70 60 ns
t
RC
Read cycle time 105 90 ns
t
AA
Address access time 105 90 ns
t
OH
t
OHA
Output hold time 20 20 ns
t
AAP
Page mode address access time 40 30 ns
t
OHP
Page mode output hold time 3–3–ns
t
CA
Chip enable active time 70 60 ns
t
PC
Pre-charge time 35 30 ns
t
AS
t
SA
Address setup time (to CE
1
, CE
2
active) 0–0–ns
t
AH
t
HA
Address hold time (Chip Enable Controlled) 70 60 ns
t
OE
t
DOE
Output enable access time 25 15 ns
t
HZ
[5, 6]
t
HZCE
Chip Enable to output HI-Z 10 10 ns
t
OHZ
[5, 6]
t
HZOE
Output enable HIGH to output HI-Z 10 10 ns
Notes
4. Test conditions assume a signal transition time of 3 ns or less, timing reference levels of 0.5 × V
DD
, input pulse levels of 0 to 3 V, output loading of the specified
I
OL
/I
OH
and load capacitance shown in AC Test Conditions on page 7.
5. t
HZ
and t
OHZ
are specified with a load capacitance of 5 pF. Transition is measured when the outputs enter a high impedance state.
6. This parameter is characterized but not 100% tested.
FM28V100
Document Number: 001-86202 Rev. *E Page 9 of 18
SRAM Write Cycle
t
WC
t
WC
Write cycle time 105 90 ns
t
CA
Chip enable active time 70 60 ns
t
CW
t
SCE
Chip enable to write enable HIGH 70 60 ns
t
PC
Pre-charge time 35 30 ns
t
PWC
Page mode write enable cycle time 40 30 ns
t
WP
t
PWE
Write enable pulse width 22 18 ns
t
AS
t
SA
Address setup time (to CE
1
, CE
2
active)0–0–ns
t
AH
t
HA
Address hold time (Chip Enable Controlled) 70 60 ns
t
ASP
Page mode address setup time (to WE LOW)8–5–ns
t
AHP
Page mode address hold time (to WE LOW) 20 15 ns
t
WLC
t
PWE
Write enable LOW to chip disabled 30 25 ns
t
WLA
Write enable LOW to A
16-3
change 30 25 ns
t
AWH
A
16-3
change to write enable HIGH 105 90 ns
t
DS
t
SD
Data input setup time 20 15 ns
t
DH
t
HD
Data input hold time 0–0–ns
t
WZ
[7, 8]
t
HZWE
Write enable LOW to output HI-Z 10 10 ns
t
WX
[8]
Write enable HIGH to output driven 5 5 ns
t
WS
[8, 9]
Write enable to CE LOW setup time 0 0 ns
t
WH
[8, 9]
Write enable to CE HIGH hold time 0 0 ns
AC Switching Characteristics (continued)
Over the Operating Range
Parameters
[4]
Description
V
DD
=
2.0 V to 2.7 V V
DD
=
2.7 V to 3.6 V
Unit
Cypress
Parameter
Alt Parameter Min Max Min Max
Notes
7. t
WZ
is specified with a load capacitance of 5 pF. Transition is measured when the outputs enter a high impedance state.
8. This parameter is characterized but not 100% tested.
9. The relationship between CE
(falling edge of CE
1
(while CE
2
is HIGH), or the rising edge of CE
2
(while CE
1
is LOW) and WE determines if a chip enable or WE
controlled write occurs.

FM28V100-TG

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
F-RAM 1M (128Kx8) 2.2-3.6V F-RAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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